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    Electrically conductive copper layers and process for preparing same
    5.
    发明授权
    Electrically conductive copper layers and process for preparing same 失效
    导电铜层及其制备方法

    公开(公告)号：US4750976A

    公开(公告)日：1988-06-14

    申请号：US806679

    申请日：1985-12-09

    申请人： Jurgen Hupe ,  Frank Sonnenschein ,  Herbert Breidenbach

    发明人： Jurgen Hupe ,  Frank Sonnenschein ,  Herbert Breidenbach

    IPC分类号： C23F1/02 ,  H05K3/06 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/38 ,  C25D5/02

    CPC分类号： H05K3/244 ,  C23F1/02 ,  H05K3/062 ,  H05K3/384 ,  H05K2203/0361 ,  H05K3/243 ,  H05K3/28 ,  Y10T428/24975 ,  Y10T428/265

    摘要： Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areas(a) are galvanically coated with a coating of a black metal in an acidic medium;(b) the resist is removed and then the copper areas having been exposed thereby are removed by etching;(c) the conductor plates are provided with an adhering solder mask;(d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.

    摘要翻译： 导电板中的导电铜层和具有酸溶性且能够在酸性介质中施加的黑色金属涂层的电子部件更容易制备并且具有优异的性能。 在制备过程中，具有抗蚀剂和任选地具有通孔的导体板和具有自由铜区域（a）的导体板在酸性介质中用黑色金属涂层电镀涂覆; （b）去除抗蚀剂，然后通过蚀刻去除已曝露的铜区域; （c）导体板设置有粘附的焊接掩模; （d）在未被焊接掩模覆盖的那些部分，除去黑色金属涂层，如果需要，由此暴露的铜区域设置有可焊接的金属层。