公开(公告)号：US07302757B2

公开(公告)日：2007-12-04

申请号：US11204699

申请日：2005-08-16

Applicant: Jeffrey A. Brody ,  Hsichang Liu ,  Hai Pham Longworth ,  James C. Monaco ,  Gerard J. Nuzback ,  Wei Zou

Inventor： Jeffrey A. Brody ,  Hsichang Liu ,  Hai Pham Longworth ,  James C. Monaco ,  Gerard J. Nuzback ,  Wei Zou

IPC: H01K3/10

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10348 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the contact pad and fuss button. The improved contact reduces displacement of electrical contact points due to thermo-mechanical stress and lowers the required actuation force during assembly.

Abstract translation: 提供了一种改进的Land Grid阵列互连结构，其中在基板电接触焊盘上使用小的金属凸块。 凸起与绒头按钮连接的部分互锁，并增加接触垫和大按钮之间的物理接触表面积。 改进的接触减少了由于热机械应力引起的电接触点的位移，并降低了组装过程中所需的致动力。