公开(公告)号：US06800187B1

公开(公告)日：2004-10-05

申请号：US09927741

申请日：2001-08-10

Applicant: Jonathan D. Reid ,  Steven T. Mayer ,  R. Marshall Stowell ,  Evan E. Patton ,  Jeff A. Hawkins

Inventor： Jonathan D. Reid ,  Steven T. Mayer ,  R. Marshall Stowell ,  Evan E. Patton ,  Jeff A. Hawkins

IPC: C25D500

CPC classification number: H01L21/2885 ,  C23C18/1619 ,  C23C18/1628 ,  C23C18/163 ,  C23C18/1669 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/008

Abstract: An apparatus for engaging a work piece during plating facilitates electrolyte flow during a plating operation. The apparatus helps to control the plating solution fluid dynamics and electric field shape to keep the wafer's local plating environment uniform and bubble free. The apparatus holding the work piece in a manner that facilitates electrolyte circulation patterns in which the electrolyte flows from the center of the work piece plating surface, outward toward the edge of the edge of the work piece. The apparatus holds the work piece near the work piece edges and provides a flow path for electrolyte to flow outward away from the edges of the work piece plating surface. That flow path has a “snorkel” shape in which the outlet is higher than the inlet. In addition, the flow path may have a slot shape that spans much or all of the circumference of holding apparatus. It may be made from a material that resists deformation and corrosion such as certain ceramics.

Abstract translation: 在电镀期间接合工件的装置有助于在电镀操作期间的电解液流动。 该设备有助于控制电镀溶液流体动力学和电场形状，以保持晶片的局部电镀环境均匀且无气泡。 该装置以便于电解质循环图案的方式保持工件，其中电解质从工件电镀表面的中心向外朝向工件边缘的边缘流动。 该装置将工件保持在工件边缘附近，并且提供了电解液从工件电镀表面的边缘向外流动的流动路径。 该流路具有“浮潜”形状，其中出口高于入口。 此外，流路可以具有跨越保持装置的大部分或全部圆周的槽形状。 它可以由抵抗诸如某些陶瓷的变形和腐蚀的材料制成。