公开(公告)号：US20110044368A1

公开(公告)日：2011-02-24

申请号：US12615274

申请日：2009-11-10

Applicant: Hung-Sheng LEE ,  Chih-Cheng CHEN ,  Tsai-Yu CHUANG ,  Ching-Hui LIN ,  Sheng-Ping LAI

Inventor： Hung-Sheng LEE ,  Chih-Cheng CHEN ,  Tsai-Yu CHUANG ,  Ching-Hui LIN ,  Sheng-Ping LAI

IPC: H01S5/026 ,  H01L33/50

CPC classification number: G06F3/0317

Abstract: An optical device is disclosed. The optical device includes a first packaging unit and a second packaging unit. The first packaging unit includes a first lead frame and a sensor electrically coupled to the first lead frame. The second packaging unit includes an emitting die and a second lead frame. The emitting die has an optical axis and is operable to emit a light. The second lead frame has a first portion disposed within the second packaging unit and a second portion extending into the first packaging unit so that an angle of about 5-85 degrees is formed between the optical axis of the emitting die and the sensing plane of the sensor.

Abstract translation: 公开了一种光学装置。 光学装置包括第一包装单元和第二包装单元。 第一包装单元包括电耦合到第一引线框架的第一引线框架和传感器。 第二包装单元包括发射管芯和第二引线框架。 发射管芯具有光轴并且可操作地发射光。 第二引线框架具有设置在第二封装单元内的第一部分和延伸到第一封装单元中的第二部分，使得在发射管芯的光轴和发射管芯的感测平面之间形成大约5-85度的角度 传感器。

公开(公告)号：US20060284305A1

公开(公告)日：2006-12-21

申请号：US11450552

申请日：2006-06-12

Applicant: Hsien-Cheng Yen ,  Hung-Sheng Lee ,  Ming-Cho Wu ,  Szutsun-Simon Ou

Inventor： Hsien-Cheng Yen ,  Hung-Sheng Lee ,  Ming-Cho Wu ,  Szutsun-Simon Ou

IPC: H01L23/14

CPC classification number: H01S5/024 ,  H01L33/641 ,  H01S5/02212

Abstract: A packaging base for semiconductor elements is made of metal powder selected from the group consisting of cupper (Cu), iron (Fe), wolfram (W), molybdenum (Mo), aluminum (Al), indium (In), and gallium (Ga) or from an alloy of combinations thereof. A heat sink is integrally formed by metallurgical injection molding process. A fixing mount and a protection mount are positioned on the heat sink, thereby creating a packaging base structure. The protection mount surrounds the fixing mount for protecting semiconductor elements like laser diode dies. The packaging base structure includes a mounting gap for the purpose of an easy installation of the semiconductor elements. In this way, the reduction of the heat-removal capacity caused by the thermal contact resistance of the conventional configuration can be avoided so that the cooling effect can be enhanced. Meanwhile, the fabrication process is simplified.

Abstract translation: 用于半导体元件的封装基底由选自铜（Cu），铁（Fe），钨（W），钼（Mo），铝（Al），铟（In）和镓 Ga）或其组合的合金。 散热器通过冶金注射成型工艺整体形成。 固定座和保护座位于散热器上，从而形成包装基座结构。 保护安装件围绕用于保护半导体元件的激光二极管管芯的固定安装座。 包装基座结构包括用于容易安装半导体元件的安装间隙。 以这种方式，可以避免由常规结构的热接触电阻引起的除热能力的降低，从而可以提高冷却效果。 同时，简化了制作工艺。