公开(公告)号：US20130284893A1

公开(公告)日：2013-10-31

申请号：US13979539

申请日：2011-12-07

申请人： Ryuji Kyushima ,  Kazuki Fujita ,  Harumichi Mori

发明人： Ryuji Kyushima ,  Kazuki Fujita ,  Harumichi Mori

IPC分类号： H04N5/378

CPC分类号： H04N5/378 ,  H01L27/14645 ,  H01L27/14658 ,  H04N5/32 ,  H04N5/343 ,  H04N5/3742

摘要： A controlling section, by bringing readout switches of pixels of a certain row out of the M rows into a connected state, causes charges generated in the row to be input to integration circuits, causes first holding circuits to hold voltage values output from the integration circuits, and then brings transfer switches into a connected state to transfer the voltage values to the second holding circuits, and thereafter performs in parallel an operation for causing the voltage values to be sequentially output from the second holding circuits and an operation for, by bringing readout switches of pixels of another row into a connected state, causing charges generated in the row to be input to the integration circuits. Accordingly, a solid-state imaging device and a driving method thereof capable of suppressing variations in output characteristics, while solving the problem due to a delay effect are realized.

摘要翻译： 控制部通过将M行以外的某行的像素的读出开关导入到连接状态，使得在行中产生的电荷被输入到积分电路，使得第一保持电路保持从积分电路输出的电压值 ，然后使转移开关进入连接状态，将电压值传送到第二保持电路，然后并行执行使得从第二保持电路顺序地输出电压值的操作和通过读出的操作 将另一行的像素的开关转换为连接状态，使得在行中产生的电荷被输入到积分电路。 因此，实现了能够在解决由于延迟效果引起的问题的同时抑制输出特性的变化的固态成像装置及其驱动方法。

公开(公告)号：US08477907B2

公开(公告)日：2013-07-02

申请号：US12989132

申请日：2009-04-22

申请人： Ryuji Kyushima ,  Kazuki Fujita ,  Harumichi Mori

发明人： Ryuji Kyushima ,  Kazuki Fujita ,  Harumichi Mori

IPC分类号： H05G1/64

CPC分类号： H01L27/14609 ,  A61B6/032 ,  H04N5/23245 ,  H04N5/32 ,  H04N5/343 ,  H04N5/3454 ,  H04N5/3745

摘要： A solid-state image pickup apparatus 1A includes a photodetecting section 10A, a signal readout section 20, and a controlling section 40A. In the photodetecting section 10A, M×N pixel units P1,1 to PM,N each including a photodiode and a readout switch are arrayed in M rows and N columns. Charges generated in each pixel unit Pm,n are input to an integrating circuit Sn through a readout wiring LO,n, and a voltage value output from the integrating circuit Sn in response to the charge amount is output through a holding circuits Hn. When in a first imaging mode, a voltage value according to an amount of charges generated in the photodiode PD of each of the M×N pixel units P1,1 to PM,N in the photodetecting section 10A is output from the signal readout section 20. When in a second imaging mode, a voltage value according to an amount of charges generated in the photodiode PD of each pixel unit Pm,n included in consecutive M1 rows in the photodetecting section 10A is output from the signal readout section 20.

摘要翻译： 固态图像拾取装置1A包括光电检测部分10A，信号读出部分20和控制部分40A。 在受光部10A中，分别包含光电二极管和读出用开关的M×N个像素部P1,1〜PM，N排列成M行N列。 每个像素单元Pm，n中产生的电荷通过读出配线LO，n输入到积分电路Sn，并且响应于充电量从积分电路Sn输出的电压值通过保持电路Hn输出。 当处于第一成像模式时，从信号读出部分20输出根据在光电检测部分10A中的M×N个像素单元P1,1至PM，N中的每一个的光电二极管PD中产生的电荷量的电压值 当在第二成像模式中，从信号读出部20输出根据在受光部10A中连续的M1行中包含的各像素部Pm，n的光电二极管PD中产生的电荷量的电压值。

公开(公告)号：US08368028B2

公开(公告)日：2013-02-05

申请号：US12999188

申请日：2009-06-11

申请人： Harumichi Mori ,  Ryuji Kyushima ,  Kazuki Fujita

发明人： Harumichi Mori ,  Ryuji Kyushima ,  Kazuki Fujita

IPC分类号： G01T1/24

CPC分类号： H04N5/3694 ,  A61B6/06 ,  A61B6/14 ,  A61B6/4233 ,  G01T1/2018 ,  H01L27/14663 ,  H04N5/32 ,  H04N5/3743 ,  H04N5/378

摘要： A solid-state image pickup device 1 includes a semiconductor substrate 3A having a pixel array 10A with pixels arrayed in M rows and NA columns, a semiconductor substrate 3B having a pixel array 10B with pixels arrayed in M rows and NB columns, and a first column of which is arranged along an NA-th column of the pixel array 10A, and a signal output section 20. The signal output section 20 outputs digital values corresponding to the respective columns from the first column to the n-th column (2≦n

摘要翻译： 固态摄像装置1包括具有像素阵列10A的半导体衬底3A，像素阵列10A排列成M行和NA列，像素阵列10B具有排列成M行和NB列的像素的半导体衬底3B，以及第一 其列被设置在像素阵列10A的第NA列和信号输出部20之间。信号输出部20输出与从第一列到第n列（2＆amp; nlE; 像素阵列10A的n

公开(公告)号：US08189084B2

公开(公告)日：2012-05-29

申请号：US12676282

申请日：2008-09-03

申请人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

发明人： Ryuji Kyushima ,  Harumichi Mori ,  Junichi Sawada ,  Kazuki Fujita ,  Masahiko Honda

IPC分类号： H04N5/335

CPC分类号： H04N5/3653 ,  H04N5/32 ,  H04N5/359 ,  H04N5/367

摘要： A solid state imaging device 1 includes a photodetecting section 10, a signal readout section 20, a controlling section 30, and a correction processing section 40. In the photodetecting section 10, M×N pixel portions each including a photodiode which generates charges as much as an incident light intensity and a readout switch connected to the photodiode are two-dimensionally arrayed in M rows and N columns. Charges generated in each pixel portion Pm,n are input into an integration circuit Sn through a readout wiring LO,n, and a voltage value output corresponding to the charge amount from the integration circuit Sn is output to an output wiring Lout through a holding circuit Hn. In the correction processing section 40, correction processing is performed for frame data repeatedly output from the signal readout section 20, and frame data after being subjected to the correction processing is output.

摘要翻译： 固态成像装置1包括光电检测部10，信号读出部20，控制部30和校正处理部40.在受光部10中，M×N个像素部分，每个像素部分包括产生电荷的光电二极管 连接到光电二极管的入射光强度和读出开关二维排列成M行N列。 每个像素部分Pm，n中产生的电荷通过读出配线LO，n输入到积分电路Sn中，并且与积分电路Sn的电荷量对应的电压值输出通过保持电路输出到输出布线Lout 嗯。 在校正处理部40中，对从信号读出部20重复输出的帧数据进行校正处理，输出经过校正处理后的帧数据。

公开(公告)号：US20110303823A1

公开(公告)日：2011-12-15

申请号：US13202995

申请日：2010-03-26

申请人： Harumichi Mori ,  Ryuji Kyushima ,  Kazuki Fujita

发明人： Harumichi Mori ,  Ryuji Kyushima ,  Kazuki Fujita

IPC分类号： H01L27/146

CPC分类号： H04N5/378 ,  A61B6/00 ,  A61B6/14 ,  A61B6/4233 ,  H01L27/14607 ,  H01L27/14643 ,  H01L27/14658 ,  H01L27/14806 ,  H04N5/32 ,  H04N5/3742

摘要： A solid-state imaging device of one embodiment includes a light receiving section including of a plurality of pixels 11 having respective photodiodes, the pixels being two-dimensionally arrayed in M rows and N columns; N readout lines disposed for the respective columns and connected with the photodiodes PD included in the pixels of a respective columns via readout switches; a signal output section for outputting a voltage value according to an amount of charge input through each of the readout lines; and a vertical shift register for controlling an opening and closing operation of the readout switch for each of the rows. A contour between one side along a row direction of the light receiving section and a pair of sides along a column direction has a stepped shape. A dummy photodiode region is formed along the stepped contour of the light receiving section.

摘要翻译： 一个实施例的固态成像装置包括光接收部分，其包括具有各自的光电二极管的多个像素11，所述像素被二维排列成M行N列; N个读出线被设置用于各列，并且经由读取开关与包括在各列的像素中的光电二极管PD连接; 信号输出部分，用于根据通过每条读出线输入的电荷量输出电压值; 以及垂直移位寄存器，用于控制每行的读出开关的打开和关闭操作。 沿着光接收部分的行方向的一侧和沿着列方向的一对侧面之间的轮廓具有台阶形状。 沿着光接收部分的台阶轮廓形成虚拟光电二极管区域。

公开(公告)号：US20110135057A1

公开(公告)日：2011-06-09

申请号：US12999188

申请日：2009-06-11

申请人： Harumichi Mori ,  Ryuji Kyushima ,  Kazuki Fujita

发明人： Harumichi Mori ,  Ryuji Kyushima ,  Kazuki Fujita

IPC分类号： G01N23/04

CPC分类号： H04N5/3694 ,  A61B6/06 ,  A61B6/14 ,  A61B6/4233 ,  G01T1/2018 ,  H01L27/14663 ,  H04N5/32 ,  H04N5/3743 ,  H04N5/378

摘要： A solid-state image pickup device 1 includes a semiconductor substrate 3A having a pixel array 10A with pixels arrayed in M rows and NA columns, a semiconductor substrate 3B having a pixel array 10B with pixels arrayed in M rows and NB columns, and a first column of which is arranged along an NA-th column of the pixel array 10A, and a signal output section 20. The signal output section 20 outputs digital values corresponding to the respective columns from the first column to the n-th column (2≦n

摘要翻译： 固态摄像装置1包括具有像素阵列10A的半导体衬底3A，像素阵列10A排列成M行和NA列，像素阵列10B具有排列成M行和NB列的像素的半导体衬底3B，以及第一 其列被设置在像素阵列10A的第NA列和信号输出部20之间。信号输出部20输出与从第一列到第n列（2＆amp; nlE; 像素阵列10A的n

公开(公告)号：US07863576B2

公开(公告)日：2011-01-04

申请号：US12465006

申请日：2009-05-13

申请人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

发明人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

IPC分类号： G01T1/20

摘要： Wiring substrates 11 and 12 are positioned on a fixed base 10 in a manner such that there is a step between the wiring substrates, and radiation imaging elements 2 and 3, respectively having scintillators 25 and 35 deposited on photosensitive portions 21 and 31, are respectively mounted on the wiring substrates 11 and 12. The radiation imaging element 2 is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element 3, and the photosensitive portion 21 of the radiation imaging element 2 and the photosensitive portion 31 of the radiation imaging element 3 are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion 21 of the radiation imaging element 2 extends close to an edge at the radiation imaging element 3 side and the scintillator 25 of substantially uniform thickness is formed up to this position.

公开(公告)号：US07834323B2

公开(公告)日：2010-11-16

申请号：US11596071

申请日：2005-05-10

申请人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

发明人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

IPC分类号： G01T1/20

CPC分类号： H01L27/14618 ,  G01T1/2018 ,  H01L31/0203 ,  H01L31/02322 ,  H01L2924/0002 ,  H04N5/32 ,  H01L2924/00

摘要： Wiring substrates 11 and 12 are positioned on a fixed base 10 in a manner such that there is a step between the wiring substrates, and radiation imaging elements 2 and 3, respectively having scintillators 25 and 35 deposited on photosensitive portions 21 and 31, are respectively mounted on the wiring substrates 11 and 12. The radiation imaging element 2 is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element 3, and the photosensitive portion 21 of the radiation imaging element 2 and the photosensitive portion 31 of the radiation imaging element 3 are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion 21 of the radiation imaging element 2 extends close to an edge at the radiation imaging element 3 side and the scintillator 25 of substantially uniform thickness is formed up to this position.

摘要翻译： 接线基板11和12以分别在布线基板之间形成的台阶和分别具有沉积在感光部21和31上的闪烁体25和35的辐射摄像元件2和3分别位于固定基座10上的方式 安装在布线基板11和12上。放射线成像元件2被定位成使得其设置表面突出超过辐射成像元件3的辐射入射表面，并且辐射成像元件2的感光部分21和感光部分31 放射线成像元件3的一部分并置于该部分不重叠的程度。 辐射摄像元件2的感光部分21靠近辐射摄像元件3侧的边缘延伸，并且形成基本均匀厚度的闪烁器25直至该位置。

公开(公告)号：US07728303B2

公开(公告)日：2010-06-01

申请号：US12465003

申请日：2009-05-13

申请人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

发明人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

IPC分类号： G01T1/20

CPC分类号： H01L27/14618 ,  G01T1/2018 ,  H01L31/0203 ,  H01L31/02322 ,  H01L2924/0002 ,  H04N5/32 ,  H01L2924/00

摘要： Wiring substrates 11 and 12 are positioned on a fixed base 10 in a manner such that there is a step between the wiring substrates, and radiation imaging elements 2 and 3, respectively having scintillators 25 and 35 deposited on photosensitive portions 21 and 31, are respectively mounted on the wiring substrates 11 and 12. The radiation imaging element 2 is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element 3, and the photosensitive portion 21 of the radiation imaging element 2 and the photosensitive portion 31 of the radiation imaging element 3 are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion 21 of the radiation imaging element 2 extends close to an edge at the radiation imaging element 3 side and the scintillator 25 of substantially uniform thickness is formed up to this position.

公开(公告)号：US20090224166A1

公开(公告)日：2009-09-10

申请号：US12465006

申请日：2009-05-13

申请人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

发明人： Harumichi Mori ,  Masahiko Honda ,  Ryuji Kyushima ,  Kazuki Fujita

IPC分类号： G01T1/20 ,  G01N23/04 ,  B32B7/14

CPC分类号： H01L27/14618 ,  G01T1/2018 ,  H01L31/0203 ,  H01L31/02322 ,  H01L2924/0002 ,  H04N5/32 ,  H01L2924/00

摘要： Wiring substrates 11 and 12 are positioned on a fixed base 10 in a manner such that there is a step between the wiring substrates, and radiation imaging elements 2 and 3, respectively having scintillators 25 and 35 deposited on photosensitive portions 21 and 31, are respectively mounted on the wiring substrates 11 and 12. The radiation imaging element 2 is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element 3, and the photosensitive portion 21 of the radiation imaging element 2 and the photosensitive portion 31 of the radiation imaging element 3 are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion 21 of the radiation imaging element 2 extends close to an edge at the radiation imaging element 3 side and the scintillator 25 of substantially uniform thickness is formed up to this position.

摘要翻译： 接线基板11和12以分别在布线基板之间形成的台阶和分别具有沉积在感光部21和31上的闪烁体25和35的辐射摄像元件2和3分别位于固定基座10上的方式 安装在布线基板11和12上。放射线成像元件2被定位成使得其设置表面突出超过辐射成像元件3的辐射入射表面，并且辐射成像元件2的感光部分21和感光部分31 放射线成像元件3的一部分并置于该部分不重叠的程度。 辐射摄像元件2的感光部分21靠近辐射摄像元件3侧的边缘延伸，并且形成基本均匀厚度的闪烁器25直至该位置。