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    Production of color filter
    4.
    发明授权
    Production of color filter 失效
    生产滤色片

    公开(公告)号：US5827626A

    公开(公告)日：1998-10-27

    申请号：US613094

    申请日：1996-03-08

    申请人： Yuji Kobayashi ,  Shigeo Tachiki ,  Toshihiko Akahori ,  Syoichi Sasaki ,  Kouji Yamazaki ,  Yoichi Kimura

    发明人： Yuji Kobayashi ,  Shigeo Tachiki ,  Toshihiko Akahori ,  Syoichi Sasaki ,  Kouji Yamazaki ,  Yoichi Kimura

    IPC分类号： G02B5/22 ,  G02B5/20

    CPC分类号： G02B5/223

    摘要： A color filter having excellent optical properties can be produced in high yield using a photo-sensitive composition comprising (a) a resin, (b) one or more pigments, (c) one or more monomers, and (d) a photoinitiator to form a film on a substrate, followed by exposure to light and development using a specific developer containing ##STR1## wherein R.sup.1 is C.sub.1-19 alkyl; and R.sup.2 is C.sub.1-19 alkylene.

    摘要翻译： 可以使用包含（a）树脂，（b）一种或多种颜料，（c）一种或多种单体的光敏组合物和（d）光引发剂形成的光敏组合物，可以高产率地制备具有优异光学特性的滤色器 在底物上的膜，接着用含有的特定显影剂曝光和显影，其中R1是C1-19烷基; 并且R 2是C 1-19亚烷基。

    Process for producing printed wiring board and photosensitive resin composition used in the same
    6.
    发明授权
    Process for producing printed wiring board and photosensitive resin composition used in the same 有权
    用于制造印刷线路板的方法和用于其中的感光性树脂组合物

    公开(公告)号：US07338751B2

    公开(公告)日：2008-03-04

    申请号：US10473466

    申请日：2002-03-29

    申请人： Toshihiko Akahori ,  Ken Sawabe ,  Michiko Natori ,  Tomoaki Aoki ,  Takuya Kajiwara

    发明人： Toshihiko Akahori ,  Ken Sawabe ,  Michiko Natori ,  Tomoaki Aoki ,  Takuya Kajiwara

    IPC分类号： G03F7/20 ,  G03F7/30 ,  G03F7/42 ,  G03F7/26 ,  G03F7/032

    CPC分类号： H05K3/243 ,  H05K3/28 ,  H05K2203/0571 ,  H05K2203/0574 ,  H05K2203/0588 ,  H05K2203/072

    摘要： An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process. The present invention is directed to a process for producing a printed wiring board, comprising the steps of: (i) forming a solder resist on a wiring board having a circuit; (ii) laminating a preliminarily molded layer of a photosensitive resin composition on the solder resist; (iii) subjecting the layer of the photosensitive resin composition to exposure and development to form a resist pattern of the photosensitive resin composition; (iv) subjecting the entire surface of the resultant board to electroless plating, and (v) stripping the layer of the photosensitive resin composition, wherein the steps are conducted in this order, as well as a photosensitive resin composition and the layer thereof used in the process.

    摘要翻译： 本发明的目的是提供一种制造印刷电路板的方法，其优点在于不仅能够实现电路板的尺寸减小和密度的增加，而且还简化了步骤，而且也在于 安装部件的连接可靠性和产量提高，并且在该方法中使用感光性树脂组合物。 本发明涉及印刷电路板的制造方法，其特征在于包括以下步骤：（i）在具有电路的布线板上形成阻焊剂; （ii）在阻焊剂上层叠感光性树脂组合物的预成型层; （iii）将感光性树脂组合物的层进行曝光和显影以形成感光性树脂组合物的抗蚀剂图案; （iv）使所得板的整个表面进行无电镀，和（v）剥离感光性树脂组合物层，其中依次进行所述步骤，以及光敏树脂组合物及其用于 的过程。

    CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
    8.
    发明授权
    CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate 有权
    CMP磨料，用于CMP磨料的液体添加剂和抛光基材的方法

    公开(公告)号：US07163644B2

    公开(公告)日：2007-01-16

    申请号：US10990427

    申请日：2004-11-18

    申请人： Toshihiko Akahori ,  Toranosuke Ashizawa ,  Keizo Hirai ,  Miho Kurihara ,  Masato Yoshida ,  Yasushi Kurata

    发明人： Toshihiko Akahori ,  Toranosuke Ashizawa ,  Keizo Hirai ,  Miho Kurihara ,  Masato Yoshida ,  Yasushi Kurata

    IPC分类号： C09K13/00

    CPC分类号： B24D3/34 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053

    摘要： A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.

    摘要翻译： 包含含有氧化铈颗粒的氧化铈浆料，分散剂和水以及含有分散剂和水的液体添加剂的CMP研磨剂; 和用于CMP研磨剂的液体添加剂。 一种用于抛光衬底的方法，其包括将其上形成有待研磨的膜的衬底保持在研磨台板的抛光垫上，随后按压并移动所述衬底和所述研磨台板，同时在其间提供上述CMP磨料 要抛光的膜和抛光垫，从而抛光待抛光的膜。 CMP研磨剂和抛光方法可用于抛光硅氧烷膜或氮化硅膜等抛光表面，而不会用钠离子等碱金属污染待抛光表面，而且不会产生缺陷， CMP研磨剂的储存稳定性优异。

    CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
    9.
    发明申请
    CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate 审中-公开
    CMP磨料，用于CMP磨料的液体添加剂和抛光基材的方法

    公开(公告)号：US20060197054A1

    公开(公告)日：2006-09-07

    申请号：US11407195

    申请日：2006-04-20

    申请人： Toshihiko Akahori ,  Toranosuke Ashizawa ,  Keizo Hirai ,  Miho Kurihara ,  Masato Yoshida ,  Yasushi Kurata

    发明人： Toshihiko Akahori ,  Toranosuke Ashizawa ,  Keizo Hirai ,  Miho Kurihara ,  Masato Yoshida ,  Yasushi Kurata

    IPC分类号： C09K13/00 ,  C09K13/06

    CPC分类号： B24D3/34 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053

    摘要： A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.

    摘要翻译： 包含含有氧化铈颗粒的氧化铈浆料，分散剂和水以及含有分散剂和水的液体添加剂的CMP研磨剂; 和用于CMP研磨剂的液体添加剂。 一种用于抛光衬底的方法，其包括将其上形成有待研磨的膜的衬底保持在研磨台板的抛光垫上，随后按压并移动所述衬底和所述研磨台板，同时在其间提供上述CMP磨料 要抛光的膜和抛光垫，从而抛光待抛光的膜。 CMP研磨剂和抛光方法可用于抛光硅氧烷膜或氮化硅膜等抛光表面，而不会用钠离子等碱金属污染待抛光表面，而且不会产生缺陷， CMP研磨剂的储存稳定性优异。