公开(公告)号：US20100151680A1

公开(公告)日：2010-06-17

申请号：US12314809

申请日：2008-12-17

申请人： Shulin Wang ,  Gautam Ganguly ,  Marvin Keshner ,  Erik G. Vaaler ,  James Harroun ,  Paul McClelland

发明人： Shulin Wang ,  Gautam Ganguly ,  Marvin Keshner ,  Erik G. Vaaler ,  James Harroun ,  Paul McClelland

IPC分类号： H01L21/3205 ,  H01L21/67

CPC分类号： H01L21/6776 ,  C23C16/4581 ,  C23C16/4585 ,  C23C16/46 ,  C23C16/54 ,  H01L21/67109 ,  H01L21/67173 ,  H01L21/67346 ,  H01L21/67748 ,  H01L21/68721

摘要： A substrate carrier is used in an in-line fabrication such as Plasma Enhanced Chemical Vapor Deposition (PECVD) for application of thin film on substrates. The carrier is in thermal communication with the substrate and thereby provides heat sinking. The carrier further permits movement of the substrate past a deposition apparatus at a deposition station.

摘要翻译： 衬底载体用于诸如等离子体增强化学气相沉积（PECVD）的在线制造，用于在衬底上施加薄膜。 载体与衬底热连通，从而提供散热。 载体还允许衬底在沉积站处移动通过沉积设备。