摘要:
The optimization of two technologies (CMOS and CCD) wherein a pinned photodiode is integrated into the image sensing element of an active pixel sensor. Pinned photodiodes are fabricated with CCD process steps into the active pixel architecture. Charge integrated within the active pixel pinned photodiode is transferred into the charge sensing node by a transfer gate. The floating diffusion is coupled CMOS circuitry that can provide the addressing capabilities of individual pixels. Alternatively, a buried channel photocapacitor can be used in place of the pinned photodiode.
摘要:
The present invention teaches how to maintain temporally the increased collection region (depletion depth) of detectors within a solid-state image sensor. A novel clocking method is used to control charge transfer within charge coupled devices to reduce cross talk with a resulting improvement in the MTF and quantum efficiency. Specifically, the present invention employs a pulsing type of clocking technique wherein the duty cycle is adjusted to maximize the depletion region. These pulses are spaced equally from phase to phase within the multiphase clocking scheme. The present invention is specifically designed for high speed CCD devices in which improvements in the MTF and QE are desired. Time Delay Integration (TDI) image sensors are such devices that have high speed characteristics as a common requirement and the application of the present invention to these devices is discussed. Additionally, the application of the present invention to certain full frame and frame transfer devices having requirements for high speed characteristics will benefit from the teachings of the present invention.
摘要:
The optimization of two technologies (CMOS and CCD) wherein a pinned photodiode is integrated into the image sensing element of an active pixel sensor. Pinned photodiodes are fabricated with CCD process steps into the active pixel architecture. Charge integrated within the active pixel pinned photodiode is transferred into the charge sensing node by a transfer gate. The floating diffusion is coupled CMOS circuitry that can provide the addressing capabilities of individual pixels. Alternatively, a buried channel photocapacitor can be used in place of the pinned photodiode.
摘要:
The optimization of two technologies (CMOS and CCD) wherein a pinned photodiode is integrated into the image sensing element of an active pixel sensor. Pinned photodiodes are fabricated with CCD process steps into the active pixel architecture. Charge integrated within the active pixel pinned photodiode is transferred into the charge sensing node by a transfer gate. The floating diffusion is coupled CMOS circuitry that can provide the addressing capabilities of individual pixels. Alternatively, a buried channel photocapacitor can be used in place of the pinned photodiode.