公开(公告)号：US20090083193A1

公开(公告)日：2009-03-26

申请号：US12326779

申请日：2008-12-02

申请人： FIDES CARLOS ,  GLENN D.J. RANSIER ,  FARHAD SUBJALLY ,  SHANKAR SUBRAMANIAM ,  IMRAN YUSUF

发明人： FIDES CARLOS ,  GLENN D.J. RANSIER ,  FARHAD SUBJALLY ,  SHANKAR SUBRAMANIAM ,  IMRAN YUSUF

IPC分类号： G06Q40/00 ,  G06Q20/00

CPC分类号： G06Q40/02 ,  G06Q40/00 ,  G06Q40/025 ,  G06Q50/188

摘要： A system and method for facilitating the negotiation of credits. The bank issuing the credit and a nominated bank agree to program conditions pursuant to which the nominated bank, based upon its own examination of documents presented under the credit and before said documents are forwarded to, received, and accepted by the issuing bank, will pay, accept, or negotiate the credit with no or limited recourse to the issuing bank for discrepancies in the documents.

摘要翻译： 一种促进信贷谈判的制度和方法。 发行信用银行和指定银行同意规定条件，根据该条件，指定银行根据自己对信用证提交的文件进行审查，并在所述文件转交给开证行收到并接受之前，将支付 ，接受或谈判信用，没有或有限的诉诸发卡行的文件中的差异。

公开(公告)号：US06310773B1

公开(公告)日：2001-10-30

申请号：US09470322

申请日：1999-12-21

申请人： Imran Yusuf ,  Biju Chandran

发明人： Imran Yusuf ,  Biju Chandran

IPC分类号： H05K720

CPC分类号： H01L23/40 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation system for an integrated circuit assembly uses a compressible support structure to support a cooling solution, or heat sink, that dissipates heat generated by an integrated circuit. The compressible support structure, in one embodiment, is a deformable tube that is supported by a base structure. The tube, heat sink and base can be formed from a conductive material to provide an EMI shield for the integrated circuit. Retention mechanisms are used to provide either a fixed or an adjustable compression force to place the heat sink in thermal contact with the integrated circuit. The compressible support structure supports the heat sink, but also absorbs vibration and shock forces exerted on the heat sink to reduce the amount of forces transferred to the integrated circuit.

摘要翻译： 用于集成电路组件的散热系统使用可压缩支撑结构来支持散热由集成电路产生的热的冷却溶液或散热器。 在一个实施例中，可压缩支撑结构是由基部结构支撑的可变形管。 管，散热器和基座可以由导电材料形成，以为集成电路提供EMI屏蔽。 保持机构用于提供固定或可调节的压缩力以将散热器与集成电路热接触。 可压缩支撑结构支撑散热器，而且还吸收施加在散热片上的振动和冲击力，以减少传递到集成电路的力量。

公开(公告)号：US07475037B2

公开(公告)日：2009-01-06

申请号：US10707313

申请日：2003-12-04

申请人： Fides Carlos ,  Glenn D. J. Ransier ,  Farhad Subjally ,  Shankar Subramaniam ,  Imran Yusuf

发明人： Fides Carlos ,  Glenn D. J. Ransier ,  Farhad Subjally ,  Shankar Subramaniam ,  Imran Yusuf

IPC分类号： G06Q40/00

CPC分类号： G06Q40/02 ,  G06Q20/10 ,  G06Q20/108 ,  G06Q40/00 ,  G06Q40/025

摘要： A system and method for facilitating the negotiation of credits. The bank issuing the credit and a nominated bank agree to program conditions pursuant to which the nominated bank, based upon its own examination of documents presented under the credit and before said documents are forwarded to, received, and accepted by the issuing bank, will pay, accept, or negotiate the credit with no or limited recourse to the issuing bank for discrepancies in the documents.

摘要翻译： 一种促进信贷谈判的制度和方法。 发放信贷的银行和指定银行同意规定条件，根据该条件，指定银行根据自己对信用证提交的文件进行审查，并在所述文件转交给开证行接收和接受之前，将支付 ，接受或谈判信用，没有或有限的诉诸发卡行的文件中的差异。

公开(公告)号：US5990549A

公开(公告)日：1999-11-23

申请号：US19570

申请日：1998-02-06

申请人： Chia-Pin Chiu ,  Imran Yusuf ,  Banerjee Koushik ,  Todd Young ,  Gary Solbrekken

发明人： Chia-Pin Chiu ,  Imran Yusuf ,  Banerjee Koushik ,  Todd Young ,  Gary Solbrekken

IPC分类号： H01L29/40 ,  H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K7/20 ,  H01L23/48 ,  H01L23/10 ,  H01L23/34

CPC分类号： H05K7/20509 ,  H01L23/367 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/3011

摘要： One embodiment of the present invention is an electronic assembly which may have a first integrated circuit package mounted to a first side of a substrate and a second integrated circuit package mounted to a second side of the substrate. A thermal plate may be thermally coupled to the first integrated circuit package. A heat sink may be mounted to the thermal plate. A thermal bus may be is thermally coupled to the second integrated circuit package and the thermal plate. The thermal bus bar allows heat to flow from the second integrated circuit package to the thermal plate and heat sink. The electronic assembly of the present invention can thus remove heat from integrated circuit packages located on both sides of a substrate with only one heat sink.

摘要翻译： 本发明的一个实施例是一种电子组件，其可以具有安装到基板的第一侧的第一集成电路封装和安装到基板的第二侧的第二集成电路封装。 热板可以热耦合到第一集成电路封装。 散热器可以安装在热板上。 热母线可以被热耦合到第二集成电路封装和热板。 热母线允许热量从第二集成电路封装流到热板和散热片。 因此，本发明的电子组件可以仅使用一个散热器从位于基板两侧的集成电路封装件去除热量。

公开(公告)号：US07778921B2

公开(公告)日：2010-08-17

申请号：US12326779

申请日：2008-12-02

申请人： Fides Carlos ,  Glenn D. J. Ransier ,  Farhad Subjally ,  Shankar Subramaniam ,  Imran Yusuf

发明人： Fides Carlos ,  Glenn D. J. Ransier ,  Farhad Subjally ,  Shankar Subramaniam ,  Imran Yusuf

IPC分类号： G06Q40/00

CPC分类号： G06Q40/02 ,  G06Q40/00 ,  G06Q40/025 ,  G06Q50/188

摘要： A system and method for facilitating the negotiation of credits. The bank issuing the credit and a nominated bank agree to program conditions pursuant to which the nominated bank, based upon its own examination of documents presented under the credit and before said documents are forwarded to, received, and accepted by the issuing bank, will pay, accept, or negotiate the credit with no or limited recourse to the issuing bank for discrepancies in the documents.

摘要翻译： 一种促进信贷谈判的制度和方法。 发行信用银行和指定银行同意规定条件，根据该条件，指定银行根据自己对信用证提交的文件进行审查，并在所述文件转交给开证行收到并接受之前，将支付 ，接受或谈判信用，没有或有限的诉诸发卡行的文件中的差异。

公开(公告)号：US06441480B1

公开(公告)日：2002-08-27

申请号：US09379537

申请日：1999-08-24

申请人： Timothy M. Takeuchi ,  Imran Yusuf ,  Johnny M. Cook, Jr.

发明人： Timothy M. Takeuchi ,  Imran Yusuf ,  Johnny M. Cook, Jr.

IPC分类号： H01L2310

CPC分类号： H01L23/4338 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： A microelectronic package comprises a substrate, a electronic chip mounted on the substrate, a thermal interface material, a spring clip, and a retention frame. The thermal interface material is located between the electronic chip and the slug and is capable of thermally coupling the electronic chip to a slug without curing. The spring clip is located between the retention frame and the slug. In the assembled microelectronic package, the retention frame caps the substrate, and the spring clip applies a constant force to the slug to ensure reliable and continuous thermal contact between the electronic chip and the slug.

摘要翻译： 微电子封装包括衬底，安装在衬底上的电子芯片，热界面材料，弹簧夹和保持框架。 热界面材料位于电子芯片和芯块之间，并且能够将电子芯片热连接到芯块而不固化。 弹簧夹位于保持框架和块之间。 在组装的微电子封装中，保持框架盖住基板，并且弹簧夹对芯块施加恒定的力，以确保电子芯片和芯块之间的可靠和连续的热接触。

公开(公告)号：US06256199B1

公开(公告)日：2001-07-03

申请号：US09410648

申请日：1999-10-01

申请人： Imran Yusuf ,  Hong Xie ,  Johnny M. Cook, Jr. ,  Peter Brandenburger ,  Biju Chandran ,  Hamid Ekhlassi

发明人： Imran Yusuf ,  Hong Xie ,  Johnny M. Cook, Jr. ,  Peter Brandenburger ,  Biju Chandran ,  Hamid Ekhlassi

IPC分类号： H05K720

CPC分类号： H01L23/40 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： An integrated circuit cartridge and method has been described. The cartridge includes a heat pipe that comes in thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force to maintain a substantially even bond line thickness in the presence of opposing forces, such as forces caused by thermal cycling, power cycling, shocks, and vibration. The spring clip can modulate the compressive force applied as a function of parameters on the spring clip. Parameters include load arm width, load arm thickness, load arm curvature, and the location of tabs relative to load arms. A cartridge cover supplies physical protection for pins that protrude from the cartridge. The cartridge cover also supplies key features that aid in alignment of the pins and a socket.

摘要翻译： 已经描述了集成电路盒和方法。 该盒包括与至少一个集成电路管芯热接触的热管。 使用弹簧夹提供压缩力以在存在相反的力（例如由热循环，功率循环，冲击和振动引起的力）的情况下保持基本上均匀的接合线厚度。 弹簧夹可以根据弹簧夹上的参数调节施加的压缩力。 参数包括负载臂宽度，负载臂厚度，负载臂曲率以及接头相对于负载臂的位置。 墨盒盖为从墨盒突出的针脚提供物理保护。 墨盒盖还提供了有助于对齐针脚和插座的关键特征。