公开(公告)号：US3824104A

公开(公告)日：1974-07-16

申请号：US36345373

申请日：1973-05-24

申请人： GRACE W & CO WASHINGTON RES CE

发明人： KLOCZEWSKI H ,  SCHAEFFER W

IPC分类号： H05K3/28 ,  C08F2/00 ,  C08F2/48 ,  C08F16/00 ,  C08F16/32 ,  C08F18/00 ,  C08F18/14 ,  C08G75/00 ,  C08G75/02 ,  C08G75/04 ,  C09D4/00 ,  C09D181/00 ,  G03F7/027 ,  G03C1/70

CPC分类号： C08G75/12 ,  C08G75/045 ,  G03F7/0275 ,  Y10S430/122

摘要： THIS INVENTION RELATES TO A HEAT AND SOLDER RESISTANT SOLID PHOTOPOLYMER COMPOSITION WHICH CAN BE IMAGED AND DEVELOPED AND A PROCESS OF USING SAME. THE SOLDER RESISTANT PHOTOCURABLE COMPOSITION CONSISTS ESSENTIALLY OF A SOLID DIALLYL PHTHALATE PREPOLYMER, I.E. POLY-(DIALLY ORTHOPHTHALATE) AND A LIQUID POLYENE AND POLYTHIOL. THE SOLID COMPOSITION WHEN APPLIED TO A PRINTED CIRCUIT BOARD AND CURED IMAGEWISE IN THE PRESENCE OF A FREE RADICAL GENERATOR PERMITS PASSAGE OF THE BOARD THROUGH A BATH OF MOLTEN SOLDER TO SECURE ELECTRICAL COMPONENTS, THERETO WHEN THE FREE RADICAL GENERATOR IS ACTINIC RADIATION. E.G., UV LIGHT, A CURING RATE ACCELERATOR, E.G., BENZOPHENON IS USUALLY ADDED TO THE COMPOSITION.