公开(公告)号：US07078631B2

公开(公告)日：2006-07-18

申请号：US10505338

申请日：2003-02-24

申请人： Dag T. Wang ,  Ralph W. Bernstein ,  Geir Uri Jensen ,  Eivind Lund

发明人： Dag T. Wang ,  Ralph W. Bernstein ,  Geir Uri Jensen ,  Eivind Lund

IPC分类号： G01G3/14

CPC分类号： G01G3/1402

摘要： A spring scale, in particular for weighing loads in the μg-mg range, comprises a load platform suspended by at least three flexural springs in a surrounding frame, and has bridge-connected strain gauges arranged for measuring strain on one side of the flexural springs. The flexural springs extend in succession along substantially the whole periphery of the load platform in a gap between the load platform and the inner edge of the frame, and an attachment spot on the load platform for every flexural spring is arranged substantially directly opposite or past an attachment spot on the inner edge of the frame for a next flexural spring in the succession of springs. Preferably, the spring scale is made in one piece, and manufactured by means of semiconductor process technology.

摘要翻译： 弹簧秤，特别是用于称重摩擦范围内的载荷的称重载荷包括由周围框架中的至少三个弯曲弹簧悬挂的载荷平台，并且具有布置成用于测量挠曲弹簧一侧的应变的桥接应变仪 。 弯曲弹簧在负载平台和框架的内边缘之间的间隙中沿着负载平台的大致整个周边连续地延伸，并且用于每个弯曲弹簧的负载平台上的附接点基本上直接相对或经过 在连续弹簧的下一个弯曲弹簧的框架的内边缘上的附着点。 优选地，弹簧秤制成一体，并且通过半导体工艺技术制造。

公开(公告)号：US20120074509A1

公开(公告)日：2012-03-29

申请号：US13259809

申请日：2010-03-26

申请人： Sigrid Berg ,  Kamal Chapagain ,  Jon Due-Hansen ,  Kjell Arne Ingebrigtsen ,  Geir Uri Jensen ,  Kjersti Midtbø ,  Erik Utne Poppe ,  Arne Rønnekleiv ,  Dag Thorstein Wang

发明人： Sigrid Berg ,  Kamal Chapagain ,  Jon Due-Hansen ,  Kjell Arne Ingebrigtsen ,  Geir Uri Jensen ,  Kjersti Midtbø ,  Erik Utne Poppe ,  Arne Rønnekleiv ,  Dag Thorstein Wang

IPC分类号： H01L29/84 ,  H01L21/02

CPC分类号： B06B1/0292 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

摘要： A wafer bonded CMUT array comprising a plurality of CMUT elements distributed across a substrates, each element comprising a cavity and a signal electrode formed in the substrate, and a conductive membrane closing the cavity and forming a ground electrode, wherein the membranes of the individual elements form an unbroken ground plane across the surface of the array and wherein electrical connection to the signal electrodes is provided by means of a conductive vias depending therefrom through the substrate from the signal electrode to the rear of the substrate.

摘要翻译： 一种晶片结合的CMUT阵列，包括跨越衬底分布的多个CMUT元件，每个元件包括形成在衬底中的空腔和信号电极，以及导电膜封闭空腔并形成接地电极，其中各元件的膜 在阵列的表面上形成不间断的接地平面，并且其中与信号电极的电连接通过从基板从信号电极到基板的后部从基板悬垂的导电通孔提供。