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公开(公告)号：US20140065474A1
公开(公告)日：2014-03-06
申请号：US13599377
申请日：2012-08-30
IPC分类号： H01M2/08
CPC分类号： H01M2/08 , H01M2/0207 , H01M2/021 , H01M2/0267 , H01M2/0292 , H01M2/0408 , Y10T156/1043
摘要： A portable electronic device comprises an electromechanical module having an actuator for positioning a mechanical element between first and second positions, and a controller coupled to the electromechanical module. The controller is configured to detect a mechanical event coupling to the electromechanical module, select an actuation signal to position the mechanical element in a safe position between the first and second positions, and transmit the selected signal, such that the mechanical element is positioned in the safe position during the event.
摘要翻译： 便携式电子设备包括具有用于在第一和第二位置之间定位机械元件的致动器的机电模块以及耦合到机电模块的控制器。 控制器被配置为检测耦合到机电模块的机械事件，选择致动信号以将机械元件定位在第一和第二位置之间的安全位置，并且传送所选择的信号，使得机械元件位于 活动期间的安全位置。
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公开(公告)号：US09812680B2
公开(公告)日：2017-11-07
申请号：US13599377
申请日：2012-08-30
CPC分类号： H01M2/08 , H01M2/0207 , H01M2/021 , H01M2/0267 , H01M2/0292 , H01M2/0408 , Y10T156/1043
摘要： A portable electronic device comprises an electromechanical module having an actuator for positioning a mechanical element between first and second positions, and a controller coupled to the electromechanical module. The controller is configured to detect a mechanical event coupling to the electromechanical module, select an actuation signal to position the mechanical element in a safe position between the first and second positions, and transmit the selected signal, such that the mechanical element is positioned in the safe position during the event.
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公开(公告)号：US20140057731A1
公开(公告)日：2014-02-27
申请号：US13594135
申请日：2012-08-24
IPC分类号： B21D53/24
CPC分类号： H05K3/341 , H05K2201/1031 , H05K2201/10371 , H05K2201/10409 , H05K2201/2036 , Y02P70/611 , Y02P70/613
摘要： Threaded standoff structures may be provided with features that control the flow of solder. A base structure for a standoff may be formed from a solderphobic material such as brass. A through hole may be formed in the base structure. The base structure may be coated with a solderphilic material such as an inner layer of nickel and an outer layer of tin. A tapping tool may be used to remove the solderphilic material from the opening by tapping threads into the opening, thereby exposing the underlying base metal of the standoff in the opening. During attachment to a substrate such as a printed circuit board, the standoff may be exposed to molten solder. The solderphilic coating on the outer surface of the standoff may attract the molten solder, whereas the solderphobic base metal in the threaded opening may help prevent solder from contaminating the threads in the opening.
摘要翻译： 螺纹支座结构可以具有控制焊料流动的特征。 用于隔离物的基底结构可以由诸如黄铜的阻燃材料形成。 可以在基部结构中形成通孔。 基底结构可以涂覆有诸如镍的内层和锡的外层的可焊性材料。 可以使用攻丝工具通过将螺纹攻丝到开口中从开口中去除可焊性材料，从而将开口中的支架的下面的底层金属暴露出来。 在连接到诸如印刷电路板的基板时，间隔可能暴露于熔融焊料。 在支座的外表面上的气溶胶涂层可能会吸引熔融焊料，而螺纹孔中的阻焊基体金属可能有助于防止焊料污染开口中的螺纹。
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