公开(公告)号：US20080128383A1

公开(公告)日：2008-06-05

申请号：US11970400

申请日：2008-01-07

申请人： Hiroki Tamano

发明人： Hiroki Tamano

IPC分类号： H01B13/00

CPC分类号： H05K3/0085 ,  H05K1/0393 ,  H05K3/068 ,  H05K2203/0746 ,  H05K2203/1545

摘要： An etching apparatus for forming conductor patterns by etching a wiring board is provided. The etching apparatus includes a drum, a chamber and a nozzle head. The drum is configured to run a flexible wiring board under rotation while turning it around a drum face. The chamber is a chamber for storing an etching liquid under a constant pressure. The nozzle head is arranged at a position in the vicinity of the drum face in an upper portion of the chamber. The etching liquid pressurized in the chamber is linearly ejected onto the drum face through the nozzle holes.

摘要翻译： 提供了通过蚀刻布线板形成导体图案的蚀刻装置。 蚀刻装置包括鼓，腔室和喷嘴头。 滚筒被配置成使旋转的柔性布线板在滚筒周围转动。 该室是用于在恒定压力下存储蚀刻液体的室。 喷嘴头布置在室的上部中的鼓面附近的位置。 在腔室中加压的蚀刻液通过喷嘴孔线性地喷射到鼓面上。