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1.发明授权Semiconductor chip connection components with adhesives and methods of making same 有权半导体芯片连接组件与粘合剂及其制造方法公开(公告)号：US06202299B1
公开(公告)日：2001-03-20
申请号：US09209216
申请日：1998-12-11
IPC分类号： H05K334
CPC分类号： H01L24/86 , H01L21/4821 , H01L21/6835 , H01L23/495 , H01L23/4985 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/2919 , H01L2224/81801 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T29/49117 , Y10T29/49121 , Y10T29/49133 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171 , H01L2924/00
摘要： A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
摘要翻译： 半导体芯片连接部件在其底表面上设置有粘合剂，期望地为固体，非粘性状态。 粘合剂可以以覆盖小于所有组分底部表面的图案存在，以便当粘合剂将组分粘合到芯片的顶表面时提供无空隙的界面。 粘合剂期望地通过从芯片本身传递的热量而变成可流动状态。 连接部件可以包括在顶表面下方的迹线区域中具有基底金属条的引线和突出超过顶层边缘的贵金属部分。 可流动的可固化材料封装基体金属部分。 因为贱金属部分理想地没有底切部分，所以在形成部件期间可以以无空隙的方式将其包封。
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2.发明授权Method of mounting a connection component on a semiconductor chip with adhesives 有权用粘合剂将连接部件安装在半导体芯片上的方法
公开(公告)号：US6045655A
公开(公告)日：2000-04-04
申请号：US170906
申请日：1998-10-13
IPC分类号： H01L21/48 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/495 , H01L23/498 , H05K1/14
CPC分类号： H01L24/86 , H01L21/4821 , H01L21/6835 , H01L23/495 , H01L23/4985 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/2919 , H01L2224/81801 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T29/49117 , Y10T29/49121 , Y10T29/49133 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171
摘要： A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
摘要翻译： 半导体芯片连接部件在其底表面上设置有粘合剂，期望地为固体，非粘性状态。 粘合剂可以以覆盖小于所有组分底部表面的图案存在，以便当粘合剂将组分粘合到芯片的顶表面时提供无空隙的界面。 粘合剂期望地通过从芯片本身传递的热量而变成可流动状态。 连接部件可以包括在顶表面下方的迹线区域中具有基底金属条的引线和突出超过顶层边缘的贵金属部分。 可流动的可固化材料封装基体金属部分。 因为贱金属部分理想地没有底切部分，所以在形成部件期间可以以无空隙的方式将其包封。
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公开(公告)号：US5875545A
公开(公告)日：1999-03-02
申请号：US658577
申请日：1996-06-05
IPC分类号： H01L21/48 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/495 , H01L23/498 , H05K13/04 , H05K3/38
CPC分类号： H01L24/86 , H01L21/4821 , H01L21/6835 , H01L23/495 , H01L23/4985 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/2919 , H01L2224/81801 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T29/49117 , Y10T29/49121 , Y10T29/49133 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171
摘要： A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
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4.发明授权Semiconductor chip connection components with adhesives and methods for bonding to the chip 失效半导体芯片连接组件与粘合剂和方法粘合到芯片上
公开(公告)号：US5548091A
公开(公告)日：1996-08-20
申请号：US143080
申请日：1993-10-26
IPC分类号： H01L21/48 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/495 , H01L23/498 , H05K1/14
CPC分类号： H01L24/86 , H01L21/4821 , H01L21/6835 , H01L23/495 , H01L23/4985 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/2919 , H01L2224/81801 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T29/49117 , Y10T29/49121 , Y10T29/49133 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171
摘要： A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
摘要翻译： 半导体芯片连接部件在其底表面上设置有粘合剂，期望地为固体，非粘性状态。 粘合剂可以以覆盖小于所有组分底部表面的图案存在，以便当粘合剂将组分粘合到芯片的顶表面时提供无空隙的界面。 粘合剂期望地通过从芯片本身传递的热量而变成可流动状态。 连接部件可以包括在顶表面下方的迹线区域中具有基底金属条的引线和突出超过顶层边缘的贵金属部分。 可流动的可固化材料封装基体金属部分。 因为贱金属部分理想地没有底切部分，所以在形成部件期间可以以无空隙的方式将其包封。
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