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    Solution for package crosstalk minimization
    1.
    发明授权
    Solution for package crosstalk minimization 有权
    封装串扰最小化的解决方案

    公开(公告)号：US08324019B2

    公开(公告)日：2012-12-04

    申请号：US12469985

    申请日：2009-05-21

    申请人： George C. Tang ,  Lizhi Zhong ,  Freeman Y. Zhong ,  Wenyi Jin ,  Jeffrey A. Hall

    发明人： George C. Tang ,  Lizhi Zhong ,  Freeman Y. Zhong ,  Wenyi Jin ,  Jeffrey A. Hall

    IPC分类号： H01L21/00

    CPC分类号： H01L23/50 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/112

    摘要： A method of minimizing crosstalk in an IC package including (A) routing a first signal between first pads and a first trace layer in an congested area, (B) routing the first signal between the first and second trace layers in an non-congested area, (C) routing the first signal between the second trace layer and first pins in the non-congested area, (D) routing a second signal between second pads and the first trace layer in the congested area, (E) routing the second signal between the first and the second trace layers in the congested area and (F) routing the second signal between the second trace layer and second pins in the non-congested area, wherein (i) all of the first and second pins are arranged along a line and (ii) the first pins are offset from the second pins by a gap of at least two inter-pin spaces.

    摘要翻译： 一种使IC封装中的串扰最小化的方法，包括：（A）在第一焊盘和拥堵区域中的第一迹线层之间路由第一信号;（B）在非拥塞区域中路由第一和第二迹线层之间的第一信号 （C）在第二跟踪层和非拥塞区域中的第一引脚之间路由第一信号，（D）在第二焊盘和拥塞区域中的第一跟踪层之间路由第二信号，（E）将第二信号 在所述拥挤区域中的所述第一和第二迹线层之间，以及（F）在所述非拥挤区域中的所述第二迹线层和所述第二引脚之间布置所述第二信号，其中（i）所有所述第一和第二引脚沿着 并且（ii）第一引脚与至少两个引脚间空间的间隙从第二引脚偏移。

    SOLUTION FOR PACKAGE CROSSTALK MINIMIZATION
    2.
    发明申请
    SOLUTION FOR PACKAGE CROSSTALK MINIMIZATION 有权
    解决方案用于包装CROSSTALK最小化

    公开(公告)号：US20090289348A1

    公开(公告)日：2009-11-26

    申请号：US12469985

    申请日：2009-05-21

    申请人： George C. Tang ,  Lizhi Zhong ,  Freeman Y. Zhong ,  Wenyi Jin ,  Jeffrey A. Hall

    发明人： George C. Tang ,  Lizhi Zhong ,  Freeman Y. Zhong ,  Wenyi Jin ,  Jeffrey A. Hall

    IPC分类号： H01L23/498 ,  H04L5/14

    CPC分类号： H01L23/50 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/112

    摘要： A method of minimizing crosstalk in an IC package including (A) routing a first signal between first pads and a first trace layer in an congested area, (B) routing the first signal between the first and second trace layers in an non-congested area, (C) routing the first signal between the second trace layer and first pins in the non-congested area, (D) routing a second signal between second pads and the first trace layer in the congested area, (E) routing the second signal between the first and the second trace layers in the congested area and (F) routing the second signal between the second trace layer and second pins in the non-congested area, wherein (i) all of the first and second pins are arranged along a line and (ii) the first pins are offset from the second pins by a gap of at least two inter-pin spaces.

    摘要翻译： 一种使IC封装中的串扰最小化的方法，包括：（A）在第一焊盘和拥堵区域中的第一迹线层之间路由第一信号;（B）在非拥塞区域中路由第一和第二迹线层之间的第一信号 （C）在第二跟踪层和非拥塞区域中的第一引脚之间路由第一信号，（D）在第二焊盘和拥塞区域中的第一跟踪层之间路由第二信号，（E）将第二信号 在所述拥挤区域中的所述第一和第二迹线层之间，以及（F）在所述非拥挤区域中的所述第二迹线层和所述第二引脚之间布置所述第二信号，其中（i）所有所述第一和第二引脚沿着 并且（ii）第一引脚与至少两个引脚间空间的间隙从第二引脚偏移。

    Electronic component connection support structures including air as a dielectric
    3.
    发明申请
    Electronic component connection support structures including air as a dielectric 有权
    电子部件连接支撑结构，包括空气作为电介质

    公开(公告)号：US20080142250A1

    公开(公告)日：2008-06-19

    申请号：US11641989

    申请日：2006-12-18

    申请人： George C. Tang

    发明人： George C. Tang

    IPC分类号： H05K1/03

    CPC分类号： H05K1/024 ,  H05K2201/09063

    摘要： Electronic component supporting mediums includes dielectric support material having voids adapted to include the use of air as a dielectric, which is commonly used in printed circuit boards and electrical connectors. The support medium provides physical support to conductive connections and a mechanical structure to enable electrical connections between electronic components. Support structures including air as a dielectric can be provided in the form of printed circuit boards and electrical connectors. The printed circuit board of claim 16 wherein said dielectric material comprises a low loss material. The support medium can comprise a low loss material such as air, FR-4, Teflon material, and plastic.

    摘要翻译： 电子部件支撑介质包括具有适于包括使用空气作为电介质的空隙的电介质支撑材料，其通常用于印刷电路板和电连接器中。 支撑介质为导电连接和机械结构提供物理支撑，以实现电子部件之间的电连接。 包括作为电介质的空气的支撑结构可以以印刷电路板和电连接器的形式提供。 17.根据权利要求16所述的印刷电路板，其中所述电介质材料包括低损耗材料。 支撑介质可以包括低损耗材料，例如空气，FR-4，特氟龙材料和塑料。

    Electronic component connection support structures including air as a dielectric
    4.
    发明授权
    Electronic component connection support structures including air as a dielectric 有权
    电子部件连接支撑结构，包括空气作为电介质

    公开(公告)号：US07557303B2

    公开(公告)日：2009-07-07

    申请号：US11641989

    申请日：2006-12-18

    申请人： George C. Tang

    发明人： George C. Tang

    IPC分类号： H05K1/11

    CPC分类号： H05K1/024 ,  H05K2201/09063

    摘要： Electronic component supporting mediums includes dielectric support material having voids adapted to include the use of air as a dielectric, which is commonly used in printed circuit boards and electrical connectors. The support medium provides physical support to conductive connections and a mechanical structure to enable electrical connections between electronic components. Support structures including air as a dielectric can be provided in the form of printed circuit boards and electrical connectors. A printed circuit board wherein said dielectric material comprises a low loss material. The support medium can comprise a low loss material such as air, FR-4, Teflon material, and plastic.

    摘要翻译： 电子部件支撑介质包括具有适于包括使用空气作为电介质的空隙的电介质支撑材料，其通常用于印刷电路板和电连接器中。 支撑介质为导电连接和机械结构提供物理支撑，以实现电子部件之间的电连接。 包括作为电介质的空气的支撑结构可以以印刷电路板和电连接器的形式提供。 一种印刷电路板，其中所述电介质材料包括低损耗材料。 支撑介质可以包括低损耗材料，例如空气，FR-4，特氟龙材料和塑料。