摘要:
An integrated circuit may use a processing core provided for normal operation to diagnose and reconfigure other portions of the integrated circuit by accessing scanrings of storage elements of the other portions of the integrated circuit.
摘要:
An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks.
摘要:
An object-oriented framework is introduced for coupling device drivers to an application program. Two class trees are introduced: the first class tree comprises the device drivers. The device drivers actually exchange messages with the IO devices. They depend on the protocol used, on the IO interface, and on the operating system. The second class tree comprises the so-called physical objects. Their task is to define parameters that are necessary to describe what an IO device is supposed to do. The parameters only depend on the device's functionality, but not on the protocol, the IO interface or the operating system. In order to couple a physical object with a device driver, the physical object holds a pointer to its device driver. The connection is an “object reference,” and therefore, the active device driver may be changed at runtime.
摘要:
A method, apparatus and program storage device for updating a non-volatile memory in an embedded system is provided. The invention includes detaching the non-volatile memory from all expectable non-volatile memory references, creating a temporary, volatile-memory file system for allocation of volatile memory space as needed for the non-volatile memory update process, copying all procedural code required to perform the non-volatile memory update into the volatile memory, changing the system search path definitions temporarily to point to the volatile memory, and performing the non-volatile memory update.
摘要:
An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while live circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks.
摘要:
A method, apparatus and program storage device for updating a non-volatile memory in an embedded system is provided. The invention includes detaching the non-volatile memory from all expectable non-volatile memory references, creating a temporary, volatile-memory file system for allocation of volatile memory space as needed for the non-volatile memory update process, copying all procedural code required to perform the non-volatile memory update into the volatile memory, changing the system search path definitions temporarily to point to the volatile memory, and performing the non-volatile memory update.
摘要:
A method for accessing I/O devices in embedded control environments is provided, wherein said I/O devices are remotely attached to an embedded microprocessor. By mapping said I/O devices' resources to said microprocessor's address or memory address space, existing device drivers can be reused and the time-to-market capability is greatly improved.
摘要:
A method, apparatus and program storage device for updating a non-volatile memory in an embedded system is provided. The invention includes detaching the non-volatile memory from all expectable non-volatile memory references, creating a temporary, volatile-memory file system for allocation of volatile memory space as needed for the non-volatile memory update process, copying all procedural code required to perform the non-volatile memory update into the volatile memory, changing the system search path definitions temporarily to point to the volatile memory, and performing the non-volatile memory update.
摘要:
An integrated circuit (IC) performs self-healing and reconfiguration of a portion of the IC. In response to determining that a portion of the IC should be configured, a clock to the portion of the IC to be configured is halted. That portion of the IC is then configured using a processing core that is included in the IC. The processing core is also used to perform an intended function of the IC that is different than the configuration.
摘要:
An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks.