公开(公告)号：US06295977B1

公开(公告)日：2001-10-02

申请号：US09434582

申请日：1999-11-04

申请人： Bert Ripper ,  Christian Andrae ,  Karl Egglhuber ,  Holger Lundt ,  Helmut Kölker ,  Jochen Greim

发明人： Bert Ripper ,  Christian Andrae ,  Karl Egglhuber ,  Holger Lundt ,  Helmut Kölker ,  Jochen Greim

IPC分类号： B28D106

CPC分类号： B23D57/0061 ,  B23D57/0046 ,  B28D5/0082 ,  B28D5/045

摘要： A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a translational relative movement, directed perpendicular to the longitudinal axis, between the workpiece and a wire web of a wire saw with the aid of a feed device, through the wire web which is formed by a sawing wire. The workpiece is rotated about the longitudinal axis while the wafers are being cut off. There is also a wire saw which is suitable for carrying out the method and has a device for holding and for rotating the workpiece about the longitudinal axis.

摘要翻译： 一种方法是同时从具有纵向轴线和外围表面的硬的脆性工件切断多个晶片。 通过平行相对运动，通过平行相对运动，通过平行相对运动，通过由卷绕线形成的线材，借助于进给装置，在垂直于纵向轴线的工件和线锯的线材卷材之间引导工件， 。 当晶片被切断时，工件围绕纵向轴线旋转。 还有一种适用于执行该方法的线锯，并且具有用于保持和围绕纵向轴线旋转工件的装置。