Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover

    公开(公告)号:US06759588B1

    公开(公告)日:2004-07-06

    申请号:US10076124

    申请日:2002-02-14

    IPC分类号: H05K900

    CPC分类号: H05K7/20727

    摘要: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process welding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.

    Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies

    公开(公告)号:US06690575B1

    公开(公告)日:2004-02-10

    申请号:US10076123

    申请日:2002-02-14

    IPC分类号: H05K720

    CPC分类号: H05K7/20727

    摘要: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.

    Data sampling circuit for a burst mode communication system
    3.
    发明授权
    Data sampling circuit for a burst mode communication system 失效
    用于突发模式通信系统的数据采样电路

    公开(公告)号:US5642386A

    公开(公告)日:1997-06-24

    申请号:US268635

    申请日:1994-06-30

    IPC分类号: H04L7/033 H04L7/00

    CPC分类号: H04L7/0337

    摘要: A data sampling circuit and method is provided for a burst mode communication system. The circuit is an entirely digital circuit for reliably sampling an incoming stream of data for automatically adjusting to variations in data stream clock rates and phase variations in the incoming data. The circuit includes a delay line, with a plurality of serially coupled taps, each tap having a variable delay. A first aspect of the invention includes increasing the delay time until the delay line captures at least one full data cell, but preferably two, of the incoming data stream (i.e., signal levels over at least one full clock period, defined by two transitions of the data stream), thereby aligning the receiving circuit with the frequency of the data stream clock. A second aspect of the invention includes outputting data from a tap that is selected to be midway between two regions of transitions of the incoming data stream, thereby aligning the receiving circuit with the phase of the data stream clock. The invention can, in alternative embodiments, track changes in the input data stream's phase/frequency. This involves updating the amount of delay in each tap of the delay line as well as picking the output of the appropriate tap to be used as the sampled data stream, in response to changes in the input signal as well as changes in propagation delays, of the circuits used to implement the delay line, resulting from temperature and voltage variations.

    摘要翻译: 提供了一种用于突发模式通信系统的数据采样电路和方法。 该电路是一个完全数字电路,用于可靠地采样输入数据流,以自动调整数据流时钟频率的变化和输入数据的相位变化。 电路包括具有多个串联耦合的抽头的延迟线,每个抽头具有可变延迟。 本发明的第一方面包括增加延迟时间,直到延迟线捕获输入数据流中的至少一个完整数据单元,但优选地两个,即至少一个完整时钟周期的信号电平, 数据流),从而使接收电路与数据流时钟的频率对准。 本发明的第二方面包括从选择为进入数据流的两个转换区域之间的中间的抽头输出数据,从而使接收电路与数据流时钟的相位对准。 在替代实施例中,本发明可以跟踪输入数据流的相位/频率的变化。 这涉及更新延迟线的每个抽头中的延迟量,以及响应于输入信号的变化以及传播延迟的变化而选择要用作采样数据流的适当抽头的输出 用于实现由温度和电压变化引起的延迟线的电路。

    Network fault recovery by controllable switching of subnetworks
    4.
    发明授权
    Network fault recovery by controllable switching of subnetworks 失效
    网络故障恢复通过子网的可控切换

    公开(公告)号:US5299312A

    公开(公告)日:1994-03-29

    申请号:US613400

    申请日:1990-11-15

    CPC分类号: H04L12/433

    摘要: A subring module for controlling the switching of a subring in and out of the main network of a token passing ring has a data detection circuit for detecting a token on the network. The subring module switches between two switch positions in response to an internal state machine. The first switch position incorporates the subring into the main network, and the second switch position isolates the subring from main network. The subring module has a state machine which responds to the detection of the token on the network to switch the subring out of the network when the network is down, and to switch the subring back into the network when both the subring and the main network are up again. When a number of subrings are present, each subring has its own module and state machine control. When the network goes down, the subrings switch out at different times depending on a hierarchial priority given to the subrings. The switching of the subrings back into the network is also controlled relative to a hierarchical priority. Thus, splitting and recombining of subrings of the the token passing ring can be arranged to proceed in any desired manner. The end result is that a defective subring is automatically isolated.

    摘要翻译: 用于控制进入和离开令牌通过环的主网络的子环的子环模块具有用于检测网络上的令牌的数据检测电路。 子环模块响应于内部状态机在两个开关位置之间切换。 第一个开关位置将子环结合到主网络中,第二个开关位置将子环与主网络隔离。 子环模块具有状态机,响应网络令牌的检测,在网络故障时将子环从网络切换出来,并且子网和主网络都将子环转回网络 再次。 当有多个子环时,每个子环都有自己的模块和状态机控制。 当网络断开时,子环根据子环的分级优先级在不同的时间切换。 子环向网络的切换也相对于分级优先级进行控制。 因此,令牌通过环的子环的拆分和重组可以以任何期望的方式被布置成进行。 最终的结果是自动隔离有缺陷的子环。