公开(公告)号：US20160190716A1

公开(公告)日：2016-06-30

申请号：US14583357

申请日：2014-12-26

申请人： Kuang Liu ,  Gregorio Murtagian ,  David J. Llapitan ,  Jeffory L. Smalley ,  Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Jonathan W. Thibado

发明人： Kuang Liu ,  Gregorio Murtagian ,  David J. Llapitan ,  Jeffory L. Smalley ,  Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Jonathan W. Thibado

IPC分类号： H01R12/70 ,  H01R43/20

CPC分类号： H01R12/89 ,  H01R12/716 ,  H05K7/1007

摘要： Some forms relate to a socket having a housing. A first receiving pin field is formed as part of the housing. The first pin receiving field includes a first plurality of electrical contacts. A second receiving pin field is formed as part of the housing. The second pin field includes a second plurality of electrical contacts. An actuation mechanism is configured to engage the first plurality electrical contacts with a first set of pins on a first electronic package and the second plurality electrical contacts with a second set of pins on a second electronic package.

摘要翻译： 一些形式涉及具有外壳的插座。 第一接收引脚字段形成为外壳的一部分。 第一引脚接收区域包括第一多个电触点。 第二接收引脚字段形成为外壳的一部分。 第二引脚字段包括第二多个电触点。 致动机构构造成使第一多个电触点与第一电子封装上的第一组引脚接合，而第二多个电触点与第二电子封装上的第二组引脚接合。

公开(公告)号：US20140187058A1

公开(公告)日：2014-07-03

申请号：US13728735

申请日：2012-12-27

申请人： Hongfei Yan ,  Jeffory L. Smalley

发明人： Hongfei Yan ,  Jeffory L. Smalley

IPC分类号： H01R13/502 ,  H05K7/20 ,  H01R12/51

CPC分类号： H05K7/20436 ,  H01R12/716 ,  H01R12/73

摘要： A modular multiple piece socket and a computing system are described herein. The modular multiple piece socket includes a plurality of socket pieces, wherein at least one corridor separates the socket pieces. The plurality of socket pieces may be configured to secure a processing unit to a printed circuit board. The at least one corridor may be filled with a thermally conductive material.

摘要翻译： 本文描述了模块化多件式插座和计算系统。 模块化多件式插座包括多个插座件，其中至少一个走廊分离插座件。 多个插座件可以被配置为将处理单元固定到印刷电路板。 至少一个走廊可以用导热材料填充。

公开(公告)号：US20240349457A1

公开(公告)日：2024-10-17

申请号：US18754759

申请日：2024-06-26

申请人： Phil Geng ,  David Shia ,  Donald Tiendung Tran ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Ralph V. Miele ,  Sanjoy Kumar Saha ,  Jing-Hua He ,  Steven Adam Klein ,  Ethan Russell Long ,  Andres Ramirez Macias ,  Irving Joseph Castro Guzman

发明人： Phil Geng ,  David Shia ,  Donald Tiendung Tran ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Ralph V. Miele ,  Sanjoy Kumar Saha ,  Jing-Hua He ,  Steven Adam Klein ,  Ethan Russell Long ,  Andres Ramirez Macias ,  Irving Joseph Castro Guzman

IPC分类号： H05K7/20

CPC分类号： H05K7/2039 ,  H05K7/20709

摘要： Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.

公开(公告)号：US09681556B2

公开(公告)日：2017-06-13

申请号：US13631806

申请日：2012-09-28

申请人： David J. Llapitan ,  Neal E. Ulen ,  Jeffory L. Smalley

发明人： David J. Llapitan ,  Neal E. Ulen ,  Jeffory L. Smalley

IPC分类号： H05K3/30 ,  H05K7/10

CPC分类号： H05K3/301 ,  H05K7/1007 ,  H05K7/1061 ,  H05K2201/10325 ,  H05K2201/2018 ,  H05K2203/167

摘要： In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a first biasing device carried on the base frame is actuated to engage and bias the load frame toward the base frame aligned with the load frame, and to bias the integrated circuit toward the substrate. A latch latches the load and base frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other. Other aspects and features are also described.

公开(公告)号：US20150184053A1

公开(公告)日：2015-07-02

申请号：US14142704

申请日：2013-12-27

申请人： SHANKAR KRISHNAN ,  Susan F. Smith ,  CHRISTIAN AK AMOAH-KUSI ,  Jeffory L. Smalley ,  Barrett M. Faneuf ,  Jeremy Young ,  Tao Liu ,  loan Sauciuc

发明人： SHANKAR KRISHNAN ,  Susan F. Smith ,  CHRISTIAN AK AMOAH-KUSI ,  Jeffory L. Smalley ,  Barrett M. Faneuf ,  Jeremy Young ,  Tao Liu ,  loan Sauciuc

IPC分类号： C09K5/06 ,  B23P15/26 ,  H05K7/20 ,  F28F23/00

CPC分类号： C09K5/06 ,  F28D20/02 ,  F28F2013/006 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2924/0002 ,  Y02E60/145 ,  Y10T29/4935 ,  H01L2924/00

摘要： A gasketted thermal interface material (TIM) is described herein. The gasketted TIM includes a phase change thermal interface material and a curable thermal interface material. The curable thermal interface material surrounds the phase change thermal interface material. The gasketted TIM also includes a gasketted chamber, and the phase change thermal interface material is located within the gasketted chamber.

摘要翻译： 本文描述了垫圈热界面材料（TIM）。 垫圈TIM包括相变热界面材料和可固化的热界面材料。 可固化热界面材料围绕相变热界面材料。 垫圈TIM还包括一个垫圈腔，相变热界面材料位于垫圈腔内。

公开(公告)号：US08279596B2

公开(公告)日：2012-10-02

申请号：US12846286

申请日：2010-07-29

申请人： Alejandro Z. Rodriguez ,  Brian T. Whitman ,  Char Damneun ,  Corey D. Hartman ,  Glen P. Gordon ,  Jeffory L. Smalley

发明人： Alejandro Z. Rodriguez ,  Brian T. Whitman ,  Char Damneun ,  Corey D. Hartman ,  Glen P. Gordon ,  Jeffory L. Smalley

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/20 ,  Y10T29/49817 ,  Y10T29/49826

摘要： A fan mounting system includes a fan chassis defining a plurality of fan housings. A guide member is located on the fan chassis. At least one board support member extends from the fan chassis and is operable to extend through a board to engage an Information Handling System (IHS) chassis when the fan chassis is positioned in the IHS chassis. An IHS chassis cover anchor is located on the fan chassis and is operable to engage an IHS chassis cover and secure the IHS chassis cover to the IHS chassis when the fan chassis is coupled to the IHS chassis.

摘要翻译： 风扇安装系统包括限定多个风扇壳体的风扇底盘。 导向件位于风扇底盘上。 至少一个板支撑构件从风扇框架延伸，并且当风扇机架位于IHS机箱中时，可操作以延伸穿过板以接合信息处理系统（IHS）机箱。 IHS机箱盖锚固件位于风扇机架上，可用于与IHS机箱盖接合，并将风扇机箱连接到IHS机箱时将IHS机箱盖固定到IHS机箱。

公开(公告)号：US20240136766A1

公开(公告)日：2024-04-25

申请号：US18400282

申请日：2023-12-29

申请人： Siva Prasad Jangili Ganga ,  Yogesh Ramakrishna Kuthkanahalli ,  Lianchang Du ,  Chuansheng Liu ,  Ligang Wang ,  Narayanasamy Soundararajan ,  Jeffory L. Smalley

发明人： Siva Prasad Jangili Ganga ,  Yogesh Ramakrishna Kuthkanahalli ,  Lianchang Du ,  Chuansheng Liu ,  Ligang Wang ,  Narayanasamy Soundararajan ,  Jeffory L. Smalley

IPC分类号： H01R13/631 ,  H01R12/75 ,  H01R13/502

CPC分类号： H01R13/631 ,  H01R12/75 ,  H01R13/502

摘要： Connectors for processing packages are disclosed herein. An example male connector includes a plurality of wires. The example male connector further includes a socket pin. The example male connector further includes a paddle board connected to the socket pin. The example male connector further includes an overmolded cable housing the plurality of wires, the overmolded cable coupled to the paddle board, one of the plurality of wires coupled to the socket pin via the paddle board. The example male connector further includes a molded region to encompass the plurality of wires within a flat portion, the overmolded cable housing and the molded region to increase a height of the wires from the paddle board from a first height to a second height.

公开(公告)号：US09325087B2

公开(公告)日：2016-04-26

申请号：US14229157

申请日：2014-03-28

申请人： Gaurav Chawla ,  Joshua D. Heppner ,  Jeffory L Smalley ,  Vijaykumar Krithivasan

发明人： Gaurav Chawla ,  Joshua D. Heppner ,  Jeffory L Smalley ,  Vijaykumar Krithivasan

IPC分类号： H01R4/48 ,  H01R11/24 ,  H01R12/72 ,  H01R12/88

CPC分类号： H01R11/24 ,  H01R12/721 ,  H01R12/88 ,  Y10T29/4913

摘要： A clip-type connector for electrically coupling a substrate with a device or another substrate is disclosed. An electrical connector comprises a top plate and a bottom plate. An array of contacts are on at least one of the top plate and bottom plate. A hinge is located between the top plate and the bottom plate such that the hinge mechanically connects the top plate to the bottom plate. A spring applying a force against the top and bottom plates.

摘要翻译： 公开了用于将衬底与器件或另一衬底电耦合的夹式连接器。 电连接器包括顶板和底板。 触点阵列位于顶板和底板中的至少一个上。 铰链位于顶板和底板之间，使得铰链将顶板机械地连接到底板。 弹簧向顶板和底板施加力。

公开(公告)号：US08405966B2

公开(公告)日：2013-03-26

申请号：US12953035

申请日：2010-11-23

申请人： Corey D. Hartman ,  Brian T. Whitman ,  Glen Patrick Gordon ,  Jeffory L. Smalley ,  Michael Schrempp ,  Pete Ross ,  Russell Smith

发明人： Corey D. Hartman ,  Brian T. Whitman ,  Glen Patrick Gordon ,  Jeffory L. Smalley ,  Michael Schrempp ,  Pete Ross ,  Russell Smith

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00

CPC分类号： G06F1/186 ,  G06F1/187 ,  Y10T29/49826

摘要： A memory carrier system includes a carrier chassis that includes a board having a board connector. The board is operable to couple to a plurality of memory modules. A pair of pinion cams are rotatably mounted to the carrier chassis. A handle is moveably coupled to the carrier chassis and includes a pair of rack arms. Each rack arm engages a respective pinion cam. The carrier chassis is operable to be positioned in an information handling system (IHS) chassis that includes an IHS connector, and the handle is operable to be moved relative to the carrier chassis in order to rotate the pinion cams into an engagement with the IHS chassis that provides a cam force that mates the board connector to the IHS connector.

摘要翻译： 存储器载体系统包括载体底架，其包括具有板连接器的板。 板可操作以耦合到多个存储器模块。 一对小齿轮凸轮可旋转地安装在承载架上。 手柄可移动地联接到承载架，并且包括一对齿条臂。 每个齿条臂与相应的小齿轮凸轮接合。 载体底盘可操作地定位在包括IHS连接器的信息处理系统（IHS）底盘中，并且手柄可操作以相对于承载底盘移动，以便将小齿轮凸轮旋转成与IHS底盘接合 它提供了将板连接器与IHS连接器相配合的凸轮力。

公开(公告)号：US20240355702A1

公开(公告)日：2024-10-24

申请号：US18756860

申请日：2024-06-27

申请人： Phil Geng ,  Donald Tiendung Tran ,  Srikant Nekkanty ,  Baris Bicen ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Steven Adam Klein ,  Andres Ramirez Macias

发明人： Phil Geng ,  Donald Tiendung Tran ,  Srikant Nekkanty ,  Baris Bicen ,  James Trevor Goulding ,  Jeffory L. Smalley ,  Steven Adam Klein ,  Andres Ramirez Macias

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/367 ,  H01L23/49816 ,  H01L23/562

摘要： Integrated circuit packages with dampeners to reduce vibration effects are disclosed. An example apparatus comprises a substrate, a semiconductor die carried by the substrate, and a dampener carried by the substrate. Further, the example dampener is dimensioned to interface with a heatsink when the heatsink is thermally coupled to the semiconductor die.