公开(公告)号：US06683787B1

公开(公告)日：2004-01-27

申请号：US10076125

申请日：2002-02-14

申请人： Randall G. Banton ,  Don W. Blanchet ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

发明人： Randall G. Banton ,  Don W. Blanchet ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

IPC分类号： H05K720

CPC分类号： H05K7/20727

摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration.

摘要翻译： 改进的电路板组件包括覆盖物或邻近衬底设置的其它构件，并且例如与其间隔开以限定增压室。 自对准散热器（或其他散热元件）弹簧安装（或以其他方式弹性安装）到盖子，从而与一个或多个电路部件热接触。 提供流转元件，例如，使得板的总体阻抗基本上与公共底盘中的一个或多个其它电路板的整体阻抗匹配。 电路板盖可以适用于提供热和/或电磁辐射控制以及冲击和振动。

公开(公告)号：US06661657B1

公开(公告)日：2003-12-09

申请号：US10076133

申请日：2002-02-14

申请人： Randall G. Banton ,  Don W. Blanchet ,  John R. Freeburn, Jr. ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

发明人： Randall G. Banton ,  Don W. Blanchet ,  John R. Freeburn, Jr. ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

IPC分类号： H05K720

CPC分类号： H05K7/20563 ,  G06F1/181 ,  G06F1/183 ,  G06F1/20

摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.

公开(公告)号：US06879486B1

公开(公告)日：2005-04-12

申请号：US10076226

申请日：2002-02-14

申请人： Randall G. Banton ,  Don W. Blanchet ,  John R. Freeburn, Jr. ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

发明人： Randall G. Banton ,  Don W. Blanchet ,  John R. Freeburn, Jr. ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

IPC分类号： H05K7/20

CPC分类号： H05K7/20563

摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g, lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exists. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.

公开(公告)号：US06759588B1

公开(公告)日：2004-07-06

申请号：US10076124

申请日：2002-02-14

申请人： Randall G. Banton ,  Don W. Blanchet ,  John R. Freeburn, Jr. ,  Jason E. Bardo ,  A. Gregory Rocco, Jr. ,  Mike W. Gust ,  Paul N. Zuidema

发明人： Randall G. Banton ,  Don W. Blanchet ,  John R. Freeburn, Jr. ,  Jason E. Bardo ,  A. Gregory Rocco, Jr. ,  Mike W. Gust ,  Paul N. Zuidema

IPC分类号： H05K900

CPC分类号： H05K7/20727

摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process welding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.

公开(公告)号：US06781831B1

公开(公告)日：2004-08-24

申请号：US10076207

申请日：2002-02-14

申请人： Randall G. Banton ,  Don W. Blanchet ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

发明人： Randall G. Banton ,  Don W. Blanchet ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

IPC分类号： H05K720

CPC分类号： H05K7/20727 ,  G06F1/183 ,  G06F1/20

摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.

公开(公告)号：US06697255B1

公开(公告)日：2004-02-24

申请号：US10076032

申请日：2002-02-14

申请人： Randall G. Banton ,  Don W. Blanchet ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

发明人： Randall G. Banton ,  Don W. Blanchet ,  Jason E. Bardo ,  Mike W. Gust ,  Paul N. Zuidema

IPC分类号： H05K720

CPC分类号： H05K7/20727

摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.

公开(公告)号：US06690575B1

公开(公告)日：2004-02-10

申请号：US10076123

申请日：2002-02-14

申请人： Randall G. Banton ,  Don W. Blanchet ,  John R. Freeburn, Jr. ,  Jason E. Bardo ,  A. Gregory Rocco, Jr. ,  Mike W. Gust ,  Paul N. Zuidema

发明人： Randall G. Banton ,  Don W. Blanchet ,  John R. Freeburn, Jr. ,  Jason E. Bardo ,  A. Gregory Rocco, Jr. ,  Mike W. Gust ,  Paul N. Zuidema

IPC分类号： H05K720

CPC分类号： H05K7/20727

摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.