公开(公告)号：US4603867A

公开(公告)日：1986-08-05

申请号：US596207

申请日：1984-04-02

申请人： Richard R. Babb ,  Howard A. Kirschler

发明人： Richard R. Babb ,  Howard A. Kirschler

IPC分类号： B23B31/30

CPC分类号： B23B31/307 ,  Y10S264/78 ,  Y10T279/11

摘要： A vacuum spinner chuck having improved holding power for thin wafers is obtained by providing a retention means for moveably holding an O-ring on the peripheral edge of the chuck. There is a first part-circular portion adjacent the upper surface of the chuck, arranged so that in the absence of vacuum the O-ring protrudes above the chuck surface and contacts the wafer. Below this first part-circular portion is a second sloped portion which tilts away from the surface of the spinner chuck by an angle preferably in the range 30-60 degrees. There is a smooth transition between these two portions. When vacuum is applied to the space between the wafer and the chuck, the wafer presses on the O-ring causing it to stretch and move down from the part-circular portion onto the sloped portion until the wafer rests on the surface of the chuck. The stretch creates an opposing force which holds the O-ring in contact with the wafer and the spinner chuck to prevent loss of vacuum. The stretch automatically returns the O-ring to its initial position when the vacuum is removed. The holding power of the chuck is doubled.

摘要翻译： 通过设置用于在卡盘的周缘上可移动地保持O形环的保持装置，获得具有改善的用于薄晶片的保持力的真空旋转卡盘。 存在与卡盘的上表面相邻的第一部分圆形部分，其布置成使得在没有真空的情况下，O形环突出在卡盘表面上方并接触晶片。 在该第一部分圆形部分之下是第二倾斜部分，其倾斜远离旋转卡盘的表面优选地在30-60度的范围内。 这两个部分之间有一个平滑的过渡。 当将真空施加到晶片和卡盘之间的空间时，晶片压在O形环上，使得其从部分圆形部分向下拉伸并向下移动到倾斜部分上，直到晶片搁置在卡盘的表面上。 拉伸产生相反的力，其将O形环保持与晶片和旋转卡盘接触以防止真空损失。 当真空被去除时，拉伸自动将O形圈返回到其初始位置。 卡盘的保持力倍增。