摘要:
Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame.
摘要:
A mobile device having at least two antennas can circumvent transmission problems caused by a user's grasp of the device. A sensor unit is disposed at a specific location of a device body and creates a sensor signal by detecting the contact or proximity of a particular object such a user's hand. When receiving the sensor signal, a control unit selects one of the antennas depending on the sensor signal and establishes a communication path based on the selected antenna. The selected antenna involved in the communication path is typically relatively free from degradation in transmission caused by a user's grasp of the mobile device. The radiation property of the mobile device, which may be degraded due to a user's grasp, can exhibit relatively little or no degradation as compared to the typical degradation in performance when the mobile device is being grasped.
摘要:
Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame.
摘要:
A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.
摘要:
A mobile device having at least two antennas can circumvent transmission problems caused by a user's grasp of the device. A sensor unit is disposed at a specific location of a device body and creates a sensor signal by detecting the contact or proximity of a particular object such a user's hand. When receiving the sensor signal, a control unit selects one of the antennas depending on the sensor signal and establishes a communication path based on the selected antenna. The selected antenna involved in the communication path is typically relatively free from degradation in transmission caused by a user's grasp of the mobile device. The radiation property of the mobile device, which may be degraded due to a user's grasp, can exhibit relatively little or no degradation as compared to the typical degradation in performance when the mobile device is being grasped.