公开(公告)号：US06631078B2

公开(公告)日：2003-10-07

申请号：US10044204

申请日：2002-01-10

Applicant: David J. Alcoe ,  Varaprasad Venkata Calmidi ,  Krishna Darbha ,  Sanjeev Balwant Sathe

Inventor： David J. Alcoe ,  Varaprasad Venkata Calmidi ,  Krishna Darbha ,  Sanjeev Balwant Sathe

IPC: H05K720

CPC classification number: H05K7/1061 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H05K1/0203 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0116 ,  H05K2201/10348 ,  H05K2201/10393 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper surface of the electronic module by way of mechanical linkage to the PCB. The heat dissipating flexible standoff provides a force opposing the compression force to thereby reduce stress on solder ball connections between electronic module and PCB. Thermally conductive flexible standoffs in the form of spring arrangements, such as a wire mesh, act to provide heat dissipation by both thermal conduction and thermal convection. A thermally conductive flexible polymer pad and a layer of porous metal foam may also act as thermally conductive standoffs.

Abstract translation: 散热的柔性或弹性支座被机械夹紧在电子模块和基板（例如PCB）之间。 夹紧装置包括通过机械连接到PCB来在电子模块的上表面上压缩导热柔性界面垫的散热器。 散热柔性支座提供与压缩力相反的力，从而减少电子模块和PCB之间焊球连接的应力。 弹性布置形式的导热弹性支座，如丝网，用于通过热传导和热对流来提供散热。 导热柔性聚合物垫和多孔金属泡沫层也可以用作导热支座。

公开(公告)号：US06417747B1

公开(公告)日：2002-07-09

申请号：US09935496

申请日：2001-08-23

Applicant: Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

Inventor： Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

IPC: H01P100

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

Abstract: An RF interconnect is incorporated in RF module packages for direct attachment onto a multi-layer PWB using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing including a metal bottom wall structure. The module includes a plurality of RF interconnects, which provide RF interconnection between the package and the PWB. Each interconnect includes a feedthrough center pin protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator. The center pin is surrounded with a ring of shield pins attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes formed in the PWB, and make contact with fuzz button interconnects disposed in the holes. Circuitry connects the fuzz button interconnects to appropriate levels of the PWB for grounding and RF signal conduction.

Abstract translation: RF互连结合在RF模块封装中，以使用可压缩中心导体（Fuzz按钮）互连直接连接到多层PWB上。 该模块具有以微波频率工作的电路。 模块封装包括金属外壳，其包括金属底壁结构。 该模块包括多个RF互连，其在封装和PWB之间提供RF互连。 每个互连件包括穿过形成在金属底壁中的开口突出的馈通中心销，由隔离绝缘子提供隔离。 中心销被围绕着一个安装在模块壳体底壁外表面的屏蔽销圈。 销可插入形成在PWB中的孔中，并与布置在孔中的绒头按钮互连接触。 电路将毛绒按钮互连连接到PWB的适当级别，用于接地和RF信号传导。

公开(公告)号：US07302757B2

公开(公告)日：2007-12-04

申请号：US11204699

申请日：2005-08-16

Applicant: Jeffrey A. Brody ,  Hsichang Liu ,  Hai Pham Longworth ,  James C. Monaco ,  Gerard J. Nuzback ,  Wei Zou

Inventor： Jeffrey A. Brody ,  Hsichang Liu ,  Hai Pham Longworth ,  James C. Monaco ,  Gerard J. Nuzback ,  Wei Zou

IPC: H01K3/10

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10348 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the contact pad and fuss button. The improved contact reduces displacement of electrical contact points due to thermo-mechanical stress and lowers the required actuation force during assembly.

Abstract translation: 提供了一种改进的Land Grid阵列互连结构，其中在基板电接触焊盘上使用小的金属凸块。 凸起与绒头按钮连接的部分互锁，并增加接触垫和大按钮之间的物理接触表面积。 改进的接触减少了由于热机械应力引起的电接触点的位移，并降低了组装过程中所需的致动力。

公开(公告)号：US20030129863A1

公开(公告)日：2003-07-10

申请号：US10044204

申请日：2002-01-10

Applicant: International Business Machines Corporation

Inventor： David J. Alcoe ,  Varaprasad Venkata Calmidi ,  Krishna Darbha ,  Sanjeev Balwant Sathe

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H05K7/1061 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H05K1/0203 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0116 ,  H05K2201/10348 ,  H05K2201/10393 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper surface of the electronic module by way of mechanical linkage to the PCB. The heat dissipating flexible standoff provides a force opposing the compression force to thereby reduce stress on solder ball connections between electronic module and PCB. Thermally conductive flexible standoffs in the form of spring arrangements, such as a wire mesh, act to provide heat dissipation by both thermal conduction and thermal convection. A thermally conductive flexible polymer pad and a layer of porous metal foam may also act as thermally conductive standoffs.

Abstract translation: 散热的柔性或弹性支座被机械夹紧在电子模块和基板（例如PCB）之间。 夹紧装置包括通过机械连接到PCB来在电子模块的上表面上压缩导热柔性界面垫的散热器。 散热柔性支座提供与压缩力相反的力，从而减少电子模块和PCB之间焊球连接的应力。 弹性布置形式的导热弹性支座，如丝网，用于通过热传导和热对流来提供散热。 导热柔性聚合物垫和多孔金属泡沫层也可以用作导热支座。

公开(公告)号：US20170215286A1

公开(公告)日：2017-07-27

申请号：US15007743

申请日：2016-01-27

Applicant: Northrop Grumman Systems Corporation

Inventor： Matthew J. Pirih ,  Steven J. Mass ,  Andrew Yurko

IPC: H05K1/14 ,  H05K3/02 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10265 ,  H05K2201/10348 ,  H05K2203/0723 ,  H05K2203/095 ,  H05K2203/107

Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.

公开(公告)号：US07077660B2

公开(公告)日：2006-07-18

申请号：US10775922

申请日：2004-02-10

Applicant: Michael F. McAllister ,  John G. Torok

Inventor： Michael F. McAllister ,  John G. Torok

IPC: H01R12/00

CPC classification number: H05K1/141 ,  H05K1/0286 ,  H05K1/162 ,  H05K3/325 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/10348 ,  H05K2201/10666 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

Abstract translation: 使用柔性膜插入器增强了栅格阵列结构，不仅在多芯片模块（MCM）和下一级集成（例如系统板）之间提供了一个栅格阵列（LGA）电连接，而且提供了一个 可靠的手段来实现所需的工程变更（EC）能力，以及将功率与地面结构分离的手段，以最小化对系统的开关活动影响。 所描述的发明可以用于EC修复，用于电容去耦或两者。

公开(公告)号：US06989995B2

公开(公告)日：2006-01-24

申请号：US10386523

申请日：2003-03-13

Applicant: Takeshi Ito

Inventor： Takeshi Ito

IPC: H05K7/06

CPC classification number: H01G2/06 ,  H05K1/141 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/10348 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: Electrode lead wires for each capacitor are soldered to land patterns of a mounting plate of insulation. Spacers each having a flexible structure composed of a grid of metal lines are mounted on electrode patterns printed on a printed circuit board, and tip portions of the electrode lead wires which project from the mounting plate are stuck into the spacers to provide mechanical contact therebetween. While keeping this contact, the mounting plate is secured with bolts to the printed circuit board. This forms a capacitor mounting structure. For replacement of the capacitors, by simply loosening the bolts, the entire mounting plate including all the capacitors can be demounted from the board.

Abstract translation: 每个电容器的电极引线焊接到绝缘安装板的焊盘图案。 每个具有由金属线网格组成的柔性结构的间隔件安装在印刷在印刷电路板上的电极图案上，并且从安装板突出的电极引线的尖端部分粘贴到间隔物中以在它们之间提供机械接触。 在保持接触的同时，安装板用螺栓固定到印刷电路板上。 这形成电容器安装结构。 为了更换电容器，通过简单地松开螺栓，可以从板上拆卸包括所有电容器的整个安装板。

公开(公告)号：US06954984B2

公开(公告)日：2005-10-18

申请号：US10202726

申请日：2002-07-25

Applicant: Michael F. McAllister ,  John G. Torok

Inventor： Michael F. McAllister ,  John G. Torok

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/16 ,  H05K3/32 ,  H05K3/34 ,  H05K3/42 ,  H05K3/30

CPC classification number: H05K1/141 ,  H05K1/0286 ,  H05K1/162 ,  H05K3/325 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/10348 ,  H05K2201/10666 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

Abstract translation: 使用柔性膜插入器增强了栅格阵列结构，不仅在多芯片模块（MCM）和下一级集成（例如系统板）之间提供了一个栅格阵列（LGA）电连接，而且提供了一个 可靠的手段来实现所需的工程变更（EC）能力，以及将功率与地面结构分离的手段，以最小化对系统的开关活动影响。 所描述的发明可以用于EC修复，用于电容去耦或两者。

公开(公告)号：US20040085742A1

公开(公告)日：2004-05-06

申请号：US10386523

申请日：2003-03-13

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Takeshi Ito

IPC: H05K007/06

CPC classification number: H01G2/06 ,  H05K1/141 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/10348 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: Electrode lead wires for each capacitor are soldered to land patterns of a mounting plate of insulation. Spacers each having a flexible structure composed of a grid of metal lines are mounted on electrode patterns printed on a printed circuit board, and tip portions of the electrode lead wires which project from the mounting plate are stuck into the spacers to provide mechanical contact therebetween. While keeping this contact, the mounting plate is secured with bolts to the printed circuit board. This forms a capacitor mounting structure. For replacement of the capacitors, by simply loosening the bolts, the entire mounting plate including all the capacitors can be demounted from the board.

Abstract translation: 每个电容器的电极引线焊接到绝缘安装板的焊盘图案。 每个具有由金属线网格组成的柔性结构的间隔件安装在印刷在印刷电路板上的电极图案上，并且从安装板突出的电极引线的尖端部分粘贴到间隔物中以在它们之间提供机械接触。 在保持接触的同时，安装板用螺栓固定到印刷电路板上。 这形成电容器安装结构。 为了更换电容器，通过简单地松开螺栓，可以从板上拆卸包括所有电容器的整个安装板。

公开(公告)号：US08431830B2

公开(公告)日：2013-04-30

申请号：US12884701

申请日：2010-09-17

Applicant: Akira Tamura

Inventor： Akira Tamura

IPC: H05K1/03

CPC classification number: H05K3/32 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/1316 ,  H01L2224/14131 ,  H01L2224/81101 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H05K2201/0314 ,  H05K2201/09681 ,  H05K2201/09854 ,  H05K2201/1028 ,  H05K2201/10348 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/01024 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: An interposer for connecting a semiconductor and a circuit board includes an insulating material sheet, a through hole which is formed in the insulating material sheet and an elastic conductive contact which is formed from an elastic conductive sheet and provided in the through hole.

Abstract translation: 用于连接半导体和电路板的插入件包括绝缘材料片，形成在绝缘材料片中的通孔和由弹性导电片形成并设置在通孔中的弹性导电接触。