公开(公告)号：US20130130417A1

公开(公告)日：2013-05-23

申请号：US13302462

申请日：2011-11-22

申请人： Jar-Yu WU ,  Biau-Dar Chen ,  Chun-Lung Tseng ,  Chih-Hung Wang ,  Hung-Yao Lin

发明人： Jar-Yu WU ,  Biau-Dar Chen ,  Chun-Lung Tseng ,  Chih-Hung Wang ,  Hung-Yao Lin

IPC分类号： H01L33/48

CPC分类号： B32B5/26 ,  A41D31/08 ,  A41D31/085 ,  A62B17/00 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2307/3065 ,  B32B2437/00 ,  B32B2571/02 ,  H01L33/0066 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/382 ,  H01L33/405 ,  H01L2933/0016

摘要： A method for manufacturing a light-emitting device includes steps of: providing a substrate comprising an upper surface and a lower surface opposite to the upper surface; processing the upper surface to be an uneven surface; forming a light-emitting structure on the upper surface of the substrate; and forming a hole through the substrate by radiating a coherent laser beam to the lower surface of the substrate for a predetermined time; wherein the band gap energy of the coherent laser beam is higher than the band gap energy of the substrate thereby the substrate is etched away by the laser beam.

摘要翻译： 一种制造发光器件的方法包括以下步骤：提供包括上表面和与所述上表面相对的下表面的基底; 将上表面加工成不平坦的表面; 在基板的上表面上形成发光结构; 以及通过将相干激光束照射到所述基板的下表面预定时间而在所述基板上形成孔; 其中相干激光束的带隙能量高于衬底的带隙能量，从而衬底被激光束蚀刻掉。