-
公开(公告)号：US20220231198A1
公开(公告)日：2022-07-21
申请号：US17555727
申请日：2021-12-20
发明人： Chin-Tang Li
IPC分类号： H01L33/48 , H01L25/075 , H01L33/62
摘要： An electronic device and a substrate structure thereof. The substrate structure includes a carrier board and a laminated structure. The carrier board has a board body, through holes and conductive portions. The board body has a first surface and a second surface. The through holes communicate the first and second surfaces. Each through hole has a first opening and a second opening. The conductive portions are arranged on the first surface, and the first opening is sealed by a corresponding conductive portion. The laminated structure includes a viscid layer and conductive elements. One surface of the viscid layer is in surface contact with the second surface. Each conductive element passes through and accommodates in the viscid layer, and corresponds to one through hole in a projection direction of the carrier board. One end of each conductive element is electrically connected to one conductive portion through the corresponding through hole.
-
公开(公告)号：US20210408348A1
公开(公告)日：2021-12-30
申请号：US17349150
申请日：2021-06-16
发明人： Chin-Tang Li
摘要： A light-emitting device comprises a transparent substrate, a reflection structure and a light-emitting unit. The transparent substrate is defined with a first surface and a second surface opposite to each other. The reflection structure is disposed on and contacts the second surface of the transparent substrate. The reflection structure includes a reflection layer and a circuit layer. The reflection structure is configured to define a light-transmitting window. The light-emitting unit is disposed corresponding to the light-transmitting window. The light-emitting unit is electrically connected to the circuit layer of the reflection structure, and one optical path of the light-emitting unit passes through the light-transmitting window.
-
公开(公告)号：US20210329782A1
公开(公告)日：2021-10-21
申请号：US17230452
申请日：2021-04-14
发明人： Chin-Tang Li
摘要： An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.
-
公开(公告)号：US10653012B2
公开(公告)日：2020-05-12
申请号：US16135492
申请日：2018-09-19
发明人： Chin-Tang Li
摘要： An electronic device and manufacturing method thereof are disclosed. The manufacturing method of the electronic device comprises following steps: forming at least a thin-film conductive line on the substrate by a thin-film process; forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad. The electronic device has a lower manufacturing cost and a higher component configuration density, and the production yield and reliability of the electronic device are improved by the configuration of the electrical connection pad.
-
公开(公告)号：US20190198490A1
公开(公告)日：2019-06-27
申请号：US16220610
申请日：2018-12-14
发明人： Chin-Tang LI
摘要： An electronic package unit, a manufacturing method thereof and an electronic device are disclosed. The manufacturing method includes: providing an insulation substrate, wherein the insulation substrate has a first surface and a second surface opposite to the first surface; forming a plurality of sub-matrix circuits on the insulation substrate, wherein each sub-matrix circuit comprises at least one thin film transistor; disposing at least one functional chip on the first surface, wherein the functional chip is electrically connected with the sub-matrix circuit; forming a plurality of through-holes on the insulation substrate and disposing a conductive material in the through-holes, so that the functional chip is electrically connected to the second surface through the sub-matrix circuits and the conductive material; forming a protection layer on the first surface to cover the functional chips; and cutting the insulation substrate and the protection layer to form a plurality of electronic package units.
-
6.发明授权公开(公告)号：US10156748B2
公开(公告)日：2018-12-18
申请号：US15037226
申请日：2014-11-28
发明人： Yuan-Liang Wu , Peter Gerets , Sven Schule
IPC分类号： G02F1/1333 , G02F1/1345 , G02F1/1335 , G02F1/1343 , G02F1/1362 , G02F1/1368 , G06F3/041
摘要： A matrix circuit substrate, having: a substrate body, having a first surface and a second surface which are opposite each other, and at least one sidewall located between the first surface and the second surface, the sidewall having at least one recess; multiple electrodes, disposed in a crisscross arrangement on the first surface; and at least one first conductive material, disposed in the recess to correspond to at least one of the electrodes, and electrically connected to the electrode. Additionally, a display apparatus having such substrate, and to a method for manufacturing such substrate.
-
公开(公告)号：US20170039935A1
公开(公告)日：2017-02-09
申请号：US15227244
申请日：2016-08-03
发明人： Wu-Chang YANG , Chia-Ho YANG
IPC分类号： G09G3/3233 , G09G3/32
CPC分类号： G09G3/3233 , G09G3/32 , G09G3/3258 , G09G2300/0833 , G09G2300/0842 , G09G2300/0861 , G09G2310/0259 , G09G2310/06 , G09G2310/066 , G09G2320/0247
摘要： A pixel circuit includes a lighting element, a driving signal generating unit and a switching unit. The driving signal generating unit compares a data signal with a reference signal so as to generate a PWM driving signal. The status of the PWM driving signal is determined according to the comparing result of the data signal and the reference signal. The switching unit is electrically connected to a power source and the lighting element, and generates a driving current to drive the lighting element to emit light according to the PWM driving signal.
摘要翻译： 像素电路包括发光元件，驱动信号产生单元和开关单元。 驱动信号生成单元将数据信号与参考信号进行比较，以产生PWM驱动信号。 根据数据信号和参考信号的比较结果确定PWM驱动信号的状态。 开关单元电连接到电源和照明元件，并且根据PWM驱动信号产生驱动电流以驱动发光元件发光。
-
公开(公告)号：US11553591B2
公开(公告)日：2023-01-10
申请号：US17230452
申请日：2021-04-14
发明人： Chin-Tang Li
摘要： An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.
-
公开(公告)号：US20220210918A1
公开(公告)日：2022-06-30
申请号：US17562614
申请日：2021-12-27
发明人： Chin-Tang LI
摘要： An electronic device includes a supporting board, an electrical board and electronic units. The supporting board includes a circuit layer. The electrical board has a board body, through holes through the board body, an electrical layer on the board body, and primary conductive elements respectively in the through holes. The board body has opposite first and second surfaces. The through holes communicate with the first surface and the second surface. The primary conductive elements electrically connect the electrical layer to the circuit layer. The electronic units are arranged on the first surface. Each electronic unit partially overlaps with one corresponding through hole in a projection direction of the electrical board. Each electronic unit has an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer. The secondary conductive elements and the primary conductive elements are arranged in dislocation in the projection direction.
-
10.发明授权公开(公告)号：US10545364B2
公开(公告)日：2020-01-28
申请号：US16184040
申请日：2018-11-08
发明人： Yuan-Liang Wu , Peter Gerets , Sven Schule
IPC分类号： G02F1/1333 , G02F1/1345 , G02F1/1335 , G02F1/1343 , G02F1/1362 , G02F1/1368 , G06F3/041
摘要： A matrix circuit substrate, having a substrate body, having a first surface and a second surface which are opposite each other, and at least one sidewall located between the first surface and the second surface, the sidewall having at least one recess; multiple electrodes, disposed in a crisscross arrangement on the first surface; and at least one first conductive material, disposed in the recess to correspond to at least one of the electrodes, and electrically connected to the electrode. Additionally, a display apparatus having such substrate, and to a method for manufacturing such substrate.
-
-
-
-
-
-
-
-
-
搜索结果
38 条记录 (耗时 0.016 秒)
