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公开(公告)号:US20070231581A1
公开(公告)日:2007-10-04
申请号:US11732319
申请日:2007-04-03
申请人: Pui-Yan Lin , Govindasamy Rajendran , George Zahr
发明人: Pui-Yan Lin , Govindasamy Rajendran , George Zahr
IPC分类号: B32B27/38 , B32B15/092 , C08L63/00 , B32B27/18
CPC分类号: C08G59/4223 , C08G59/3218 , H05K3/4661 , H05K3/4676 , Y10T428/31511 , Y10T428/31529
摘要: Epoxy compositions that exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. The compositions are well-suited for use as dielectrics in electronics applications such as in multi-layer printed circuit boards, integrated circuit (IC) chip substrates, also known as IC chip carriers, and IC chip package interposers.
摘要翻译: 提供在固化状态下显示低粘度和固化状态下的低热膨胀系数的环氧组合物。 该组合物非常适合用作电子应用中的电介质,例如多层印刷电路板,也称为IC芯片载体的集成电路(IC)芯片基板和IC芯片封装内插器。
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公开(公告)号:US20060041076A1
公开(公告)日:2006-02-23
申请号:US11177752
申请日:2005-07-08
申请人: Pui-Yan Lin , George Zahr , Govindasamy Rajendran
发明人: Pui-Yan Lin , George Zahr , Govindasamy Rajendran
IPC分类号: C08F120/08
CPC分类号: C08G73/1014
摘要: Provided according to the invention are cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyimide cross-links, providing a polymeric composite on a molecular scale, and shaped articles made therefrom. In some embodiments the shaped articles are particularly well suited for electronics applications. The shaped articles are characterized by low CTE (coefficient of thermal expansion), low dielectric constant (Dk), low dissipation factor (Df), high strength, high modulus and high toughness.
摘要翻译: 根据本发明提供的是包含酸酐或部分水解的酸酐官能化聚合物的交联聚合物,其具有低聚聚酰亚胺交联,提供分子尺度的聚合物复合物,以及由其制成的成型制品。 在一些实施例中,成形制品特别适用于电子应用。 成型制品的特点是低CTE(热膨胀系数),低介电常数(Dk),低耗散因数(Df),高强度,高模量和高韧性。
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公开(公告)号:US20060020081A1
公开(公告)日:2006-01-26
申请号:US11177753
申请日:2005-07-08
申请人: Pui-Yan Lin , George Zahr , Govindasamy Rajendran
发明人: Pui-Yan Lin , George Zahr , Govindasamy Rajendran
CPC分类号: C08G73/10 , C08F8/48 , C08F2800/20 , C08G73/101 , H05K1/0346 , H05K3/4676 , C08F8/32 , C08F210/02
摘要: Cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyamic acid cross-links are provided. In solution, a polymer of the invention forms a formable gel. The formable gel is useful for forming shaped articles that are useful for electronics applications.
摘要翻译: 提供了包含具有低聚聚酰胺酸交联的酸酐或部分水解的酸酐官能化聚合物的交联聚合物。 在溶液中,本发明的聚合物形成可形成的凝胶。 可成型凝胶可用于形成用于电子应用的成型制品。
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