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公开(公告)号:US5928567A
公开(公告)日:1999-07-27
申请号:US816015
申请日:1997-03-11
IPC分类号: C08K3/00 , C08K3/08 , H01C7/02 , H01T4/08 , H05K1/02 , H05K1/16 , H05K1/18 , H05K3/28 , H01B1/02 , H01B1/22
CPC分类号: H05K3/285 , C08K3/0008 , C08K3/08 , H01C7/021 , H01T4/08 , H05K1/0257 , H05K1/0254 , H05K1/0259 , H05K1/167 , H05K1/18 , H05K3/28 , Y10T428/257 , Y10T428/2993
摘要: A solvent-free liquid conductive material designed to protect electrical components, such as printed circuit boards from high pulse static electricity. The solvent-free liquid conductive material comprises a liquid silicone polymer, powdered metallic compound, non-conductive inorganic powder and a curing agent. The conductive material is applicable to both additively and subtractively processed printed circuit boards.
摘要翻译: 无溶剂的液体导电材料设计用于保护诸如印刷电路板的电气部件免受高脉冲静电。 无溶剂的液体导电材料包括液体硅氧烷聚合物,粉末金属化合物,非导电无机粉末和固化剂。 导电材料适用于加和差处理的印刷电路板。