公开(公告)号：US20050137493A1

公开(公告)日：2005-06-23

申请号：US10800763

申请日：2004-03-16

Applicant: Chang Ryu ,  Yoon Song ,  Seung Nam ,  Tae Yim ,  Chang Ryu

Inventor： Chang Ryu ,  Yoon Song ,  Seung Nam ,  Tae Yim ,  Chang Ryu

IPC: A61B5/0476 ,  A61B5/04 ,  G06F3/01

CPC classification number: G06F3/015

Abstract: Provided are an apparatus and a method for recognizing positive/negative intention using a fine change of gamma wave of a brainwave comprising the steps of detecting the brainwave from a head of a user, receiving and amplifying the brainwave detected from the step of detecting the brainwave, converting the amplified analog brainwave to one of a digital type, and recognizing the positive/negative intention of the user by detecting the fine change of the gamma wave of the brainwave in the digital type, which is transmitted from the A/D converting portion, whereby it is possible to implement an application of a real time interface and minimizes inconvenience for the user, and it requires no separate user practice.

Abstract translation: 提供了使用脑波伽马波的精细变化来识别正/负意图的装置和方法，包括以下步骤：从用户的头部检测脑波，接收和放大从检测脑波的步骤检测到的脑波 将放大的模拟脑波转换为数字类型之一，并且通过检测从A / D转换部分发送的数字类型的脑波的伽马波的微小变化来识别用户的正/负意图 ，由此可以实现实时接口的应用并且最小化用户的不便，并且不需要单独的用户练习。

公开(公告)号：US09039269B2

公开(公告)日：2015-05-26

申请号：US13354395

申请日：2012-01-20

Applicant: Byung-Seo Yoon ,  Ju-Young Yoon ,  Han-Moe Cha ,  Sang-Il Park ,  Hee-Kwang Song ,  Jung-Kyun Kim ,  Su-Chang Ryu

Inventor： Byung-Seo Yoon ,  Ju-Young Yoon ,  Han-Moe Cha ,  Sang-Il Park ,  Hee-Kwang Song ,  Jung-Kyun Kim ,  Su-Chang Ryu

IPC: F21V7/04 ,  G02F1/1335 ,  F21V8/00

CPC classification number: G02F1/1336 ,  G02B6/002 ,  G02B6/0023 ,  G02B6/0068 ,  G02B6/0073 ,  G02F1/1335 ,  G02F1/133603 ,  G02F1/133609 ,  G02F1/133611 ,  G02F1/133615

Abstract: A backlight assembly includes a first light source unit including n light emitting members; and a light guide plate including a first side adjacent to the first light source unit, and a first groove adjacent to a first end of the first side.

Abstract translation: 背光组件包括：第一光源单元，包括n个发光元件; 以及导光板，其包括与所述第一光源单元相邻的第一侧，以及与所述第一侧的第一端相邻的第一槽。

公开(公告)号：US08690409B2

公开(公告)日：2014-04-08

申请号：US13399932

申请日：2012-02-17

Applicant: Dong-Lyoul Shin ,  Jae-Chang Choi ,  Tae-Ho Lee ,  Je-Won Woo ,  Su-Chang Ryu

Inventor： Dong-Lyoul Shin ,  Jae-Chang Choi ,  Tae-Ho Lee ,  Je-Won Woo ,  Su-Chang Ryu

IPC: F21V7/04

CPC classification number: G02B6/0018 ,  G02B6/0016 ,  G02B6/0055

Abstract: A backlight assembly includes a light guiding plate and a plurality of first light sources. The light guiding plate includes a light exiting surface through which light can exit, a light guiding surface positioned opposite to the light exiting surface, and a first surface extending between the light guiding surface and the light exiting surface and inclined with respect to the light guiding surface by a first angle. The first angle is an acute angle. The first light sources can generate light, and are disposed under the light guiding plate. These first light sources are disposed adjacent to a first edge connecting the first surface with the light guiding surface.

Abstract translation: 背光组件包括导光板和多个第一光源。 导光板包括光可以离开的光出射表面，与光出射表面相对定位的导光表面，以及在导光表面和光出射表面之间延伸并且相对于光导向倾斜的第一表面 表面以第一角度。 第一个角度是一个锐角。 第一光源可以产生光，并且设置在导光板下。 这些第一光源被设置在与第一表面和导光表面连接的第一边缘附近。

公开(公告)号：US20110159304A1

公开(公告)日：2011-06-30

申请号：US12792342

申请日：2010-06-02

Applicant: Hong Seok Song ,  Young Geun Kim ,  Keun Chang Ryu ,  Young Min Baek ,  Young Hyo Chang

Inventor： Hong Seok Song ,  Young Geun Kim ,  Keun Chang Ryu ,  Young Min Baek ,  Young Hyo Chang

IPC: A61K31/428 ,  C07D275/04 ,  C07C43/257 ,  A61K31/075 ,  C07C69/00 ,  A61K31/185 ,  C07C249/00 ,  A61K31/16 ,  C07C205/00 ,  A61K31/045 ,  B32B15/04

CPC classification number: A01N31/16 ,  A01N35/08 ,  A01N37/02 ,  A01N37/34 ,  A01N43/80 ,  C09D5/14 ,  Y10T428/31678 ,  A01N25/34

Abstract: Disclosed are a composition for inhibiting a proliferation of sulphate reducing bacteria comprising at least one of 1,2-benzisothiazol-3(2H)-one, irgasan, benzyl-2-bromoacetate, 2,2-dibromo-2-cyanoacetamide, and 2-bromo-2-nitropropan-1,3-diol as effective ingredients; a method for inhibiting the proliferation of sulphate reducing bacteria comprising the step of including a sufficient amount for inhibiting the proliferation of sulphate reducing bacteria of at least one of 1,2-benzisothiazol-3(2H)-one, irgasan, benzyl-2-bromoacetate, 2,2-dibromo-2-cyanoacetamide, and 2-bromo-2-nitropropan-1,3-diol in a corrosion sensitive material or degradation sensitive material; a sheet comprising the composition; and a steel plate to which the composition is applied.

Abstract translation: 公开了一种用于抑制硫酸还原细菌增殖的组合物，其包括1,2-苯并异噻唑-3（2H） - 酮，氟利昂，2-溴乙酸苄酯，2,2-二溴-2-氰基乙酰胺和2 溴-2-硝基丙烷-1,3-二醇作为有效成分; 一种抑制硫酸盐还原细菌增殖的方法，其包括以下步骤：足够的量用于抑制1,2-苯并异噻唑-3（2H） - 酮，氟利昂，苄基-2- 溴乙酸酯，2,2-二溴-2-氰基乙酰胺和2-溴-2-硝基丙烷-1,3-二醇在腐蚀敏感材料或降解敏感材料中; 包含所述组合物的片材; 以及应用了组合物的钢板。

公开(公告)号：US20110109000A1

公开(公告)日：2011-05-12

申请号：US12899859

申请日：2010-10-07

Applicant: Sang-Uk Kim ,  Hyo-Chang Ryu ,  Jin-Woo Park ,  Dae-young Choi ,  Mi-yeon Kim

Inventor： Sang-Uk Kim ,  Hyo-Chang Ryu ,  Jin-Woo Park ,  Dae-young Choi ,  Mi-yeon Kim

IPC: H01L23/28

CPC classification number: H01L23/3128 ,  H01L23/16 ,  H01L23/562 ,  H01L24/13 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are a semiconductor package and a method of forming the same. The semiconductor package includes a stress reliever disposed on a part (more specifically, a weak part) of a semiconductor chip. The stress reliever relieves thermal and/or physical stresses caused by a molding layer. As a result, the semiconductor chip does not suffer from the thermal and/or physical stresses.

Abstract translation: 提供半导体封装及其形成方法。 半导体封装包括设置在半导体芯片的一部分（更具体地，弱部分）上的应力消除器。 应力释放器减轻了由模制层引起的热和/或物理应力。 结果，半导体芯片不会受到热和/或物理应力的影响。

公开(公告)号：US20090175590A1

公开(公告)日：2009-07-09

申请号：US12349885

申请日：2009-01-07

Applicant: Hee Chang RYU ,  Seung Yong Shin

Inventor： Hee Chang RYU ,  Seung Yong Shin

IPC: H04N5/00

CPC classification number: H04N7/173 ,  H04N5/76 ,  H04N5/783 ,  H04N21/23406 ,  H04N21/4331 ,  H04N21/44004 ,  H04N21/472 ,  H04N21/6125

Abstract: An IPTV reproducing apparatus and a method for reproducing data are disclosed. A method for reproducing data in an IPTV reproducing apparatus according to the present invention comprises reproducing data associated with a selected program while buffering the data being received through an IP network; and in case of the user's request for multiple speed playback, checking whether a requested multiple speed playback is possible based on a transfer speed of data,

Abstract translation: 公开了一种IPTV再现装置和再现数据的方法。 在根据本发明的IPTV再现装置中再现数据的方法包括在缓冲通过IP网络接收的数据的同时再现与选定节目相关联的数据; 并且在用户要求多速重放的情况下，基于数据的传送速度检查是否可以进行所请求的多速重放，

公开(公告)号：US20060272701A1

公开(公告)日：2006-12-07

申请号：US10537943

申请日：2003-12-09

Applicant: Pulickel Ajayan ,  Amanda Ellis ,  Chang Ryu ,  Seamus Curran

Inventor： Pulickel Ajayan ,  Amanda Ellis ,  Chang Ryu ,  Seamus Curran

IPC: H01L31/00

CPC classification number: H01L51/0049 ,  B82Y10/00 ,  H01L51/0012 ,  H01L51/0071 ,  H01L51/0072 ,  H01L51/4206 ,  H01L51/424 ,  H01L51/4253 ,  H01L51/4266 ,  Y02E10/549

Abstract: An organic photovoltaic conversion device, such as a solar cell includes a matrix material, such as a polymer matrix material, carbon nanotubes dispersed in the matrix material, and photovoltaic organic molecules, such as organic dye molecules, attached to defect sites on the carbon nanotubes.

Abstract translation: 诸如太阳能电池的有机光电转换装置包括基质材料，例如聚合物基体材料，分散在基体材料中的碳纳米管，以及附着到碳纳米管上的缺陷部位的光电有机分子，例如有机染料分子 。

公开(公告)号：US20060207791A1

公开(公告)日：2006-09-21

申请号：US11356524

申请日：2006-02-16

Applicant: Han Kim ,  Chang Ryu ,  Young Lee

Inventor： Han Kim ,  Chang Ryu ,  Young Lee

IPC: H05K1/11 ,  H01K3/10

CPC classification number: H05K1/162 ,  H05K2201/091 ,  H05K2201/09309 ,  H05K2201/09509 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the dielectric layer, and an upper electrode layer formed on the dielectric layer and configured to have at least one first blind via hole that is inwardly formed.

Abstract translation: 本发明涉及电容器嵌入式PCB及其制造方法。 电容器嵌入式PCB包括电介质层，在电介质层下形成的下电极层和形成在电介质层上的上电极层，并且被配置为具有至少一个向内形成的第一盲通孔。

公开(公告)号：US20060196691A1

公开(公告)日：2006-09-07

申请号：US11365219

申请日：2006-02-28

Applicant: Jin Ahn ,  Cheol Hwang ,  Sung Kim ,  Chang Ryu ,  Suk Cho ,  Ho Jeon

Inventor： Jin Ahn ,  Cheol Hwang ,  Sung Kim ,  Chang Ryu ,  Suk Cho ,  Ho Jeon

IPC: H05K1/03 ,  H05K1/16 ,  H05K3/06

CPC classification number: H05K1/162 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09881 ,  Y10S438/957 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

公开(公告)号：US20060157832A1

公开(公告)日：2006-07-20

申请号：US11137345

申请日：2005-05-24

Applicant: Chang Ryu ,  Doo Lee ,  Jin Ahn ,  Myung Kang ,  Suk Cho

Inventor： Chang Ryu ,  Doo Lee ,  Jin Ahn ,  Myung Kang ,  Suk Cho

IPC: H01L23/02

CPC classification number: H01L23/5389 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/82039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/0191

Abstract: A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.