公开(公告)号：US20110156061A1

公开(公告)日：2011-06-30

申请号：US12845722

申请日：2010-07-28

Applicant: Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

IPC: H01L33/48

CPC classification number: H01L25/0753 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

Abstract translation: 提供发光模块。 发光模块包括基板，设置在基板上的多个LED芯片，荧光胶体和围绕多个LED芯片的封装胶体。 基板包括基板主体和设置在其上的用于承载LED芯片的多个芯片焊盘。 通过芯片焊盘和衬底主体形成多个通孔，以增强LED芯片的散热。 荧光胶体和封装胶体都具有导光结构，以改善颜色稳定性和处理发光模块的光形状的能力。

公开(公告)号：US20110157868A1

公开(公告)日：2011-06-30

申请号：US12845709

申请日：2010-07-28

Applicant: Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

IPC: G02F1/13357 ,  F21S4/00 ,  F21V11/00

CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L2224/48091 ,  H05K1/0206 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

公开(公告)号：US20110156060A1

公开(公告)日：2011-06-30

申请号：US12845719

申请日：2010-07-28

Applicant: Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

IPC: H01L33/48

CPC classification number: H01L25/0753 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

公开(公告)号：US20110156083A1

公开(公告)日：2011-06-30

申请号：US12845612

申请日：2010-07-28

Applicant: Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

IPC: H01L33/62 ,  H05K1/11

CPC classification number: H05K1/0206 ,  F21K9/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/64 ,  H01L2224/48091 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.