公开(公告)号：US20120301281A1

公开(公告)日：2012-11-29

申请号：US13419429

申请日：2012-03-13

Applicant: Hsuan-Cheng Wang

Inventor： Hsuan-Cheng Wang

IPC: F04D1/00 ,  F04D29/40

CPC classification number: F04D29/4226 ,  F04D29/601 ,  G06F1/203

Abstract: A fan module suitable for an electronic apparatus is provided. The fan module includes a bottom plate, a top cover. a sidewall, a heat-dissipating fan and a housing. The sidewall is assembled between the top cover and the bottom plate. The sidewall, the top cover and the bottom plate together form an accommodating space. The heat-dissipating fan is disposed on the bottom plate and located in the accommodating space. The housing is stacked on the top cover.

Abstract translation: 提供适用于电子设备的风扇模块。 风扇模块包括底板，顶盖。 侧壁，散热风扇和壳体。 侧壁组装在顶盖和底板之间。 侧壁，顶盖和底板一起形成容纳空间。 散热风扇设置在底板上并且位于容纳空间中。 外壳堆叠在顶盖上。

公开(公告)号：US08162036B2

公开(公告)日：2012-04-24

申请号：US12116216

申请日：2008-05-07

Applicant: Wei-Chung Hsiao ,  Hsuan-Cheng Wang ,  Chi-Wei Tien

Inventor： Wei-Chung Hsiao ,  Hsuan-Cheng Wang ,  Chi-Wei Tien

IPC: F28D15/02

CPC classification number: F28D15/0233 ,  F28D15/046

Abstract: A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity.

Abstract translation: 提供了包括管体和工作物质的热管结构。 管体具有彼此相对的两个封闭端，内表面，压缩部分和扩展部分。 内表面和两个封闭端形成空腔。 压缩部包括在内表面形成的多个第一槽。 第一凹槽中的任何一个包括第一宽度。 扩展部分包括形成在内表面处的多个第二凹槽。 第二槽中的任何一个包括第二宽度，第一宽度大约等于第二宽度。 工作物质包含在腔中。

公开(公告)号：US20060146493A1

公开(公告)日：2006-07-06

申请号：US11161134

申请日：2005-07-25

Applicant: Hsuan-Cheng Wang ,  Chun-Hung Lin

Inventor： Hsuan-Cheng Wang ,  Chun-Hung Lin

IPC: G06F1/20

CPC classification number: H01L23/467 ,  G06F1/203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation module is suited for a portable electronic device. The module includes a first mesh, a housing and a fan, wherein the first mesh disposed at the bottom of the casing of the device has a plurality of first openings. The housing has an air inlet, a second mesh, a mounting space and an air outlet, wherein the second mesh disposed at the top of the housing has a plurality of second openings. The diameter of each of the second openings is smaller than that of the first openings. To satisfy the safety standard, the heat dissipation efficiency of this device can be improved by changing the size of these two openings. Furthermore, the first and second mesh are respectively formed with the bottom of the casing and the top of the housing together as an integral unit to reduce the production cost of the portable electronic device.

Abstract translation: 散热模块适用于便携式电子设备。 模块包括第一网孔，壳体和风扇，其中设置在设备的壳体底部的第一网格具有多个第一开口。 壳体具有空气入口，第二网孔，安装空间和空气出口，其中设置在壳体顶部的第二网具有多个第二开口。 每个第二开口的直径小于第一开口的直径。 为了满足安全标准，可以通过改变这两个开口的尺寸来提高该装置的散热效率。 此外，第一和第二网格分别形成有壳体的底部和壳体的顶部一起作为整体单元，以降低便携式电子设备的生产成本。

公开(公告)号：US20060054713A1

公开(公告)日：2006-03-16

申请号：US11161132

申请日：2005-07-25

Applicant: Hsuan Cheng Wang ,  Chun-Hung Lin ,  Chi-Hsin Lin

Inventor： Hsuan Cheng Wang ,  Chun-Hung Lin ,  Chi-Hsin Lin

IPC: F24F7/00

CPC classification number: H05K7/20209

Abstract: A method for controlling the fan speed by detecting different power supplies of a mobile electronic device is proposed. When an external power source is used for mobile electronic device and detected by the embedded controller, the first fan control table is used to control the fan speed to increase the heat dissipation capability of the mobile electronic device. When battery power is used as the power source and detected by the embedded controller, a second fan control table is used to control the fan speed to extend the battery life. The first fan control table and the second fan control table become the relation control table between the temperature of the processor and the fan speed or the relation fan control table between the temperature of the processor and the input voltage of the fan for controlling the fan speed according to the temperature of the processor.

Abstract translation: 提出了一种通过检测移动电子设备的不同电源来控制风扇速度的方法。 当外部电源用于移动电子设备并由嵌入式控制器检测时，第一风扇控制台用于控制风扇速度以增加移动电子设备的散热能力。 当电池电源用作电源并由嵌入式控制器检测时，第二个风扇控制台用于控制风扇转速以延长电池寿命。 第一风扇控制表和第二风扇控制表成为处理器的温度与风扇转速之间的关系控制表，或处理器的温度与用于控制风扇转速的风扇的输入电压之间的关系风扇控制表 根据处理器的温度。

公开(公告)号：US07591433B2

公开(公告)日：2009-09-22

申请号：US11161132

申请日：2005-07-25

Applicant: Hsuan Cheng Wang ,  Chun-Hung Lin ,  Chi-Hsin Lin

Inventor： Hsuan Cheng Wang ,  Chun-Hung Lin ,  Chi-Hsin Lin

IPC: F24F7/00 ,  H05K7/20

CPC classification number: H05K7/20209

Abstract: A method for controlling the fan speed by detecting different power supplies of a mobile electronic device is proposed. When an external power source is used for mobile electronic device and detected by the embedded controller, the first fan control table is used to control the fan speed to increase the heat dissipation capability of the mobile electronic device. When battery power is used as the power source and detected by the embedded controller, a second fan control table is used to control the fan speed to extend the battery life. The first fan control table and the second fan control table become the relation control table between the temperature of the processor and the fan speed or the relation fan control table between the temperature of the processor and the input voltage of the fan for controlling the fan speed according to the temperature of the processor.

Abstract translation: 提出了一种通过检测移动电子设备的不同电源来控制风扇速度的方法。 当外部电源用于移动电子设备并由嵌入式控制器检测时，第一风扇控制台用于控制风扇速度以增加移动电子设备的散热能力。 当电池电源用作电源并由嵌入式控制器检测时，第二个风扇控制台用于控制风扇转速以延长电池寿命。 第一风扇控制表和第二风扇控制表成为处理器的温度与风扇转速之间的关系控制表，或处理器的温度与用于控制风扇转速的风扇的输入电压之间的关系风扇控制表 根据处理器的温度。

公开(公告)号：US20080187407A1

公开(公告)日：2008-08-07

申请号：US11944454

申请日：2007-11-22

Applicant: Chi-Wei Tien ,  Hsuan-Cheng Wang ,  Wei-Chung Hsiao ,  Chih-Yung Kao

Inventor： Chi-Wei Tien ,  Hsuan-Cheng Wang ,  Wei-Chung Hsiao ,  Chih-Yung Kao

IPC: F16B39/01

CPC classification number: F16B5/02 ,  F16B19/02 ,  G06F1/1613 ,  G06F1/1656 ,  G06F1/203 ,  H05K5/0008 ,  H05K7/142

Abstract: A fastening structure including a first housing, a substrate, a second housing, and a fastening component is provided. The first housing has a first boss with a first opening, and a sidewall of the first opening is made of metal. The substrate has a second opening. The second housing has a second boss with a third opening. One end of the fastening component passes through the third opening and is fastened in the first opening, and the other end of the fastening component is restricted in one end of the third opening to fasten the substrate between the first housing and the second housing. Both the metal sidewall and the sidewall of the fastening component therein do not contact the substrate.

Abstract translation: 提供了包括第一壳体，基板，第二壳体和紧固部件的紧固结构。 第一壳体具有第一开口的第一凸台，第一开口的侧壁由金属制成。 基板具有第二开口。 第二个房屋有第二个老板，第三个开放。 紧固部件的一端穿过第三开口并被紧固在第一开口中，并且紧固部件的另一端限制在第三开口的一端，以将基板紧固在第一壳体和第二壳体之间。 金属侧壁和其中的紧固部件的侧壁均不接触基板。

公开(公告)号：US07397667B2

公开(公告)日：2008-07-08

申请号：US11724085

申请日：2007-03-14

Applicant: Chun-Hung Lin ,  Tsung-Hui Wu ,  Wei-Chung Hsiao ,  Hsuan-Cheng Wang

Inventor： Chun-Hung Lin ,  Tsung-Hui Wu ,  Wei-Chung Hsiao ,  Hsuan-Cheng Wang

IPC: H05K7/20 ,  F28D15/00

CPC classification number: H01L23/427 ,  H01L23/4006 ,  H01L2224/16 ,  H01L2224/73253

Abstract: A cooler module mounted on a CPU on a circuit board inside a computer is disclosed to include a mounting base frame, which is made of a thermal conductive material and has a heat-transfer zone disposed in contact with the CPU and two arms respectively extended from two sides of the heat-transfer zone and affixed to the circuit board and two eyelet lugs vertically extended from two sides of the distal end of one of the two arms, a heat pipe, which has one end supported on the heat-transfer zone of the mounting base frame, an elongated retaining member, which has two lugs disposed at one end thereof and respectively fastened to the eyelet lugs of the mounting base frame, and a buffer member fastened to the heat-transfer zone to hold down heat pipe on the heat-transfer zone.

Abstract translation: 公开了一种安装在计算机内部的电路板上的CPU上的冷却器模块，其包括：安装基座框架，其由导热材料制成，并具有与CPU接触设置的传热区域和分别从 传热区的两侧，并固定到电路板和两个从两个臂之一的远端的两侧垂直延伸的孔眼突起，一个热管，其一端支撑在传热区的传热区 安装基座框架，细长的保持构件，其具有设置在其一端并分别固定到安装基座框架的孔眼凸耳上的两个凸耳，以及缓冲构件，其紧固到传热区以将热管保持在 传热区。

公开(公告)号：US06643137B1

公开(公告)日：2003-11-04

申请号：US10318144

申请日：2002-12-13

Applicant: Yi-Chen Chung ,  Hsuan-Cheng Wang ,  I-Sung Huang

Inventor： Yi-Chen Chung ,  Hsuan-Cheng Wang ,  I-Sung Huang

IPC: H05K720

CPC classification number: H01L23/367 ,  H01L23/4006 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat-dissipating device is adapted for use with a multi-layer circuit board having a grounding layer and that has an electronic component mounted thereon. The heat-dissipating device includes a heat-dissipating member, a grounding member and a connecting member. The heat-dissipating member is adapted to be disposed on a heat-radiating side of the electronic component. The grounding member includes a grounding tail and a grounding body connected to the grounding tail. The grounding tail is adapted to pass through the circuit board to connect electrically with the grounding layer and to dispose the grounding body between the heat-dissipating member and the circuit board. The connecting member interconnects the heat-dissipating member and the grounding member, and is adapted to be secured on the circuit board. The connecting member cooperates with the grounding member to make electrical connection between the heat-dissipating member and the grounding layer of the circuit board.

Abstract translation: 散热装置适用于具有接地层的多层电路板，并且其上安装有电子部件。 散热装置包括散热构件，接地构件和连接构件。 散热构件适于设置在电子部件的散热侧。 接地构件包括接地尾和连接到接地尾的接地体。 接地尾部适于通过电路板与接地层电连接，并将接地体设置在散热构件和电路板之间。 连接构件将散热构件和接地构件互连，并且适于固定在电路板上。 连接构件与接地构件配合，以在散热构件和电路板的接地层之间形成电连接。

公开(公告)号：US20090173475A1

公开(公告)日：2009-07-09

申请号：US12116216

申请日：2008-05-07

Applicant: Wei-Chung Hsiao ,  Hsuan-Cheng Wang ,  Chi-Wei Tien

Inventor： Wei-Chung Hsiao ,  Hsuan-Cheng Wang ,  Chi-Wei Tien

IPC: F28D15/00

CPC classification number: F28D15/0233 ,  F28D15/046

Abstract: A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity.

Abstract translation: 提供了包括管体和工作物质的热管结构。 管体具有彼此相对的两个封闭端，内表面，压缩部分和扩展部分。 内表面和两个封闭端形成一个空腔。 压缩部包括在内表面形成的多个第一槽。 第一凹槽中的任何一个包括第一宽度。 扩展部分包括形成在内表面处的多个第二凹槽。 第二槽中的任何一个包括第二宽度，第一宽度大约等于第二宽度。 工作物质包含在腔中。

公开(公告)号：US20070274049A1

公开(公告)日：2007-11-29

申请号：US11724085

申请日：2007-03-14

Applicant: Chun-Hung Lin ,  Tsung-Hui Wu ,  Wei-Chung Hsiao ,  Hsuan-Cheng Wang

Inventor： Chun-Hung Lin ,  Tsung-Hui Wu ,  Wei-Chung Hsiao ,  Hsuan-Cheng Wang

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L23/4006 ,  H01L2224/16 ,  H01L2224/73253

Abstract: A cooler module mounted on a CPU on a circuit board inside a computer is disclosed to include a mounting base frame, which is made of a thermal conductive material and has a heat-transfer zone disposed in contact with the CPU and two arms respectively extended from two sides of the heat-transfer zone and affixed to the circuit board and two eyelet lugs vertically extended from two sides of the distal end of one of the two arms, a heat pipe, which has one end supported on the heat-transfer zone of the mounting base frame, an elongated retaining member, which has two lugs disposed at one end thereof and respectively fastened to the eyelet lugs of the mounting base frame, and a buffer member fastened to the heat-transfer zone to hold down heat pipe on the heat-transfer zone.

Abstract translation: 公开了一种安装在计算机内部的电路板上的CPU上的冷却器模块，其包括：安装基座框架，其由导热材料制成，并具有与CPU接触设置的传热区域和分别从 传热区的两侧，并固定到电路板和两个从两个臂之一的远端的两侧垂直延伸的孔眼突起，一个热管，其一端支撑在传热区的传热区 安装基座框架，细长的保持构件，其具有设置在其一端并分别固定到安装基座框架的孔眼凸耳上的两个凸耳，以及缓冲构件，其紧固到传热区以将热管保持在 传热区。