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公开(公告)号:US6091199A
公开(公告)日:2000-07-18
申请号:US903311
申请日:1997-07-30
IPC分类号: H01L23/367 , H01L23/433 , H01L25/16 , H01J7/24
CPC分类号: H01L23/367 , H01L23/433 , H01L25/165 , H01L2924/0002
摘要: An insulating enclosure for an electronic ballast has at least one major surface and a thermally conductive heat spreader at the major surface. The heat spreader is thermally coupled to at least one of the electronic components within the ballast and has an area greater than the area of the component as measured parallel with the major surface. The electronic components are thermally coupled to the heat spreader by a thermally conductive, deformable means such as caulk or by domes or dimples in the heat spreader that accommodate the variations in height among the electronic components. An electrically insulating layer can be located between the heat spreader and some of the components to prevent the heat spreader from electrically shorting the components.
摘要翻译: 用于电子镇流器的绝缘外壳在主表面具有至少一个主表面和导热散热器。 散热器热连接到镇流器内的至少一个电子部件,并且具有大于与主表面平行测量的部件的面积的面积。 电子部件通过热传导的可变形的装置(例如填缝)或散热器中的圆顶或凹坑热耦合到散热器,以适应电子部件之间的高度变化。 电绝缘层可以位于散热器和部件之间,以防止散热器电气短路部件。
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公开(公告)号:US09401237B1
公开(公告)日:2016-07-26
申请号:US13468237
申请日:2012-05-10
申请人: Donald Folker , Mike LeBlanc , James Neal Van Pelt
发明人: Donald Folker , Mike LeBlanc , James Neal Van Pelt
CPC分类号: H01F5/02 , H01F27/08 , H01F27/085 , H01F27/22 , H01F27/306 , H01F27/325 , H01F41/02
摘要: A bobbin apparatus for a magnetic component includes a core passage having one or more core passage steps located therein. The core passage steps provide one or more gaps between a core disposed in the core passage and the bobbin body. A potting material may be disposed in the gap or gaps in some applications to enhance heat transfer and/or to improve magnetic component performance by reducing effects of fringing flux on inner windings. A method of assembling a magnetic component to include one or more gaps between the core and bobbin core passage is also provided.
摘要翻译: 用于磁性部件的绕线器装置包括具有位于其中的一个或多个芯通路台阶的芯通道。 芯通道步骤在设置在芯通道中的芯和线筒主体之间提供一个或多个间隙。 在一些应用中,灌封材料可以设置在间隙或间隙中,以通过减少内绕组上的边缘通量的影响来增强热传递和/或提高磁组件性能。 还提供了组装磁性部件以在芯部和筒管芯通道之间包括一个或多个间隙的方法。
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