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公开(公告)号：US20120023743A1
公开(公告)日：2012-02-02
申请号：US13270448
申请日：2011-10-11
申请人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
IPC分类号： H01R43/00
CPC分类号： H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
摘要翻译： 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号：US08071893B2
公开(公告)日：2011-12-06
申请号：US12397922
申请日：2009-03-04
申请人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC分类号： H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
摘要翻译： 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号：US08881387B2
公开(公告)日：2014-11-11
申请号：US13270448
申请日：2011-10-11
申请人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC分类号： H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
摘要翻译： 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号：US20120024588A1
公开(公告)日：2012-02-02
申请号：US13270421
申请日：2011-10-11
申请人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
IPC分类号： H05K9/00
CPC分类号： H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
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公开(公告)号：US20100224401A1
公开(公告)日：2010-09-09
申请号：US12397922
申请日：2009-03-04
申请人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
发明人： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC分类号： H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
摘要： This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
摘要翻译： 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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