摘要:
Systems and methods for generating low or ultra-low concentrations of oil-based challenging compounds for filtration media are provided. Embodiments of the generators utilize bypass air in addition to the source of challenge. A HEPA filter which utilizes spunbond scrim material and ePTFE membrane for use in an aseptic pharmaceutical filtration air handling system for installation and testing is provided. The installation and testing configuration includes the ePTFE filter with a low or ultra-low concentration of challenging aerosol in the upstream side of the filter along with a scanning device for determining the upstream concentration, all completed in situ within a pharmaceutical air handling system. At the downstream side of the ePTFE filter is positioned another scanner which may be a discrete particle counter. The system and configuration allows for exposure to ePTFE filtration media for certification by low or ultra-low concentrations of oil based challenging compounds.
摘要:
Systems and methods for generating low or ultra-low concentrations of oil-based challenging compounds for filtration media are provided. Embodiments of the generators utilize bypass air in addition to the source of challenge. A HEPA filter which utilizes spunbond scrim material and ePTFE membrane for use in an aseptic pharmaceutical filtration air handling system for installation and testing is provided. The installation and testing configuration includes the ePTFE filter with a low or ultra-low concentration of challenging aerosol in the upstream side of the filter along with a scanning device for determining the upstream concentration, all completed in situ within a pharmaceutical air handling system. At the downstream side of the ePTFE filter is positioned another scanner which may be a discrete particle counter. The system and configuration allows for exposure to ePTFE filtration media for certification by low or ultra-low concentrations of oil based challenging compounds.
摘要:
Fabrication processes for manufacturing and connecting a semiconductor switching device are disclosed, including an embodiment for dicing a wafer into individual circuit die by sawing the interface between adjacent die with a saw blade that has an angled configuration across its width, preferably in a generally V-shape so that the adjacent die are severed from one another while simultaneously providing a beveled surface on the sides of each separated die. Another embodiment relates to the manner in which damage to a beveled side surface of the individual die can be smoothed by a chemical etching process. Another embodiment relates to the manner in which the device can be easily mounted on a printed circuit board by providing conductive lands on the printed circuit board that are coextensive with metallized electrodes on the device and which can be placed on the printed circuit board and soldered in place and a unique lead frame which can be soldered to another electrode metallization on the opposite side of the chip and the printed circuit board in a manner which substantially reduces if not eliminates harmful thermal stress and which assures secure bonding notwithstanding elevation differences between the electrode metallization and the printed circuit board the lead frame is attached to. Another embodiment relates to an output connector for interconnecting an exciter circuit product with a spark producing device wherein the output connector utilizes a configuration that includes a sealing structure that is reliable and easily installed.
摘要:
A system, method, and computer program product are provided for initiating an application in communication with a database management system via a bridge. Application memory is allocated to the application from a shared memory space within the database management system.
摘要:
A system, method, and computer program product are provided for initiating an application in communication with a database management system via a bridge. Application memory is allocated to the application from a shared memory space within the database management system.
摘要:
Fabrication processes for manufacturing and connecting a semiconductor switching device are disclosed, including an embodiment for dicing a wafer into individual circuit die by sawing the interface between adjacent die with a saw blade that has an angled configuration across its width, preferably in a generally V-shape so that the adjacent die are severed from one another while simultaneously providing a beveled surface on the sides of each separated die. Another embodiment relates to the manner in which damage to a beveled side surface of the individual die can be smoothed by a chemical etching process. Another embodiment relates to the manner in which the device can be easily mounted on a printed circuit board by providing conductive lands on the printed circuit board that are coextensive with metallized electrodes on the device and which can be placed on the printed circuit board and soldered in place and a unique lead frame which can be soldered to another electrode metallization on the opposite side of the chip and the printed circuit board in a manner which substantially reduces if not eliminates harmful thermal stress and which assures secure bonding notwithstanding elevation differences between the electrode metallization and the printed circuit board the lead frame is attached to. Another embodiment relates to an output connector for interconnecting an exciter circuit product with a spark producing device wherein the output connector utilizes a configuration that includes a sealing structure that is reliable and easily installed.
摘要:
A software-controlled latched voltage regulator includes three bipolar transistors responsive to a wiper switch multiplexed signal to place a latch formed by the transistors in an energized state, thereby supplying power to a microcontroller. One of the bipolar transistors is responsive to a deenergization signal supplied by the microcontroller, under software control, to place the latch in a deenergized state wherein regulated power is no longer supplied to the microcontroller. The voltage regulator further includes a zener diode that provides a reference voltage for use in connection with one of the transistors to implement a decoding function that is applied to the switch multiplexed signal to provide a pair of wiper switch position signals for use by the microcontroller during operation. While the latch remains in an energized state, the supplied regulated voltage enables the microcontroller to park a wiper arm of a wiper system, even though an ignition switch is an off position. Once the wiper arm is parked, as sensed by cam switches, the microcontroller deactivates the latch by generating the deenergization signal to power down the system in order to reduce current draw.