公开(公告)号：US20070126126A1

公开(公告)日：2007-06-07

申请号：US11634221

申请日：2006-12-06

申请人： Seung Kim ,  Je Yoo ,  Yong Lee ,  Yoo Wee ,  Seok Huh ,  Chang Ryu

发明人： Seung Kim ,  Je Yoo ,  Yong Lee ,  Yoo Wee ,  Seok Huh ,  Chang Ryu

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L2224/13028 ,  H01L2924/0002 ,  H05K1/111 ,  H05K2201/09663 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

摘要： Disclosed is a solder bonding structure for flip chip connection. Particularly, this invention relates to a solder bonding structure, in which the shape of a connection pad on which solder is applied is changed to thus increase the size of the solder bond that is formed using a reflow process, resulting in highly reliable solder bonding. To this end, the solder bonding structure is composed of a connection pad (a bridge type pattern) composed of at least two pattern regions spaced apart from each other by a predetermined interval, a solder bond formed on the connection pad having such a shape, and a metal bump in contact with the solder bond. In such a solder bonding structure, the solder bond is formed to a sufficient size on a fine pattern having a smaller width, thus achieving reliable solder bonding between the semiconductor chip having the metal bump and the printed circuit board having the connection pad. Further, since the connection pad may be realized through a typical formation process thereof without the need for an additional process, the reliability of the solder bonding may be sufficiently assured without an increase in the working man-hours or in the number of processes.

摘要翻译： 公开了一种用于倒装芯片连接的焊接结合结构。 特别地，本发明涉及焊接接合结构，其中施加焊料的连接焊盘的形状改变，从而增加使用回流工艺形成的焊料接合的尺寸，导致高度可靠的焊接。 为此，焊接接合结构由由至少两个彼此间隔开的图案区域构成的连接焊盘（桥式图案）构成，形成在具有这种形状的连接焊盘上的焊料接合， 以及与焊料接合的金属凸块。 在这种焊接结构中，焊接接合形成为具有较小宽度的精细图案的足够的尺寸，从而在具有金属凸块的半导体芯片和具有连接焊盘的印刷电路板之间实现可靠的焊接。 此外，由于可以通过其典型的形成工艺实现连接焊盘，而不需要额外的工艺，可以充分确保焊接接合的可靠性，而不增加工作工时或工艺数量。