公开(公告)号：US20230112086A1

公开(公告)日：2023-04-13

申请号：US17865683

申请日：2022-07-15

Applicant: Envista

Inventor： Byung Jun Ahn ,  Bruce H. Lipshutz ,  Sam L. Nguyen ,  Roscoe Linstadt

IPC: C09D7/63 ,  C09D5/00 ,  C07C205/43 ,  A61K6/20 ,  A61K6/62 ,  A61K6/65 ,  A61K6/78 ,  B05D3/10 ,  C07C69/01 ,  C07C205/42 ,  C07C235/06 ,  C07C271/16 ,  C07F7/08 ,  C07F9/12 ,  B05D3/00 ,  C07C235/20 ,  C07D217/16 ,  C07F9/62

Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.

公开(公告)号：US11739223B2

公开(公告)日：2023-08-29

申请号：US17740350

申请日：2022-05-10

Applicant: Envista

Inventor： Byung Jun Ahn ,  Bruce H. Lipshutz ,  Sam L. Nguyen

IPC: C09D7/63 ,  C09D5/00 ,  A61K6/65 ,  A61K6/20 ,  A61K6/62 ,  A61K6/78 ,  B05D3/00 ,  B05D3/10 ,  C07C69/01 ,  C07C205/42 ,  C07C205/43 ,  C07C235/06 ,  C07C235/20 ,  C07C271/16 ,  C07D217/16 ,  C07F7/08 ,  C07F9/12 ,  C07F9/62 ,  C08K5/107 ,  C08K5/13

CPC classification number: C09D5/002 ,  A61K6/20 ,  A61K6/62 ,  A61K6/65 ,  A61K6/78 ,  B05D3/002 ,  B05D3/10 ,  B05D3/107 ,  C07C69/01 ,  C07C205/42 ,  C07C205/43 ,  C07C235/06 ,  C07C235/20 ,  C07C271/16 ,  C07D217/16 ,  C07F7/0896 ,  C07F9/12 ,  C07F9/62 ,  C09D7/63 ,  C08K5/107 ,  C08K5/13

Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II:




wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.

公开(公告)号：US11453790B2

公开(公告)日：2022-09-27

申请号：US16877097

申请日：2020-05-18

Applicant: Envista

Inventor： Byung Jun Ahn ,  Bruce H. Lipshutz ,  Sam L. Nguyen ,  Roscoe Linstadt

IPC: C09D7/63 ,  C09D5/00 ,  C07C205/43 ,  A61K6/20 ,  A61K6/62 ,  A61K6/65 ,  A61K6/78 ,  B05D3/10 ,  C07C69/01 ,  C07C205/42 ,  C07C235/06 ,  C07C271/16 ,  C07F7/08 ,  C07F9/12 ,  B05D3/00 ,  C07C235/20 ,  C07D217/16 ,  C07F9/62 ,  C08K5/13 ,  C08K5/107

Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.

公开(公告)号：US20230103027A1

公开(公告)日：2023-03-30

申请号：US17740350

申请日：2022-05-10

Applicant: Envista

Inventor： Byung Jun Ahn ,  Bruce H. Lipshutz ,  Sam L. Nguyen

IPC: C09D7/63 ,  C09D5/00 ,  C07C205/43 ,  A61K6/20 ,  A61K6/62 ,  A61K6/65 ,  A61K6/78 ,  B05D3/10 ,  C07C69/01 ,  C07C205/42 ,  C07C235/06 ,  C07C271/16 ,  C07F7/08 ,  C07F9/12 ,  B05D3/00 ,  C07C235/20 ,  C07D217/16 ,  C07F9/62

Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.

公开(公告)号：US11352512B2

公开(公告)日：2022-06-07

申请号：US16877058

申请日：2020-05-18

Applicant: Envista

Inventor： Byung Jun Ahn ,  Bruce H. Lipshutz ,  Sam L. Nguyen

IPC: C09D7/63 ,  C09D5/00 ,  C07C205/43 ,  A61K6/20 ,  A61K6/62 ,  A61K6/65 ,  A61K6/78 ,  B05D3/10 ,  C07C69/01 ,  C07C205/42 ,  C07C235/06 ,  C07C271/16 ,  C07F7/08 ,  C07F9/12 ,  B05D3/00 ,  C07C235/20 ,  C07D217/16 ,  C07F9/62 ,  C08K5/13 ,  C08K5/107

Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.

公开(公告)号：US20200347248A1

公开(公告)日：2020-11-05

申请号：US16877097

申请日：2020-05-18

Applicant: Envista

Inventor： Byung Jun Ahn ,  Bruce H. Lipshutz ,  Sam L. Nguyen ,  Roscoe Linstadt

IPC: C09D7/63 ,  C09D5/00 ,  C07C205/43 ,  A61K6/20 ,  A61K6/62 ,  A61K6/65 ,  A61K6/78 ,  B05D3/10 ,  C07C69/01 ,  C07C205/42 ,  C07C235/06 ,  C07C271/16 ,  C07F7/08 ,  C07F9/12 ,  B05D3/00 ,  C07C235/20 ,  C07D217/16 ,  C07F9/62

Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.

公开(公告)号：US20200347247A1

公开(公告)日：2020-11-05

申请号：US16877058

申请日：2020-05-18

Applicant: Envista

Inventor： Byung Jun Ahn ,  Bruce H. Lipshutz ,  Sam L. Nguyen

IPC: C09D7/63 ,  C09D5/00 ,  C07C205/43 ,  A61K6/20 ,  A61K6/62 ,  A61K6/65 ,  A61K6/78 ,  B05D3/10 ,  C07C69/01 ,  C07C205/42 ,  C07C235/06 ,  C07C271/16 ,  C07F7/08 ,  C07F9/12 ,  B05D3/00 ,  C07C235/20 ,  C07D217/16 ,  C07F9/62

Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.