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公开(公告)号：US20060292029A1
公开(公告)日：2006-12-28
申请号：US11159417
申请日：2005-06-23
申请人： Seigi Aoyama , Yuju Endo , Hiroyoshi Hiruta
发明人： Seigi Aoyama , Yuju Endo , Hiroyoshi Hiruta
IPC分类号： C22C9/00
CPC分类号： C22C9/00
摘要： A soft copper alloy contains 10 mass ppm or less of oxygen, and more than 0.005 mass % and less than 0.6 mass % of indium. A soft copper alloy wire or plate material is manufactured by processing the soft copper alloy, wherein an average crystal grain size after annealing is 2 to 20 um.
摘要翻译： 软质铜合金含有10质量ppm以下的氧，0.005质量％以下且0.6质量％以下的铟。 通过加工软铜合金制造软铜合金线或板材，其中退火后的平均晶粒尺寸为2〜20μm。
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2.发明授权公开(公告)号：US07148426B2
公开(公告)日：2006-12-12
申请号：US09892630
申请日：2001-06-28
申请人： Seigi Aoyama , Takaaki Ichikawa , Hiromitsu Kuroda , Takashi Nemoto , Atsushi Ohtake , Hiroyoshi Hiruta
发明人： Seigi Aoyama , Takaaki Ichikawa , Hiromitsu Kuroda , Takashi Nemoto , Atsushi Ohtake , Hiroyoshi Hiruta
CPC分类号： B23K35/262 , H01L31/0504 , H01L31/0508 , H01L31/0512 , H05K3/3426 , H05K3/3463 , Y02E10/50
摘要： In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip conductor; and the plating provided on at least one side of the strip constructor, the plating having a shape such that the plating in the widthwise direction of the strip conductor has a bulge as viewed in section with the apex being located at a proper position in the widthwise direction of the strip conductor. By virtue of this constitution, the lead-free solder on its surface is less likely to be oxidized, and the connection lead has excellent bond strength owing to the property of the lead-free solder and, in addition, has the function of breaking the formed oxide layer and the function of removing included gas bubbles and can eliminate the need to form the plating in very large thickness. Further, the lead-free solder can be used as a connection element in an electrical component that is less likely to cause oxidation of the connection element on its surface and, thus, can have a strong connection structure by the connection element.
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3.发明授权Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor 有权Cu合金材料，使用其制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用Cu合金导体的电缆或电车线公开(公告)号：US08845829B2
公开(公告)日：2014-09-30
申请号：US12716766
申请日：2010-03-03
摘要： A method of manufacturing a Cu alloy conductor includes the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译： 制造Cu合金导体的方法包括以下步骤：向含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质中添加和溶解0.1-0.7重量％的In以形成熔融的Cu合金，进行 与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。
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4.发明申请Cu ALLOY MATERIAL, METHOD OF MANUFACTURING Cu ALLOY CONDUCTOR USING THE SAME, Cu ALLOY CONDUCTOR OBTAINED BY THE METHOD, AND CABLE OR TROLLEY WIRE USING THE Cu ALLOY CONDUCTOR 有权铜合金材料，使用该方法制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用铜合金导体的电缆或拉杆公开(公告)号：US20100163139A1
公开(公告)日：2010-07-01
申请号：US12716766
申请日：2010-03-03
摘要： A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译： 制造Cu合金导体的方法包括以下步骤：将含有0.1-0.7重量％的含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质加入并溶解，以形成熔融的Cu合金，进行 与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。
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公开(公告)号：US20080283159A1
公开(公告)日：2008-11-20
申请号：US12219132
申请日：2008-07-16
申请人： Seigi Aoyama , Yuju Endo , Hiroyoshi Hiruta
发明人： Seigi Aoyama , Yuju Endo , Hiroyoshi Hiruta
CPC分类号： C22C9/00
摘要： A method of fabricating soft copper alloy wire having flexure resistance and heat resistance, includes casting a molten alloy of a copper alloy including 10 mass ppm or less of oxygen, and 0.005 mass % to 0.6 mass % of indium, at a predetermined temperature, to provide a cast bar of the copper alloy having equiaxed crystal, rolling the cast bar of the copper alloy having equiaxed crystal to provide a rolled copper alloy, and conducting a cold drawing and annealing on the rolled copper alloy.
摘要翻译： 一种制造具有耐挠曲性和耐热性的软铜合金线材的方法，包括在规定温度下将包含10质量ppm以下的氧和0.005质量％〜0.6质量％的铟的铜合金熔融合金铸造成规定温度， 提供具有等轴晶体的铜合金铸棒，轧制具有等轴晶体的铜合金铸造棒以提供轧制铜合金，并对轧制的铜合金进行冷拉伸和退火。
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6.发明申请Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method 有权铜合金导体和电线电缆使用相同，铜合金导体制造方法公开(公告)号：US20060157167A1
公开(公告)日：2006-07-20
申请号：US11328072
申请日：2006-01-10
IPC分类号： C22C9/02
摘要： A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt.ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 μm or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 μm or less.
摘要翻译： 铜合金导体具有铜合金材料，其具有0.001至0.1重量％（= 10至1000重量ppm）的氧和0.15至0.70重量％（不包括0.15重量％）的Sn的母体材料。 形成铜合金材料的晶体结构的结晶粒子的平均直径为100μm以下，并且Sn的氧化物的80％以上分散在晶体结构的基体中，作为细小的氧化物粒子，具有 平均粒径为1mum以下。
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7.发明授权Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method 有权铜合金导体和电线电缆使用相同，铜合金导体制造方法公开(公告)号：US09255311B2
公开(公告)日：2016-02-09
申请号：US11328072
申请日：2006-01-10
摘要： A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt·ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 μm or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 μm or less.
摘要翻译： 铜合金导体具有铜合金材料，其具有0.001至0.1重量％（= 10至1000重量ppm）的氧和0.15至0.70重量％（不包括0.15重量％）的Sn的母体材料。 形成铜合金材料的晶体结构的晶粒的平均直径为100μm以下，Sn的氧化物的80％以上分散在作为细微氧化物晶粒的晶体结构的基体中， 平均直径为1μm以下。
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8.发明申请Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor 审中-公开Cu合金材料，使用其制造Cu合金导体的方法，通过该方法获得的Cu合金导体，以及使用Cu合金导体的电缆或电车线公开(公告)号：US20050161129A1
公开(公告)日：2005-07-28
申请号：US10970717
申请日：2004-10-22
IPC分类号： C22C9/02
摘要： A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
摘要翻译： 制造Cu合金导体的方法包括以下步骤：将含有0.1-0.7重量％的含有0.001-0.1重量％（10-1000重量ppm）的氧的Cu基质加入并溶解，以形成熔融的Cu合金，进行 与熔融的Cu合金连续铸造，将铸造材料快速淬火至熔融Cu合金的熔点至少15℃以上的温度，控制铸造材料的温度等于或低于900℃ 并且对铸造材料进行多次热轧工序，使得最终热轧的温度在500〜600℃的范围内，形成轧制材料。
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