公开(公告)号：US20120074509A1

公开(公告)日：2012-03-29

申请号：US13259809

申请日：2010-03-26

申请人： Sigrid Berg ,  Kamal Chapagain ,  Jon Due-Hansen ,  Kjell Arne Ingebrigtsen ,  Geir Uri Jensen ,  Kjersti Midtbø ,  Erik Utne Poppe ,  Arne Rønnekleiv ,  Dag Thorstein Wang

发明人： Sigrid Berg ,  Kamal Chapagain ,  Jon Due-Hansen ,  Kjell Arne Ingebrigtsen ,  Geir Uri Jensen ,  Kjersti Midtbø ,  Erik Utne Poppe ,  Arne Rønnekleiv ,  Dag Thorstein Wang

IPC分类号： H01L29/84 ,  H01L21/02

CPC分类号： B06B1/0292 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

摘要： A wafer bonded CMUT array comprising a plurality of CMUT elements distributed across a substrates, each element comprising a cavity and a signal electrode formed in the substrate, and a conductive membrane closing the cavity and forming a ground electrode, wherein the membranes of the individual elements form an unbroken ground plane across the surface of the array and wherein electrical connection to the signal electrodes is provided by means of a conductive vias depending therefrom through the substrate from the signal electrode to the rear of the substrate.

摘要翻译： 一种晶片结合的CMUT阵列，包括跨越衬底分布的多个CMUT元件，每个元件包括形成在衬底中的空腔和信号电极，以及导电膜封闭空腔并形成接地电极，其中各元件的膜 在阵列的表面上形成不间断的接地平面，并且其中与信号电极的电连接通过从基板从信号电极到基板的后部从基板悬垂的导电通孔提供。