-
公开(公告)号：US20050205989A1
公开(公告)日：2005-09-22
申请号：US11069293
申请日：2005-03-01
申请人： Akihiro Shibuya , Motoyuki Furukawa , Mikio Naruse , Atsushi Ehira , Kazuhiro Ogawa , Hirotoshi Oota , Kazuyoshi Abe , Atsushi Ikezawa , Toru Kakehi
发明人： Akihiro Shibuya , Motoyuki Furukawa , Mikio Naruse , Atsushi Ehira , Kazuhiro Ogawa , Hirotoshi Oota , Kazuyoshi Abe , Atsushi Ikezawa , Toru Kakehi
CPC分类号： H01L23/3737 , C09K5/14 , H01L23/3735 , H01L24/29 , H01L24/32 , H01L25/072 , H01L2224/32013
摘要： A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.
摘要翻译： 一种散热组件，其中发热体和散热器通过电绝缘和导热片整合，其中至少一个表面涂有导热油脂，其中导热油脂与电绝缘材料不相容 和导热片。 在诸如半导体器件等的发热体的热量可以被有效地消散，同时长时间保持电绝缘状态。
-
公开(公告)号：US07081670B2
公开(公告)日：2006-07-25
申请号：US10914282
申请日：2004-08-10
申请人： Akihiro Shibuya , Motoyuki Furukawa , Mikio Naruse , Atsushi Ehira , Kazuhiro Ogawa , Hirotoshi Oota , Kazuyoshi Abe
发明人： Akihiro Shibuya , Motoyuki Furukawa , Mikio Naruse , Atsushi Ehira , Kazuhiro Ogawa , Hirotoshi Oota , Kazuyoshi Abe
CPC分类号： H01L23/4006 , H01L23/3737 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An insulation sheet is formed by a heat conductive filler of an amount of 70–93 mass % in an organopolysiloxane base material. The content of conductive impurities in the insulation sheet is 500 ppm or less. The insulation sheet according to one embodiment is interposed between a semiconductor device and a heat sink.
摘要翻译： 在有机聚硅氧烷基材中，由70〜93质量％的导热性填料形成绝缘片。 绝缘片中的导电性杂质的含量为500ppm以下。 根据一个实施例的绝缘片介于半导体器件和散热器之间。
-
公开(公告)号：US07196413B2
公开(公告)日：2007-03-27
申请号：US11069293
申请日：2005-03-01
申请人： Akihiro Shibuya , Motoyuki Furukawa , Mikio Naruse , Atsushi Ehira , Kazuhiro Ogawa , Hirotoshi Oota , Kazuyoshi Abe , Atsushi Ikezawa , Toru Kakehi
发明人： Akihiro Shibuya , Motoyuki Furukawa , Mikio Naruse , Atsushi Ehira , Kazuhiro Ogawa , Hirotoshi Oota , Kazuyoshi Abe , Atsushi Ikezawa , Toru Kakehi
CPC分类号： H01L23/3737 , C09K5/14 , H01L23/3735 , H01L24/29 , H01L24/32 , H01L25/072 , H01L2224/32013
摘要： A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.
摘要翻译： 一种散热组件，其中发热体和散热器通过电绝缘和导热片整合，其中至少一个表面涂有导热油脂，其中导热油脂与电绝缘材料不相容 和导热片。 在诸如半导体器件等的发热体的热量可以被有效地消散，同时长时间保持电绝缘状态。
-
公开(公告)号：US20050035438A1
公开(公告)日：2005-02-17
申请号：US10914282
申请日：2004-08-10
申请人： Akihiro Shibuya , Motoyuki Furukawa , Mikio Naruse , Atsushi Ehira , Kazuhiro Ogawa , Hirotoshi Oota , Kazuyoshi Abe
发明人： Akihiro Shibuya , Motoyuki Furukawa , Mikio Naruse , Atsushi Ehira , Kazuhiro Ogawa , Hirotoshi Oota , Kazuyoshi Abe
IPC分类号： H01L23/36 , H01L23/373 , H01L23/40 , H01L23/473 , H01L23/02
CPC分类号： H01L23/4006 , H01L23/3737 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An insulation sheet is formed by a heat conductive filler of an amount of 70-93 mass % in an organopolysiloxane base material. The content of conductive impurities in the insulation sheet is 500 ppm or less. The insulation sheet according to one embodiment is interposed between a semiconductor device and a heat sink.
摘要翻译： 在有机聚硅氧烷基材中，由70〜93质量％的导热性填料形成绝缘片。 绝缘片中的导电性杂质的含量为500ppm以下。 根据一个实施例的绝缘片介于半导体器件和散热器之间。
-
-
-
搜索结果
4 条记录 (耗时 0.009 秒)
