公开(公告)号：US20240349457A1

公开(公告)日：2024-10-17

申请号：US18754759

申请日：2024-06-26

Applicant: Phil Geng ,  David Shia ,  Donald Tiendung Tran ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Ralph V. Miele ,  Sanjoy Kumar Saha ,  Jing-Hua He ,  Steven Adam Klein ,  Ethan Russell Long ,  Andres Ramirez Macias ,  Irving Joseph Castro Guzman

Inventor： Phil Geng ,  David Shia ,  Donald Tiendung Tran ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Ralph V. Miele ,  Sanjoy Kumar Saha ,  Jing-Hua He ,  Steven Adam Klein ,  Ethan Russell Long ,  Andres Ramirez Macias ,  Irving Joseph Castro Guzman

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  H05K7/20709

Abstract: Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.

公开(公告)号：US20240355702A1

公开(公告)日：2024-10-24

申请号：US18756860

申请日：2024-06-27

Applicant: Phil Geng ,  Donald Tiendung Tran ,  Srikant Nekkanty ,  Baris Bicen ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Steven Adam Klein ,  Andres Ramirez Macias

Inventor： Phil Geng ,  Donald Tiendung Tran ,  Srikant Nekkanty ,  Baris Bicen ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Steven Adam Klein ,  Andres Ramirez Macias

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/367 ,  H01L23/49816 ,  H01L23/562

Abstract: Integrated circuit packages with dampeners to reduce vibration effects are disclosed. An example apparatus comprises a substrate, a semiconductor die carried by the substrate, and a dampener carried by the substrate. Further, the example dampener is dimensioned to interface with a heatsink when the heatsink is thermally coupled to the semiconductor die.