Method of providing flexible heat sink installations for early blade board manufacturing
    2.
    发明授权
    Method of providing flexible heat sink installations for early blade board manufacturing 失效
    提供用于早期刀片板制造的柔性散热器装置的方法

    公开(公告)号:US07719842B2

    公开(公告)日:2010-05-18

    申请号:US12032950

    申请日:2008-02-18

    IPC分类号: H05K7/20

    摘要: An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks.

    摘要翻译: 一种用于在电路板在固定制造站中测试时在测试期间将多个散热器安装到电路板上的装置。 该装置具有多边形框架,其尺寸限于电路板上包含多个要冷却的数据处理元件的区域。 框架上至少有四个孔,其中每个孔对应于待冷却的多个数据处理元件中的不同的孔。 插槽定位在框架上以接收超大的处理元件。 至少四个支柱从框架延伸并安装到设置在电路板上的安装孔中。 框架上的孔支撑待冷却的数据处理元件上方的散热器。 不需要额外的螺丝,粘合剂,夹子或其他固定机构来固定散热器。

    Dynamic association of input/output device with application programs
    3.
    发明授权
    Dynamic association of input/output device with application programs 失效
    输入/输出设备与应用程序的动态关联

    公开(公告)号:US06473824B1

    公开(公告)日:2002-10-29

    申请号:US09416834

    申请日:1999-10-12

    IPC分类号: G06F1300

    CPC分类号: G06F13/102

    摘要: An object-oriented framework is introduced for coupling device drivers to an application program. Two class trees are introduced: the first class tree comprises the device drivers. The device drivers actually exchange messages with the IO devices. They depend on the protocol used, on the IO interface, and on the operating system. The second class tree comprises the so-called physical objects. Their task is to define parameters that are necessary to describe what an IO device is supposed to do. The parameters only depend on the device's functionality, but not on the protocol, the IO interface or the operating system. In order to couple a physical object with a device driver, the physical object holds a pointer to its device driver. The connection is an “object reference,” and therefore, the active device driver may be changed at runtime.

    摘要翻译: 引入面向对象的框架,用于将设备驱动程序耦合到应用程序。 引入了两个类树:第一类树包括设备驱动程序。 设备驱动程序实际上与IO设备交换消息。 它们依赖于所使用的协议,IO接口和操作系统。 第二类树包括所谓的物理对象。 他们的任务是定义描述IO设备应该做什么的必要参数。 参数仅取决于设备的功能,但不依赖于协议,IO接口或操作系统。 为了将物理对象与设备驱动程序相连接,物理对象保存指向其设备驱动程序的指针。 连接是“对象引用”,因此,活动设备驱动程序可能会在运行时更改。

    Update in-use flash memory without external interfaces
    4.
    发明授权
    Update in-use flash memory without external interfaces 失效
    在没有外部接口的情况下更新使用中的闪存

    公开(公告)号:US08032740B2

    公开(公告)日:2011-10-04

    申请号:US12166182

    申请日:2008-07-01

    CPC分类号: G06F8/65

    摘要: A method, apparatus and program storage device for updating a non-volatile memory in an embedded system is provided. The invention includes detaching the non-volatile memory from all expectable non-volatile memory references, creating a temporary, volatile-memory file system for allocation of volatile memory space as needed for the non-volatile memory update process, copying all procedural code required to perform the non-volatile memory update into the volatile memory, changing the system search path definitions temporarily to point to the volatile memory, and performing the non-volatile memory update.

    摘要翻译: 提供了一种用于更新嵌入式系统中的非易失性存储器的方法,装置和程序存储装置。 本发明包括将非易失性存储器从所有可预期的非易失性存储器引用中分离出来,创建用于非易失性存储器更新过程所需的用于分配易失性存储器空间的临时易失性存储器文件系统,复制所需的所有程序代码 执行非易失性存储器更新到易失性存储器中,暂时改变系统搜索路径定义以指向易失性存储器,并执行非易失性存储器更新。

    FLEXIBLE HEAT SINK INSTALLATION FOR EARLY BLADE BOARD MANUFACTURING
    5.
    发明申请
    FLEXIBLE HEAT SINK INSTALLATION FOR EARLY BLADE BOARD MANUFACTURING 审中-公开
    柔性散热器安装早期叶片制造

    公开(公告)号:US20090268410A1

    公开(公告)日:2009-10-29

    申请号:US12195156

    申请日:2008-08-20

    IPC分类号: H05K7/20

    摘要: An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while live circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks.

    摘要翻译: 一种用于在测试期间将固定电路板在固定制造站中测试的多个散热器安装到电路板上的装置。 该装置具有多边形框架,其尺寸限于电路板上包含多个要冷却的数据处理元件的区域。 框架上至少有四个孔,其中每个孔对应于待冷却的多个数据处理元件中的不同的一个。 插槽定位在框架上以接收超大的处理元件。 至少四个支柱从框架延伸并安装到设置在电路板上的安装孔中。 框架上的孔支撑待冷却的数据处理元件上方的散热器。 不需要额外的螺丝,粘合剂,夹子或其他固定机构来固定散热器。

    Update in-use flash memory without external interfaces
    6.
    发明授权
    Update in-use flash memory without external interfaces 失效
    在没有外部接口的情况下更新使用中的闪存

    公开(公告)号:US07409538B2

    公开(公告)日:2008-08-05

    申请号:US11013680

    申请日:2004-12-16

    IPC分类号: G06F9/00 G06F15/177 G06F1/24

    CPC分类号: G06F8/65

    摘要: A method, apparatus and program storage device for updating a non-volatile memory in an embedded system is provided. The invention includes detaching the non-volatile memory from all expectable non-volatile memory references, creating a temporary, volatile-memory file system for allocation of volatile memory space as needed for the non-volatile memory update process, copying all procedural code required to perform the non-volatile memory update into the volatile memory, changing the system search path definitions temporarily to point to the volatile memory, and performing the non-volatile memory update.

    摘要翻译: 提供了一种用于更新嵌入式系统中的非易失性存储器的方法,装置和程序存储装置。 本发明包括将非易失性存储器从所有可预期的非易失性存储器引用中分离出来,创建用于非易失性存储器更新过程所需的用于分配易失性存储器空间的临时易失性存储器文件系统,复制所需的所有程序代码 执行非易失性存储器更新到易失性存储器中,暂时改变系统搜索路径定义以指向易失性存储器,并执行非易失性存储器更新。

    Update in-use flash memory without external interfaces
    8.
    发明申请
    Update in-use flash memory without external interfaces 失效
    在没有外部接口的情况下更新使用中的闪存

    公开(公告)号:US20050138347A1

    公开(公告)日:2005-06-23

    申请号:US11013680

    申请日:2004-12-16

    IPC分类号: G06F9/00 G06F9/445

    CPC分类号: G06F8/65

    摘要: A method, apparatus and program storage device for updating a non-volatile memory in an embedded system is provided. The invention includes detaching the non-volatile memory from all expectable non-volatile memory references, creating a temporary, volatile-memory file system for allocation of volatile memory space as needed for the non-volatile memory update process, copying all procedural code required to perform the non-volatile memory update into the volatile memory, changing the system search path definitions temporarily to point to the volatile memory, and performing the non-volatile memory update.

    摘要翻译: 提供了一种用于更新嵌入式系统中的非易失性存储器的方法,装置和程序存储装置。 本发明包括将非易失性存储器从所有可预期的非易失性存储器引用中分离出来,创建用于非易失性存储器更新过程所需的用于分配易失性存储器空间的临时易失性存储器文件系统,复制所需的所有程序代码 执行非易失性存储器更新到易失性存储器中,暂时改变系统搜索路径定义以指向易失性存储器,并执行非易失性存储器更新。

    Method of providing flexible heat sink installations for early blade board manufacturing
    10.
    发明申请
    Method of providing flexible heat sink installations for early blade board manufacturing 失效
    提供用于早期刀片板制造的柔性散热器装置的方法

    公开(公告)号:US20090205197A1

    公开(公告)日:2009-08-20

    申请号:US12032950

    申请日:2008-02-18

    IPC分类号: B23P19/00

    摘要: An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks.

    摘要翻译: 一种用于在电路板在固定制造站中测试时在测试期间将多个散热器安装到电路板上的装置。 该装置具有多边形框架,其尺寸限于电路板上包含多个要冷却的数据处理元件的区域。 框架上至少有四个孔,其中每个孔对应于待冷却的多个数据处理元件中的不同的一个。 插槽定位在框架上以接收超大的处理元件。 至少四个支柱从框架延伸并安装到设置在电路板上的安装孔中。 框架上的孔支撑待冷却的数据处理元件上方的散热器。 不需要额外的螺丝,粘合剂,夹子或其他固定机构来固定散热器。