公开(公告)号：US20050118527A1

公开(公告)日：2005-06-02

申请号：US10481192

申请日：2002-02-18

申请人： Ze'ev Harel ,  Michael Schieber ,  Yehezkei Saado ,  Evgeny Meerson ,  Haim Hermon ,  Benjamin Reisman

发明人： Ze'ev Harel ,  Michael Schieber ,  Yehezkei Saado ,  Evgeny Meerson ,  Haim Hermon ,  Benjamin Reisman

IPC分类号： G01T1/24 ,  H01L27/146 ,  H01L31/0296 ,  G03C1/76

CPC分类号： G01T1/24 ,  H01L27/14658 ,  H01L31/0296

摘要： An imaging composition for radiation detection systems which includes an admixture of at least one non-heat treated, non-ground particulate semiconductor with a polymeric binder. The non-heat treated, non-ground particulate semiconductor is selected from mercuric iodide, lead iodide, bismuth iodide, thallium bromide and cadmium-zinc-telluride (CZT), and at least 90% of the semiconductor particulates have a grain size of less than 100 microns in their largest dimension. A radiation detector plate (10) for an imaging system includes a substrate (12) which serves as an electrode, at least one imaging composition layer (16) applied onto the substrate (12), and a second electrode (18) which is in electrical connection with the imaging composition (16) and connected (20, 22) to a high voltage bias.

摘要翻译： 一种用于放射线检测系统的成像组合物，其包括至少一种非热处理的非研磨颗粒半导体与聚合物粘合剂的混合物。 非热处理的未研磨颗粒半导体选自碘化汞，碘化铅，碘化铋，溴化铊和碲化镉碲化物（CZT），并且至少90％的半导体颗粒具有较小的晶粒尺寸 其尺寸超过100微米。 用于成像系统的辐射检测器板（10）包括用作电极的基底（12），施加到基底（12）上的至少一个成像组合物层（16）和位于基底 与成像组合物（16）电连接并连接（20,22）至高电压偏压。