公开(公告)号：US06667239B2

公开(公告)日：2003-12-23

申请号：US10057477

申请日：2002-01-23

申请人： Nanaji Saka ,  Jiun-Yu Lai ,  Hilario L. Oh

发明人： Nanaji Saka ,  Jiun-Yu Lai ,  Hilario L. Oh

IPC分类号： H01L21461

CPC分类号： B24B49/006 ,  B24B37/042 ,  B24B49/16 ,  H01L21/3212

摘要： A method of chemical mechanical polishing of a metal damascene structure which includes an insulation layer having trenches on a wafer and a metal layer having a lower portion located in trenches of the insulation layer and an upper portion overlying the lower portion and the insulation layer is provided. The method comprises a first step of planarizing the upper portion of the metal layer and a second step of polishing the insulation layer and the lower portion of the metal layer. In the first step of planarizing the upper portion of the metal layer, the wafer and a polishing pad is urged at an applied pressure p and a relative velocity v in a contact mode between the wafer and the polishing pad to promote an increased metal removal rate. In the second, the insulation layer and the lower portion of the metal layer are polished in a steady-state mode to form individual metal lines in the trenches with minimal dishing of the metal lines and overpolishing of the insulation layer.

公开(公告)号：US08086473B2

公开(公告)日：2011-12-27

申请号：US12408091

申请日：2009-03-20

申请人： Hilario L. Oh

发明人： Hilario L. Oh

IPC分类号： G06Q50/00

CPC分类号： G06Q10/06316 ,  G06F19/00 ,  G06Q10/06 ,  G06Q50/22 ,  G06Q50/24 ,  G16H40/20

摘要： A method and system for managing healthcare delivery is presented. The method includes receiving data related to patients and the patients' scheduled procedures. Based on the data, a queue is generated for screening the patients. The patients are screened in accordance with the screening queue. Once screened, data related to tracking the patients is obtained. The tracking data is used to generate a tracking queue. The patients are tracked in relation to the tracking queue.

摘要翻译： 介绍了一种用于管理医疗保健服务的方法和系统。 该方法包括接收与患者相关的数据和患者的预定程序。 根据数据，生成队列以筛选病人。 病人按照筛查队列筛查。 一旦筛选，获得与跟踪患者有关的数据。 跟踪数据用于生成跟踪队列。 跟踪队列跟踪患者。

公开(公告)号：US07139631B2

公开(公告)日：2006-11-21

申请号：US10800369

申请日：2004-03-11

申请人： Hilario L. Oh

发明人： Hilario L. Oh

IPC分类号： G06F19/00

CPC分类号： H01L21/67294 ,  G05B19/41865 ,  G05B2219/32048 ,  G05B2219/45031 ,  H01L21/67276 ,  Y02P90/20

摘要： A semiconductor wafer fabrication system that includes at least a track system and a scanner system compensates for deviations from nominal periodicity in the scanner system by dynamically introducing time delays when such deviations are detected. Preferably prior art static wait states are also introduced into the wafer recipe to reduce probability of resource conflicts. The resultant semiconductor wafer fabrication system can enjoy enhanced wafer throughput in that synchronization of wafer flow is maintained, despite such deviations.

摘要翻译： 包括至少轨道系统和扫描仪系统的半导体晶片制造系统通过在检测到这种偏差时动态地引入时间延迟来补偿扫描器系统中的标称周期的偏差。 优选地，现有技术的静态等待状态也被引入到晶片配方中以减少资源冲突的概率。 所得到的半导体晶片制造系统可以享受增强的晶片生产量，因为尽管存在这样的偏差，仍保持了晶片流的同步。

公开(公告)号：US07029381B2

公开(公告)日：2006-04-18

申请号：US10029158

申请日：2001-12-21

申请人： Jason Melvin ,  Nam P. Suh ,  Hilario L. Oh

发明人： Jason Melvin ,  Nam P. Suh ,  Hilario L. Oh

IPC分类号： B24B5/00

CPC分类号： B24B37/32

摘要： A chemical mechanical polishing system having a wafer carrier assembly is provided. The wafer carrier assembly includes a wafer carrier support frame, a wafer carrier head housing rotable mounted on the wafer carrier support frame, with a base including a bladder bellows operating connecting the wafer carrier base to the wafer carrier head housing such that rotational torque is transferred from the wafer carrier head housing to the wafer carrier base. Further provided is a retaining ring, operatively connected to a retaining ring bearing which allows relative axial motion while constraining relative radial motion between the retaining ring and the wafer carrier head housing; and a retaining ring bellows, operatively connecting the retaining ring bearing to urge the retaining ring against a polishing member. A chamber formed by the bladder bellows, the wafer carrier base and the wafer carrier head housing may be pressurized to load the wafer carrier base against a polishing member, independent of any frictional loads on the retaining ring.

公开(公告)号：US06476921B1

公开(公告)日：2002-11-05

申请号：US09628471

申请日：2000-07-31

申请人： Nannaji Saka ,  Jamie Nam ,  Hilario L. Oh

发明人： Nannaji Saka ,  Jamie Nam ,  Hilario L. Oh

IPC分类号： G01B1114

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/12

摘要： A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.

摘要翻译： 提供了一种用于在化学机械抛光（CMP）期间提供在半导体晶片或衬底上的局部区域中去除材料的原位监测的方法和装置。 特别地，本发明的方法和装置提供了检测在晶片表面的某些局部区域或区域内的不同材料之间的反射率的差异。 反射率的差异用于指示每个特定局部区域中物质去除的速率或进展。

公开(公告)号：US4424706A

公开(公告)日：1984-01-10

申请号：US379643

申请日：1982-05-19

申请人： Hilario L. Oh

发明人： Hilario L. Oh

IPC分类号： F02P5/152 ,  G01L23/22

CPC分类号： F02P5/152 ,  G01L23/225 ,  Y02T10/46

摘要： An engine subject to knock induced vibrations of at least two characteristic knock frequencies and noise vibrations processes the output of a vibration sensor in, for example, a square law device to generate a product component only when vibrations occur simultaneously at both characteristic knock frequencies. The amplitude of the product component is proportional to the product of the amplitudes of the two characteristic knock frequency components for an improved signal to noise ratio; and the frequency of the product component is equal to the difference of the characteristic knock frequencies. A band pass filter passes the product component to further signal processing apparatus including a comparator which generates a knock signal when the amplitude exceeds a reference. The knock signal may be used in a closed loop system to control knock in the engine.

摘要翻译： 经受至少两个特征爆震频率和噪声振动的爆震诱发振动的发动机，在仅在振动在两个特征爆震频率处同时发生振动时，将振动传感器的输出处理在例如平方律装置中以产生产物分量。 产品分量的振幅与两个特征爆震频率分量的振幅的乘积成正比，以提高信噪比; 并且产品组件的频率等于特征爆震频率的差异。 带通滤波器将产品组件传递到另外的信号处理装置，该装置包括当振幅超过参考值时产生爆震信号的比较器。 爆震信号可用于闭环系统以控制发动机的爆震。

公开(公告)号：US20100241452A1

公开(公告)日：2010-09-23

申请号：US12408091

申请日：2009-03-20

申请人： Hilario L. Oh

发明人： Hilario L. Oh

IPC分类号： G06Q50/00 ,  G06Q10/00

CPC分类号： G06Q10/06316 ,  G06F19/00 ,  G06Q10/06 ,  G06Q50/22 ,  G06Q50/24 ,  G16H40/20

摘要： A method and system for managing healthcare delivery is presented. The method includes receiving data related to patients and the patients' scheduled procedures. Based on the data, a queue is generated for screening the patients. The patients are screened in accordance with the screening queue. Once screened, data related to tracking the patients is obtained. The tracking data is used to generate a tracking queue. The patients are tracked in relation to the tracking queue.

摘要翻译： 介绍了一种用于管理医疗保健服务的方法和系统。 该方法包括接收与患者相关的数据和患者的预定程序。 根据数据，生成队列以筛选病人。 病人按照筛查队列筛查。 一旦筛选，获得与跟踪患者有关的数据。 跟踪数据用于生成跟踪队列。 跟踪队列跟踪患者。

公开(公告)号：US06798529B2

公开(公告)日：2004-09-28

申请号：US10029080

申请日：2001-12-21

申请人： Nannaji Saka ,  Jamie Nam ,  Hilario L. Oh

发明人： Nannaji Saka ,  Jamie Nam ,  Hilario L. Oh

IPC分类号： G01B1114

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/12

摘要： A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.

摘要翻译： 提供了一种用于在化学机械抛光（CMP）期间提供在半导体晶片或衬底上的局部区域中去除材料的原位监测的方法和装置。 特别地，本发明的方法和装置提供了检测在晶片表面的某些局部区域或区域内的不同材料之间的反射率的差异。 反射率的差异用于指示每个特定局部区域中物质去除的速率或进展。

公开(公告)号：US06458013B1

公开(公告)日：2002-10-01

申请号：US09628962

申请日：2000-07-31

申请人： Nannaji Saka ,  Jiun-Yu Lai ,  Hilario L. Oh

发明人： Nannaji Saka ,  Jiun-Yu Lai ,  Hilario L. Oh

IPC分类号： B24B4914

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/16

摘要： In the Chemical Mechanical Polishing (CMP) process employed for microelectronics manufacturing, three contact regimes between the wafer surface and the polishing pad may be proposed: direct contact, mixed or partial contact, and hydroplaning. However, an effective in situ method for characterizing the wafer/pad contact and a systematic way of relating contact conditions to the process parameters are still lacking. In this work, the interfacial friction force, measured by a load sensor on the wafer carrier, has been employed to characterize the contact conditions. Models that relate the friction coefficient to the applied pressure, relative velocity, and slurry viscosity are developed and verified by experiments. Additionally, a correlation between friction coefficient and the material removal rate (MR) is established and the effects of process parameters on the Preston constant are investigated.

摘要翻译： 在用于微电子制造的化学机械抛光（CMP）工艺中，晶片表面和抛光垫之间的三种接触方式可以被提出：直接接触，混合或部分接触和滑水。 然而，仍然缺乏用于表征晶片/焊盘触点的有效原位方法以及将接触条件与过程参数相关联的系统方式。 在这项工作中，已经采用由晶片载体上的载荷传感器测量的界面摩擦力来表征接触条件。 通过实验开发和验证了摩擦系数与施加的压力，相对速度和浆料粘度相关的模型。 另外，建立了摩擦系数与材料去除率（MR）之间的相关性，并研究了工艺参数对Preston常数的影响。

公开(公告)号：US06984168B1

公开(公告)日：2006-01-10

申请号：US09628563

申请日：2000-07-31

申请人： Jason Melvin ,  Nam P. Suh ,  Hilario L. Oh

发明人： Jason Melvin ,  Nam P. Suh ,  Hilario L. Oh

IPC分类号： B24B29/00 ,  B24B5/00

CPC分类号： B29C45/1773

摘要： A chemical mechanical polishing system having a wafer carrier assembly is provided. The wafer carrier assembly includes a wafer carrier support frame, a wafer carrier head housing rotable mounted on the wafer carrier support frame, with a base including a bladder bellows operating connecting the wafer carrier base to the wafer carrier head housing such that rotational torque is transferred from the wafer carrier head housing to the wafer carrier base. Further provided is a retaining ring, operatively connected to a retaining ring bearing which allows relative axial motion while constraining relative radial motion between the retaining ring and the wafer carrier head housing; and a retaining ring bellows, operatively connecting the retaining ring bearing to urge the retaining ring against a polishing member. A chamber formed by the bladder bellows, the wafer carrier base and the wafer carrier head housing may be pressurized to load the wafer carrier base against a polishing member, independent of any frictional loads on the retaining ring.