公开(公告)号：US20190023917A1

公开(公告)日：2019-01-24

申请号：US16061205

申请日：2016-12-21

申请人： Carbon, Inc.

发明人： Jessica D. Drazba ,  Kai Chen ,  Jason P. Rolland

IPC分类号： C09D11/101 ,  C09D11/102 ,  C09D11/037 ,  C08G18/10 ,  C08G18/63 ,  C08G18/77 ,  B33Y70/00

CPC分类号： C09D11/101 ,  B29C64/124 ,  B29C64/135 ,  B29K2075/00 ,  B29K2083/00 ,  B29K2096/04 ,  B29K2105/0002 ,  B29K2105/0085 ,  B33Y10/00 ,  B33Y70/00 ,  C08G18/10 ,  C08G18/638 ,  C08G18/778 ,  C09D11/037 ,  C09D11/102 ,  G03F7/027 ,  G03F7/037 ,  G03F7/0755 ,  G03F7/0757

摘要： A polymerizable liquid useful for the production of a three-dimensional object comprised of silicone, or a copolymer thereof, which includes at least one constituent selected from the group consisting of (i) a blocked or reactive blocked siloxane-containing prepolymer, (ii) a blocked or reactive blocked siloxane-containing polyisocyanate, and (iii) a blocked or reactive blocked siloxane-containing polyisocyanate chain extender. Methods of using the same in additive manufacturing processes such as continuous liquid interface production are also described.

公开(公告)号：US20180024434A1

公开(公告)日：2018-01-25

申请号：US15616237

申请日：2017-06-07

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Katsuya TAKEMURA ,  Hiroyuki URANO ,  Masashi IIO ,  Masayoshi SAGEHASHI ,  Koji HASEGAWA

IPC分类号： G03F7/038 ,  C08G73/12 ,  C08G73/10 ,  G03F7/004 ,  G03F7/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  C07C69/80 ,  G03F7/031

CPC分类号： G03F7/0387 ,  C07C69/76 ,  C07C69/80 ,  C08G73/1007 ,  C08G73/1042 ,  C08G73/121 ,  C08G73/123 ,  C08G73/127 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/031 ,  G03F7/037 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/325 ,  G03F7/38 ,  G03F7/40

摘要： The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein X1 represents a tetravalent organic group; and R1 represents a group shown by the following general formula (2), Y1nRf)k   (2) wherein the dotted line represents a bond; Y1 represents an organic group with a valency of k+1; Rf represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms or an aromatic group in which a part or all of hydrogen atoms is/are substituted with a fluorine atom(s); “k” represents 1, 2, or 3; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition, and usable as a base resin of a negative photosensitive resin composition.

公开(公告)号：US20170299965A1

公开(公告)日：2017-10-19

申请号：US15517093

申请日：2015-10-01

申请人： TORAY INDUSTRIES, INC.

发明人： Keika HASHIMOTO ,  Kazuto MIYOSHI ,  Masao TOMIKAWA

IPC分类号： G03F7/40 ,  H01L27/32 ,  G03F7/037 ,  C09D179/08 ,  G03F7/023 ,  G03F7/004 ,  H01L51/52 ,  G03F7/038

CPC分类号： G03F7/40 ,  C08L101/02 ,  C09D179/08 ,  G03F7/0046 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0236 ,  G03F7/037 ,  G03F7/0387 ,  H01L21/027 ,  H01L27/3246 ,  H01L27/3258 ,  H01L29/786 ,  H01L51/529

摘要： A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.

公开(公告)号：US20170298186A1

公开(公告)日：2017-10-19

申请号：US15457493

申请日：2017-03-13

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Katsuya TAKEMURA ,  Hiroyuki URANO ,  Masashi IIO ,  Masayoshi SAGEHASHI ,  Koji HASEGAWA

IPC分类号： C08G73/10 ,  G03F7/38 ,  G03F7/32 ,  G03F7/20 ,  G03F7/16 ,  G03F7/039 ,  C07C69/92 ,  G03F7/038 ,  G03F7/031 ,  G03F7/023 ,  G03F7/004 ,  G03F7/40

CPC分类号： C08G73/1039 ,  C07C69/76 ,  C07C69/92 ,  C08G73/1007 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/106 ,  C08G73/1071 ,  C08G73/123 ,  C08G73/126 ,  C09D179/08 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/031 ,  G03F7/037 ,  G03F7/038 ,  G03F7/0387 ,  G03F7/0388 ,  G03F7/039 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2037 ,  G03F7/322 ,  G03F7/38 ,  G03F7/40

摘要： The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein X1 represents a tetravalent organic group; and R1 represents a group shown by the following general formula (2), wherein the dotted line represents a bond; Y1 represents an organic group with a valency of k+1; “k” represents 1 or 2; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition and usable as a base resin of a photosensitive resin composition.

公开(公告)号：US09753274B2

公开(公告)日：2017-09-05

申请号：US14892759

申请日：2015-01-08

申请人： JSR CORPORATION

发明人： Yoshinori Kinoshita ,  Toshiharu Araki ,  Kazunari Kudou

IPC分类号： G02B26/00 ,  G02F1/03 ,  G02F1/29 ,  G02F1/133 ,  G03F7/038 ,  G03F7/075 ,  G03F7/032 ,  G03F7/033 ,  G03F7/037

CPC分类号： G02B26/005 ,  G03F7/032 ,  G03F7/033 ,  G03F7/037 ,  G03F7/038 ,  G03F7/0387 ,  G03F7/0757

摘要： The present invention relates to a display element, a photosensitive composition and an electrowetting display. The display element includes: a first electrode layer stack; a second electrode layer stack; a housing space formed between the first and second electrode layer stacks; and a partition wall compartmentalizing the housing space, wherein the housing space contains at least a polar liquid and a non-polar liquid that are immiscible with each other, a surface layer in contact with the partition wall exists on the surface of at least one of the first and second electrode layer stacks that is in contact with the housing space, and an absolute value of the difference in linear expansion coefficient between the partition wall and the surface layer is 150 ppm/K or less.

公开(公告)号：US20170240705A1

公开(公告)日：2017-08-24

申请号：US15589114

申请日：2017-05-08

申请人： MITSUI CHEMICALS, INC.

发明人： Kenichi FUKUKAWA ,  Masaki OKAZAKI ,  Yoshihiro SAKATA ,  Tatsuhiro URAKAMI ,  Atsushi OKUBO

IPC分类号： C08G73/10 ,  C08J5/18 ,  H05K1/03 ,  H01B3/30 ,  H05K3/00 ,  G03F7/11 ,  G03F7/32

CPC分类号： C08G73/1042 ,  B32B15/08 ,  B32B15/088 ,  B32B27/281 ,  B32B2307/206 ,  B32B2307/412 ,  B32B2457/08 ,  B32B2457/20 ,  B32B2551/00 ,  C08G73/10 ,  C08G73/1082 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  C09D179/08 ,  G03F7/037 ,  G03F7/11 ,  G03F7/20 ,  G03F7/322 ,  H01B3/306 ,  H05K1/0296 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0393 ,  H05K3/0017 ,  H05K3/281 ,  H05K2201/0154

摘要： Provided are a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). The block polyimide comprises blocks configured from repeating structural units represented by defined formula (1A) and blocks configured from repeating structural units represented by defined formula (1B).

公开(公告)号：US09499002B2

公开(公告)日：2016-11-22

申请号：US14765270

申请日：2014-01-20

申请人： TORAY Industries, Inc.

发明人： Hiroyuki Kawahara ,  Tsutomu Abura

IPC分类号： B41C1/05 ,  B41N1/12 ,  G03F7/037 ,  B29B13/00 ,  B29C35/08 ,  B29K31/00 ,  B29L31/00

CPC分类号： B41N1/12 ,  B29B13/00 ,  B29C35/0805 ,  B29C2035/0838 ,  B29K2031/04 ,  B29L2031/767 ,  B41C1/05 ,  G03F7/037

摘要： It is an object of the present invention to provide a resin printing plate precursor for laser engraving that is able to form a relief by laser engraving, the relief having excellent image reproducibility, and moreover has toughness and improved printing durability. The present invention is a resin printing plate precursor for laser engraving comprising a substrate and a resin layer on the substrate, the resin layer containing: (A) a modified partially saponified polyvinyl acetate having reactive groups in its side chain; (B) a polyamide having basic nitrogen; (C) a compound having a 5- to 7-membered ring and a polymerizable ethylenic double bond; and (D) a photopolymerization initiator.

公开(公告)号：US09465151B2

公开(公告)日：2016-10-11

申请号：US14314733

申请日：2014-06-25

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.

发明人： Xiaona Liu ,  Yongzhi Song

IPC分类号： G02B5/23 ,  G02F1/1335 ,  G02B5/22 ,  G03F7/00 ,  C08J7/18

CPC分类号： G02B5/223 ,  G02F1/133514 ,  G02F2201/086 ,  G03F7/0007 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/033 ,  G03F7/035 ,  G03F7/037 ,  G03F7/038 ,  G03F7/06

摘要： The invention discloses a photosensitive resin composition and a color filter. The photosensitive resin composition comprises, by weight of the photosensitive resin composition, 0.6%-2% silver halide, 0.06%-0.7% oxidant, 5%-15% the second dispersion resin, 5%-10% light-polymerizable compound, 25%-57% pigment dispersion, 0.05%-0.06% light polymerization initiator and 28.5%-60% solvent. When placed under a strong ultraviolet light irradiation condition, the color filter exhibits black and barriers the ultraviolet light; and when placed in a visible light range, the color filter recovers the original color.

摘要翻译： 本发明公开了一种感光性树脂组合物和滤色器。 感光性树脂组合物以感光性树脂组合物的重量计含有0.6％-2％卤化银，0.06％-0.7％氧化剂，5％-15％第二分散树脂，5％-10％可光聚合化合物，25 ％-57％的颜料分散体，0.05％-0.06％的光聚合引发剂和28.5％-60％的溶剂。 当放置在强紫外线照射条件下时，滤色器显示黑色并阻挡紫外线; 并且当放置在可见光范围时，滤色器恢复原始颜色。

公开(公告)号：US09458279B2

公开(公告)日：2016-10-04

申请号：US12993721

申请日：2009-05-14

申请人： Yoshihide Sekito

发明人： Yoshihide Sekito

IPC分类号： C08G18/75 ,  C08G18/34 ,  C08G18/44 ,  C08G18/66 ,  C08G73/10 ,  C09D179/08 ,  G03F7/027 ,  G03F7/037 ,  H01B3/30 ,  H01B3/40 ,  H05K3/28

CPC分类号： C08G18/758 ,  C08G18/348 ,  C08G18/44 ,  C08G18/6659 ,  C08G73/1035 ,  C09D179/08 ,  G03F7/027 ,  G03F7/037 ,  H01B3/306 ,  H01B3/40 ,  H05K3/287 ,  C08L2666/02

摘要： An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin.

摘要翻译： 本发明的目的是提供：（a）热固性树脂组合物，感光性树脂组合物，树脂组合物溶液，树脂膜和绝缘膜，其各自（i）可在低温下固化（ 不超过200℃），（ii）具有优异的柔性，电绝缘可靠性，焊料耐热性和耐有机溶剂性，（iii）固化后基材的翘曲较少，（iv）具有优异的粘附性 密封剂; 以及设置有上述绝缘膜的（b）印刷电路板。 本发明的目的是通过使用至少含有具有末端羧酸基的（A）氨基甲酸酯酰亚胺低聚物和（B）热固性树脂的热固性树脂组合物来实现。

公开(公告)号：US09309446B2

公开(公告)日：2016-04-12

申请号：US13410702

申请日：2012-03-02

申请人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

发明人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

IPC分类号： G03F7/00 ,  G03F7/004 ,  C09J7/02 ,  H01L23/00 ,  G03F7/027 ,  G03F7/037 ,  G03F7/038 ,  C08G73/10 ,  C09J179/08 ,  H01L21/683 ,  H01L25/065 ,  H01L23/29 ,  H01L23/31

CPC分类号： C09J7/0203 ,  C08G73/105 ,  C08L63/00 ,  C09J7/35 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2479/08 ,  G03F7/027 ,  G03F7/037 ,  G03F7/038 ,  H01L21/6836 ,  H01L23/293 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/27002 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/27622 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/24802 ,  Y10T428/2817 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.

摘要翻译： 本发明涉及一种感光性粘合剂组合物，其通过曝光和显影进行图案化后具有对粘合剂的热压粘合性，并且能够进行碱显影，其中在曝光和进一步热固化后110℃下的储能弹性模量不小于10 MPa。