公开(公告)号：US06439987B1

公开(公告)日：2002-08-27

申请号：US09602397

申请日：2000-06-23

申请人： Bert Ripper ,  Hubert Grubmüller

发明人： Bert Ripper ,  Hubert Grubmüller

IPC分类号： B24B1900

CPC分类号： B24B37/16 ,  B24B37/26 ,  B24B53/017 ,  B24D7/06 ,  B24D7/10

摘要： A tool and method are provided for the abrasive machining of a substantially planar surface. The tool has a base body and a plurality of elements which are mounted on the base body and form a planar coating which is used as a working coating during machining of the surface.

摘要翻译： 提供了一种用于对基本平坦的表面进行磨削加工的工具和方法。 工具具有基体和多个元件，其安装在基体上并形成平面涂层，该表面在加工表面期间用作工作涂层。

公开(公告)号：US06295977B1

公开(公告)日：2001-10-02

申请号：US09434582

申请日：1999-11-04

申请人： Bert Ripper ,  Christian Andrae ,  Karl Egglhuber ,  Holger Lundt ,  Helmut Kölker ,  Jochen Greim

发明人： Bert Ripper ,  Christian Andrae ,  Karl Egglhuber ,  Holger Lundt ,  Helmut Kölker ,  Jochen Greim

IPC分类号： B28D106

CPC分类号： B23D57/0061 ,  B23D57/0046 ,  B28D5/0082 ,  B28D5/045

摘要： A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a translational relative movement, directed perpendicular to the longitudinal axis, between the workpiece and a wire web of a wire saw with the aid of a feed device, through the wire web which is formed by a sawing wire. The workpiece is rotated about the longitudinal axis while the wafers are being cut off. There is also a wire saw which is suitable for carrying out the method and has a device for holding and for rotating the workpiece about the longitudinal axis.

摘要翻译： 一种方法是同时从具有纵向轴线和外围表面的硬的脆性工件切断多个晶片。 通过平行相对运动，通过平行相对运动，通过平行相对运动，通过由卷绕线形成的线材，借助于进给装置，在垂直于纵向轴线的工件和线锯的线材卷材之间引导工件， 。 当晶片被切断时，工件围绕纵向轴线旋转。 还有一种适用于执行该方法的线锯，并且具有用于保持和围绕纵向轴线旋转工件的装置。

公开(公告)号：US6129609A

公开(公告)日：2000-10-10

申请号：US185328

申请日：1998-11-03

申请人： Bert Ripper ,  Robert Hofmann ,  Peter Lehfeld ,  Holger Lundt

发明人： Bert Ripper ,  Robert Hofmann ,  Peter Lehfeld ,  Holger Lundt

IPC分类号： B24B49/00 ,  B24D13/14 ,  H01L21/304 ,  H01L21/306

CPC分类号： B24B37/08 ,  B24B37/26 ,  B24B49/00 ,  H01L21/30625

摘要： Material removing machining is for wafer shaped workpieces, in particular semiconductor wafers. There is a method for achieving a wear performance which is as linear as possible for a tool which has an essentially planar working surface for the material removing machining of wafer shaped workpieces. The tool has a wear performance which is as linear as possible. There are also a method and a device for measuring a wear profile on an essentially planar working surface for the material removing machining of wafer shaped workpieces. There is also a carrier which is used for the two-sided material removing machining of wafer shaped workpieces.

摘要翻译： 材料去除加工用于晶圆形工件，特别是半导体晶片。 有一种实现磨损性能的方法，该磨损性能对于具有基本上平面的工作表面的工具是尽可能的线性，用于材料去除机加工晶圆形工件。 该工具具有尽可能线性的磨损性能。 还有一种用于测量在基本上平面的工作表面上的磨损轮廓的方法和装置，用于去除晶片形工件的加工。 还有一种用于晶圆形工件的双面材料去除加工的载体。