公开(公告)号：US08643455B2

公开(公告)日：2014-02-04

申请号：US13295774

申请日：2011-11-14

Applicant: Hideki Ogawa ,  Toshiyuki Yagasaki ,  Hiroya Shigemoto ,  Tsuyoshi Matsumoto ,  Hiroyuki Higuchi ,  Kiyoshi Tanaka

Inventor： Hideki Ogawa ,  Toshiyuki Yagasaki ,  Hiroya Shigemoto ,  Tsuyoshi Matsumoto ,  Hiroyuki Higuchi ,  Kiyoshi Tanaka

IPC: H01F27/02 ,  H01F38/12 ,  H01F27/29 ,  H01F27/30 ,  H01F17/04 ,  H01F27/24

CPC classification number: H01F27/027 ,  H01F27/266 ,  H01F27/292

Abstract: As an embodiment, a pair of first conductive films 12, 13 are formed from the side face to the bottom face of the sheet part 11a of a magnetic core 11, and one end 14b of the conductive wire of the coil 14 and the other end 14c of the conductive wire are joined to the side faces 12a, 13a of the first conductive films 12, 13, respectively. Also, as an embodiment, the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the part 15a of the magnetic sheath 15 covering the side face of the sheet part 11a of the magnetic core 11, wherein the parts of the magnetic sheath 15 covering the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the side faces 16a, 17a of second conductive films 16, 17 as well as the side faces 18a, 19a of third conductive films 18, 19.

Abstract translation: 作为实施例，从磁芯11的片部11a的侧面到底面形成一对第一导电膜12,13，线圈14的导线的一端14b，另一端 14c分别与第一导电膜12,13的侧面12a，13a接合。 此外，作为实施例，接合部分14b1,14c1被第一导电膜12,13的侧面12a，13a和磁性护套15的覆盖磁体的片状部分11a的侧面的部分15a夹着 芯11，其中覆盖接合部分14b1,14c1的磁性护套15的部分被第一导电膜12,13的侧面12a，13a和第二导电膜16,17的侧面16a，17a夹在中间 以及第三导电膜18,19的侧面18a，19a。

公开(公告)号：US06621682B1

公开(公告)日：2003-09-16

申请号：US09624770

申请日：2000-07-25

Applicant: Satoshi Takakuwa ,  Hiroya Shigemoto ,  Yukio Ono

Inventor： Satoshi Takakuwa ,  Hiroya Shigemoto ,  Yukio Ono

IPC: H01G4228

CPC classification number: H01G4/228 ,  H01G4/12 ,  H01G4/232

Abstract: An electronic part is made from a laminated object including stacked abutting ceramic green sheets each carrying an electrically conductive paste having a contact portion in proximity to an edge of the sheet. The laminated object is fired to form a laminated body including ceramic insulator layers abutting electrically conductive internal electrode layers including contact segments in proximity to a side of the object. The body is then processed so the contact segments are exposed on the side of the object. Then an external electrode is formed on the polished body where the contact segment is exposed by using a dry process so the external electrode and the contact segment abut to establish an electric contact between the external electrode and the contact segments. The firing step causes the paste to move relative to the edges of the sheets so the contact segments are displaced relative to the edges of the sheets. The processing step results in a reduction of the displacement of the contact segments relative to the edges of the sheets so the contact segments are displaced relative to the edges of the sheets by a distance to provide an anchoring effect for the external electrode when it is formed by the dry process.

Abstract translation: 电子部件由层叠体构成，该层叠体包括层叠的邻接的陶瓷生片，每个载体具有靠近片的边缘的接触部分的导电膏。 对层叠体进行烧成，形成层叠体，该层叠体具有与导电性内部电极层邻接的陶瓷绝缘体层，该内部电极层包括靠近物体一侧的接触部。 然后处理身体，使得接触段暴露在物体的侧面。 然后，通过使用干法将外部电极形成在暴露接触段的抛光体上，使得外部电极和接触部分邻接以在外部电极和接触段之间建立电接触。 烧制步骤使糊料相对于片材的边缘移动，使得接触片段相对于片材的边缘移位。 处理步骤导致接触片段相对于片材边缘的位移减小，使得接触片段相对于片材的边缘移位一定距离，以在其形成时为外部电极提供锚固效果 通过干燥过程。

公开(公告)号：US20120188040A1

公开(公告)日：2012-07-26

申请号：US13295774

申请日：2011-11-14

Applicant: Hideki Ogawa ,  Toshiyuki Yagasaki ,  Hiroya Shigemoto ,  Tsuyoshi Matsumoto ,  Hiroyuki Higuchi ,  Kiyoshi Tanaka

Inventor： Hideki Ogawa ,  Toshiyuki Yagasaki ,  Hiroya Shigemoto ,  Tsuyoshi Matsumoto ,  Hiroyuki Higuchi ,  Kiyoshi Tanaka

IPC: H01F27/02

CPC classification number: H01F27/027 ,  H01F27/266 ,  H01F27/292

Abstract: As an embodiment, a pair of first conductive films 12, 13 are formed from the side face to the bottom face of the sheet part 11a of a magnetic core 11, and one end 14b of the conductive wire of the coil 14 and the other end 14c of the conductive wire are joined to the side faces 12a, 13a of the first conductive films 12, 13, respectively. Also, as an embodiment, the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the part 15a of the magnetic sheath 15 covering the side face of the sheet part 11a of the magnetic core 11, wherein the parts of the magnetic sheath 15 covering the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the side faces 16a, 17a of second conductive films 16, 17 as well as the side faces 18a, 19a of third conductive films 18, 19.

Abstract translation: 作为实施例，从磁芯11的片部11a的侧面到底面形成一对第一导电膜12,13，线圈14的导线的一端14b，另一端 14c分别与第一导电膜12,13的侧面12a，13a接合。 此外，作为实施例，接合部分14b1,14c1被第一导电膜12,13的侧面12a，13a和磁性护套15的覆盖磁体的片状部分11a的侧面的部分15a夹着 芯11，其中覆盖接合部分14b1,14c1的磁性护套15的部分被第一导电膜12,13的侧面12a，13a和第二导电膜16,17的侧面16a，17a夹在中间 以及第三导电膜18,19的侧面18a，19a。

公开(公告)号：US6151204A

公开(公告)日：2000-11-21

申请号：US298706

申请日：1999-04-23

Applicant: Hiroya Shigemoto ,  Yukio Ono

Inventor： Hiroya Shigemoto ,  Yukio Ono

IPC: H01F41/04 ,  H01F17/00 ,  H01F27/29 ,  H01G4/232 ,  H01G4/30 ,  H05K3/34 ,  H01G4/008 ,  H01G2/20

CPC classification number: H01G4/232 ,  H05K3/3442

Abstract: An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the electronic device so as to extend and connect to the electronic parts elements, respectively. Further, in this electronic device, the external electrode is made up of an anchor layer adhered on the surface of the element assembly of the electronic device, a solder-resist layer formed to cover the anchor layer, and a solder-wettable layer formed to cover a surface of the solder-resistant layer and showing a superior wettability with respect to molten solder, in which the external electrode further includes an intermediate layer provided between the solder-resistant layer and the solder-wettable layer and made of an alloy containing both metal materials forming the solder-resistant layer and the solder-wettable layer.

Abstract translation: 电子设备具有其中设置有电子部件元件的元件组件和形成在电子设备的元件组件的表面上的金属膜的外部电极，以分别延伸并连接到电子元件元件。 此外，在该电子设备中，外部电极由附着在电子器件的元件组件的表面上的固定层，形成为覆盖锚定层的阻焊层和可焊接润湿层构成， 覆盖耐焊层的表面并且相对于熔融焊料显示出优异的润湿性，其中外部电极还包括设置在耐焊层和可焊性润湿层之间的中间层，并且由含有两者的合金制成 形成耐焊层和可焊接润湿层的金属材料。

公开(公告)号：US6071800A

公开(公告)日：2000-06-06

申请号：US183211

申请日：1998-10-30

Applicant: Hiroya Shigemoto ,  Yukio Ono

Inventor： Hiroya Shigemoto ,  Yukio Ono

IPC: H01F41/04 ,  H01F17/00 ,  H01F27/29 ,  H01G4/232 ,  H01G4/30 ,  H05K3/34 ,  H01L21/44 ,  H01G4/228 ,  H01L23/48

CPC classification number: H01G4/232 ,  H05K3/3442

Abstract: An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the electronic device so as to extend and connect to the electronic parts elements, respectively. Further, in this electronic device, the external electrode is made up of an anchor layer adhered on the surface of the element assembly of the electronic device, a solder-resist layer formed to cover the anchor layer, and a solder-wettable layer formed to cover a surface of the solder-resistant layer and showing a superior wettability with respect to molten solder, in which the external electrode further comprises an intermediate layer provided between the solder-resistant layer and the solder-wettable layer and made of an alloy containing both metal materials forming the solder-resistant layer and the solder-wettable layer.

Abstract translation: 电子设备具有其中设置有电子部件元件的元件组件和形成在电子设备的元件组件的表面上的金属膜的外部电极，以分别延伸并连接到电子元件元件。 此外，在该电子设备中，外部电极由附着在电子器件的元件组件的表面上的固定层，形成为覆盖锚定层的阻焊层和可焊接润湿层构成， 覆盖耐焊层的表面，并且相对于熔融焊料显示出优异的润湿性，其中外部电极还包括设置在耐焊料层和可焊性可润湿层之间的中间层，并由含有两者的合金 形成耐焊层和可焊接润湿层的金属材料。