公开(公告)号：US20110028603A1

公开(公告)日：2011-02-03

申请号：US12936482

申请日：2009-04-09

申请人： Maxim Peretolchin ,  Eva Rueba ,  Daniel Schoenfelder

发明人： Maxim Peretolchin ,  Eva Rueba ,  Daniel Schoenfelder

IPC分类号： C08L63/00 ,  C08G18/10 ,  C08G18/32 ,  C08G69/08 ,  C08G69/26

CPC分类号： C08G59/4021 ,  C08G59/18 ,  C08G59/50 ,  C08G83/005 ,  C08L63/00 ,  C08L79/02 ,  C08L2666/20

摘要： The invention relates to the use of hyperbranched polymers or oligomers comprising terminal primary and/or secondary amino groups as curing agents for epoxy resins. The invention further relates to a composition containing such polymers or oligomers, an uncured or only partially cured epoxy resin, and at least one optional curing agent for epoxy resins, as well as a cured epoxy resin that can be obtained by curing said components. The invention finally relates to a method for curing epoxy resins. In said method, an uncured or only partially cured epoxy resin is brought to a temperature of 5 to 150° C. or is exposed to microwave radiation along with at least one polymer or oligomer according to the definition above and at least one optional conventional curing agent for epoxy resins.

摘要翻译： 本发明涉及使用包含末端伯和/或仲氨基的超支化聚合物或低聚物作为环氧树脂的固化剂。 本发明还涉及包含这种聚合物或低聚物，未固化或仅部分固化的环氧树脂和至少一种用于环氧树脂的任选固化剂的组合物，以及可通过固化所述组分获得的固化环氧树脂。 本发明最终涉及一种固化环氧树脂的方法。 在所述方法中，未固化或仅部分固化的环氧树脂达到5至150℃的温度，或者根据上述定义暴露于微波辐射以及至少一种聚合物或低聚物，并且至少一种任选的常规固化 环氧树脂剂。