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公开(公告)号：US06879486B1
公开(公告)日：2005-04-12
申请号：US10076226
申请日：2002-02-14
申请人： Randall G. Banton , Don W. Blanchet , John R. Freeburn, Jr. , Jason E. Bardo , Mike W. Gust , Paul N. Zuidema
发明人： Randall G. Banton , Don W. Blanchet , John R. Freeburn, Jr. , Jason E. Bardo , Mike W. Gust , Paul N. Zuidema
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g, lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exists. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.
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公开(公告)号：US06759588B1
公开(公告)日：2004-07-06
申请号：US10076124
申请日：2002-02-14
申请人： Randall G. Banton , Don W. Blanchet , John R. Freeburn, Jr. , Jason E. Bardo , A. Gregory Rocco, Jr. , Mike W. Gust , Paul N. Zuidema
发明人： Randall G. Banton , Don W. Blanchet , John R. Freeburn, Jr. , Jason E. Bardo , A. Gregory Rocco, Jr. , Mike W. Gust , Paul N. Zuidema
IPC分类号： H05K900
CPC分类号： H05K7/20727
摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process welding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.
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公开(公告)号：US06661657B1
公开(公告)日：2003-12-09
申请号：US10076133
申请日：2002-02-14
申请人： Randall G. Banton , Don W. Blanchet , John R. Freeburn, Jr. , Jason E. Bardo , Mike W. Gust , Paul N. Zuidema
发明人： Randall G. Banton , Don W. Blanchet , John R. Freeburn, Jr. , Jason E. Bardo , Mike W. Gust , Paul N. Zuidema
IPC分类号： H05K720
CPC分类号： H05K7/20563 , G06F1/181 , G06F1/183 , G06F1/20
摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.
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4.发明授权公开(公告)号：US06690575B1
公开(公告)日：2004-02-10
申请号：US10076123
申请日：2002-02-14
申请人： Randall G. Banton , Don W. Blanchet , John R. Freeburn, Jr. , Jason E. Bardo , A. Gregory Rocco, Jr. , Mike W. Gust , Paul N. Zuidema
发明人： Randall G. Banton , Don W. Blanchet , John R. Freeburn, Jr. , Jason E. Bardo , A. Gregory Rocco, Jr. , Mike W. Gust , Paul N. Zuidema
IPC分类号： H05K720
CPC分类号： H05K7/20727
摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.
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5.发明授权Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks 有权具有集成空气增压室的电路板组件，采用自对准散热片公开(公告)号：US06683787B1
公开(公告)日：2004-01-27
申请号：US10076125
申请日：2002-02-14
IPC分类号： H05K720
CPC分类号： H05K7/20727
摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration.
摘要翻译： 改进的电路板组件包括覆盖物或邻近衬底设置的其它构件，并且例如与其间隔开以限定增压室。 自对准散热器（或其他散热元件）弹簧安装（或以其他方式弹性安装）到盖子，从而与一个或多个电路部件热接触。 提供流转元件，例如，使得板的总体阻抗基本上与公共底盘中的一个或多个其它电路板的整体阻抗匹配。 电路板盖可以适用于提供热和/或电磁辐射控制以及冲击和振动。
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6.发明授权公开(公告)号：US06781831B1
公开(公告)日：2004-08-24
申请号：US10076207
申请日：2002-02-14
IPC分类号： H05K720
CPC分类号： H05K7/20727 , G06F1/183 , G06F1/20
摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.
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公开(公告)号：US06697255B1
公开(公告)日：2004-02-24
申请号：US10076032
申请日：2002-02-14
IPC分类号： H05K720
CPC分类号： H05K7/20727
摘要： An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exits. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.
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8.发明授权Fault-tolerant computer system with online recovery and reintegration of redundant components 失效具有在线恢复和重新集成冗余组件的容错计算机系统
公开(公告)号：US6073251A
公开(公告)日：2000-06-06
申请号：US871077
申请日：1997-06-09
申请人： Douglas E. Jewett , Tom Bereiter , Bryan Vetter , Randall G. Banton , Richard W. Cutts, Jr. , Donald C. Westbrook, deceased , Krayn W. Fey, Jr. , John Posdro , Kenneth C. DeBacker , Nikhil A. Mehta
发明人： Douglas E. Jewett , Tom Bereiter , Bryan Vetter , Randall G. Banton , Richard W. Cutts, Jr. , Donald C. Westbrook, deceased , Krayn W. Fey, Jr. , John Posdro , Kenneth C. DeBacker , Nikhil A. Mehta
IPC分类号： G06F1/12 , G06F1/30 , G06F11/07 , G06F11/10 , G06F11/14 , G06F11/16 , G06F11/18 , G06F11/20 , G06F11/22 , G06F11/273
CPC分类号： G06F1/12 , G06F1/30 , G06F11/0709 , G06F11/0724 , G06F11/073 , G06F11/0793 , G06F11/1441 , G06F11/1658 , G06F11/1666 , G06F11/1683 , G06F11/1687 , G06F11/1691 , G06F11/181 , G06F11/185 , G06F11/20 , G06F11/2007 , G06F11/2015 , G06F11/2005 , G06F11/22 , G06F11/2736
摘要： A computer system in a fault-tolerant configuration employs multiple identical CPUs executing the same instruction stream, with multiple, identical memory modules in the address space of the CPUs storing duplicates of the same data. The system detects faults in the CPUs and memory modules, and places a faulty unit offline while continuing to operate using the good units. The faulty unit can be replaced and reintegrated into the system without shutdown. The multiple CPUs are loosely synchronized, as by detecting events such as memory references and stalling any CPU ahead of others until all execute the function simultaneously; interrupts can be synchronized by ensuring that all CPUs implement the interrupt at the same point in their instruction stream. Memory references via the separate CPU-to-memory busses are voted at the three separate ports of each of the memory modules. I/O functions are implemented using two identical I/O busses, each of which is separately coupled to only one of the memory modules. A number of I/O processors are coupled to both I/O busses. I/O devices are accessed through a pair of identical (redundant) processors, but only one is designated to actively control a given device; in case of failure of one I/O processor, however, an I/O device can be accessed by the other one without system shutdown.
摘要翻译： 容错配置的计算机系统使用执行相同指令流的多个相同的CPU，在存储相同数据的副本的CPU的地址空间中具有多个相同的存储器模块。 系统检测CPU和内存模块中的故障，并使故障单元脱机，并继续使用良好的单元进行操作。 故障单元可以更换并重新集成到系统中，无需关闭。 多个CPU松动地同步，如通过检测诸如内存引用的事件，并阻止其他任何CPU之前的事件，直到所有同时执行该功能; 可以通过确保所有CPU在其指令流中的相同点实现中断来实现中断。 通过单独的CPU到内存总线的内存引用在每个内存模块的三个独立端口上进行投票。 使用两个相同的I / O总线实现I / O功能，每个总线单独耦合到只有一个存储器模块。 许多I / O处理器耦合到两个I / O总线。 I / O设备通过一对相同（冗余）处理器访问，但只有一个被指定为主动控制给定的设备; 然而，在一个I / O处理器发生故障的情况下，I / O设备可以被另一个I / O设备访问，而不需要系统关闭。
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9.发明授权Fault-tolerant computer system having switchable I/O bus interface modules 失效具有可切换I / O总线接口模块的容错计算机系统
公开(公告)号：US5588111A
公开(公告)日：1996-12-24
申请号：US381467
申请日：1995-01-31
IPC分类号： G06F11/16 , G06F11/00 , G06F11/10 , G06F11/14 , G06F11/18 , G06F11/20 , G06F12/02 , G06F15/16 , G06F15/17 , G11C29/00
CPC分类号： G06F9/3863 , G06F11/0724 , G06F11/1641 , G06F11/1658 , G06F11/1666 , G06F11/1683 , G06F11/1687 , G06F11/1691 , G06F11/18 , G06F11/184 , G06F11/185 , G06F11/2017 , G06F9/3824 , G06F9/3851 , G06F9/3885 , G06F11/0757 , G06F11/1008 , G06F11/1405 , G06F11/1415 , G06F11/1679 , G06F11/181 , G06F11/182 , G06F11/20 , G06F11/2015 , G06F2201/85 , G11C29/74
摘要： A computer system in a fault-tolerant configuration employs multiple identical CPUs executing the same instruction stream, with multiple, identical memory modules in the address space of the CPUs storing duplicates of the same data. The multiple CPUs are loosely synchronized, as by detecting events such as memory references and stalling any CPU ahead of others until all execute the function simultaneously; interrupts can be synchronized by ensuring that all CPUs implement the interrupt at the same point in their instruction stream. I/O devices are accessed through a pair of identical (redundant) I/O processors, but only one is designated to actively control a given device; in case of failure of one I/O processor, however, an I/O device can be accessed by the other one without system shutdown, i.e., by merely redesignating the addresses of the registers of the I/O device under instruction control.
摘要翻译： 容错配置的计算机系统使用执行相同指令流的多个相同的CPU，在存储相同数据的副本的CPU的地址空间中具有多个相同的存储器模块。 多个CPU松动地同步，如通过检测诸如内存引用的事件，并阻止其他任何CPU之前的事件，直到所有同时执行该功能; 可以通过确保所有CPU在其指令流中的相同点实现中断来实现中断。 I / O设备通过一对相同（冗余）I / O处理器访问，但只有一个被指定为主动控制给定的设备; 然而，在一个I / O处理器发生故障的情况下，I / O设备可以被另一个I / O设备访问，而不需要系统关闭，即仅在指令控制下重新指定I / O设备的寄存器的地址。
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10.发明授权
公开(公告)号：US5276823A
公开(公告)日：1994-01-04
申请号：US664495
申请日：1991-03-05
IPC分类号： G06F11/16 , G06F11/00 , G06F11/10 , G06F11/14 , G06F11/18 , G06F11/20 , G06F12/02 , G06F15/16 , G06F15/17 , G11C29/00
CPC分类号： G06F9/3863 , G06F11/0724 , G06F11/1641 , G06F11/1658 , G06F11/1666 , G06F11/1683 , G06F11/1687 , G06F11/1691 , G06F11/18 , G06F11/184 , G06F11/185 , G06F11/2017 , G06F9/3824 , G06F9/3851 , G06F9/3885 , G06F11/0757 , G06F11/1008 , G06F11/1405 , G06F11/1415 , G06F11/1679 , G06F11/181 , G06F11/182 , G06F11/20 , G06F11/2015 , G06F2201/85 , G11C29/74
摘要： A computer system in a fault-tolerant configuration employs multiple identical CPUs executing the same instruction stream, with multiple, identical memory modules in the address space of the CPUs storing duplicates of the same data. The multiple CPUs are loosely synchronized, as by detecting events such as memory references and stalling any CPU ahead of others until all execute the function simultaneously; interrupts can be synchronized by ensuring that all CPUs implement the interrupt at the same point in their instruction stream. I/O devices are accessed through a pair of identical (redundant) I/O processors, but only one is designated to actively control a given device; in case of failure of one I/O processor, however, an I/O device can be accessed by the other one without system shutdown, i.e., by merely redesignating the addresses of the registers of the I/O device under instruction control.
摘要翻译： 容错配置的计算机系统使用执行相同指令流的多个相同的CPU，在存储相同数据的副本的CPU的地址空间中具有多个相同的存储器模块。 多个CPU松动地同步，如通过检测诸如内存引用的事件，并阻止其他任何CPU之前的事件，直到所有同时执行该功能; 可以通过确保所有CPU在其指令流中的相同点实现中断来实现中断。 I / O设备通过一对相同（冗余）I / O处理器访问，但只有一个被指定为主动控制给定的设备; 然而，在一个I / O处理器发生故障的情况下，I / O设备可以被另一个I / O设备访问，而不需要系统关闭，即仅在指令控制下重新指定I / O设备的寄存器的地址。
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