-
1.
公开(公告)号:US6060215A
公开(公告)日:2000-05-09
申请号:US49056
申请日:1998-03-27
申请人: Jin Amanokura , Fumihiko Ota , Ritsuko Obata , Toshihiko Akahori , Kenji Suzuki , Hiroshi Nishizawa , Katsunori Tsuchiya , Takao Hirayama , Hiroaki Hirakura
发明人: Jin Amanokura , Fumihiko Ota , Ritsuko Obata , Toshihiko Akahori , Kenji Suzuki , Hiroshi Nishizawa , Katsunori Tsuchiya , Takao Hirayama , Hiroaki Hirakura
摘要: A photosensitive resin composition comprising (A) a resin having an amide bond, an oxyalkylene group and a carboxyl group, (B) a photopolymerizable compound having an ethylenically unsaturated group and (C) a photopolymerization initiator has an alkali developability, good sensitivity and photocurability, an efficient pattern formability by photolithography, a good application workability to a film and is capable of producing cured products having good folding endurance, solder reflow heat resistance, solvent resistance, bondability and nonflammability and suitable for producing a photosensitive element, a photosensitive laminate and a flexible printed circuit board.
摘要翻译: 包含(A)具有酰胺键,氧化烯基和羧基的树脂的感光树脂组合物,(B)具有烯属不饱和基团的光聚合性化合物和(C)光聚合引发剂具有碱显影性,良好的灵敏度和光固化性 通过光刻法有效的图案成形性,对膜的良好的应用可加工性,并且能够生产具有良好的耐折性,耐回焊耐热性,耐溶剂性,粘合性和不燃性的固化产物,并且适用于制备感光元件,感光层压板和 柔性印刷电路板。