METHOD OF PATTERING NONMETAL CONDUCTIVE LAYER
    1.
    发明申请
    METHOD OF PATTERING NONMETAL CONDUCTIVE LAYER 审中-公开
    描绘非导电层的方法

    公开(公告)号:US20130280660A1

    公开(公告)日:2013-10-24

    申请号:US13592330

    申请日:2012-08-22

    CPC classification number: B82Y30/00 G03F7/038 G03F7/325 G03F7/40

    Abstract: A method of patterning a nonmetal conductive layer on a circuit board is provided. A nonmetal conductive layer and a negative photoresist layer are sequentially formed on a substrate of a circuit board. Then, the negative photoresist layer is exposed through a patterned photomask and then developed by a developing solution. Next, the nonmetal conductive layer is etched. The remained photoresist layer is finally removed by a non-alkaline stripper solution to obtain a patterned nonmetal layer on the substrate.

    Abstract translation: 提供了一种在电路板上构图非金属导电层的方法。 在电路板的基板上依次形成非金属导电层和负性光致抗蚀剂层。 然后,将负性光致抗蚀剂层通过图案化的光掩模曝光,然后通过显影液显影。 接下来,蚀刻非金属导电层。 最终通过非碱性剥离剂溶液去除残留的光致抗蚀剂层,以在基底上获得图案化的非金属层。

    METHOD FOR MAKING A CONDUCTIVE LAMINATE
    3.
    发明申请
    METHOD FOR MAKING A CONDUCTIVE LAMINATE 审中-公开
    制造导电层压板的方法

    公开(公告)号:US20130045362A1

    公开(公告)日:2013-02-21

    申请号:US13592254

    申请日:2012-08-22

    CPC classification number: G03F7/027 G03F7/203 Y10T428/24355

    Abstract: A method for making a conductive laminate includes: (a) forming a photocurable layer on a substrate, the photocurable layer including at least one photocurable prepolymer that has a plurality of reactive functional groups and that has a functional group equivalent weight ranging from 70 to 700 g/mol; (b) covering partially the photocurable layer using a patterned mask; (c) exposing the photocurable layer through the patterned mask using a first light source; (d) removing the patterned mask; (e) exposing the photocurable layer to a second light source to cure second regions of the photocurable layer which have not been cured, so as to form a microstructure; and (f) forming a conductive layer on the microstructure.

    Abstract translation: 制造导电性层叠体的方法包括:(a)在基材上形成光固化层,所述光固化层包含至少一种具有多个反应性官能团并具有70〜700的官能团当量的光固化性预聚物 g / mol; (b)使用图案化掩模部分地覆盖光固化层; (c)使用第一光源将可光固化层曝光通过图案化掩模; (d)去除图案化掩模; (e)将光固化层暴露于第二光源以固化未固化的光固化层的第二区域,以形成微结构; 和(f)在微结构上形成导电层。

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