公开(公告)号：US20050236703A1

公开(公告)日：2005-10-27

申请号：US10830910

申请日：2004-04-22

申请人： Tauseef Kazi ,  Jeff Gemar ,  Vaishnav Srinivas ,  Vivek Mohan

发明人： Tauseef Kazi ,  Jeff Gemar ,  Vaishnav Srinivas ,  Vivek Mohan

IPC分类号： G01R31/30 ,  G01R31/3185 ,  H01L23/02

CPC分类号： G01R31/3008 ,  G01R31/318505 ,  G01R31/318533

摘要： A main die and a stacked die are included in the same component package. A transmission gate (370) is implemented on the main die, and can be enabled to receive leakage current in a connection (318) between the main die and the stacked die, and to conduct the leakage current to a bonding pad (344) that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer (364) that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.

摘要翻译： 主模具和堆叠模具包括在相同的组件封装中。 在主管芯上实现传输门（370），并且能够在主管芯和堆叠管芯之间的连接（318）中接收泄漏电流，并将泄漏电流传导到接合焊盘（344） 可以在包装外部访问。 因此，可以在封装模具之后测试主模具和堆叠模具之间的连接性。 传输门在高速测试和正常运行期间被禁用。 封装还可以包括多路复用器（364），其在高速测试期间被启用以在封装级别输入和输出测试信号。 方向信号用于指示测试信号是否被输入到主模具或从主模块输出。

公开(公告)号：US20060214276A1

公开(公告)日：2006-09-28

申请号：US11436452

申请日：2006-05-18

申请人： Tauseef Kazi ,  Jeff Gemar ,  Vaishnav Srinivas ,  Vivek Mohan

发明人： Tauseef Kazi ,  Jeff Gemar ,  Vaishnav Srinivas ,  Vivek Mohan

IPC分类号： H01L23/02

CPC分类号： G01R31/3008 ,  G01R31/318505 ,  G01R31/318533

摘要： A main die and a stacked die are included in the same component package. A transmission gate (370) is implemented on the main die, and can be enabled to receive leakage current in a connection (318) between the main die and the stacked die, and to conduct the leakage current to a bonding pad (344) that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer (364) that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.

摘要翻译： 主模具和堆叠模具包括在相同的组件封装中。 在主管芯上实现传输门（370），并且能够在主管芯和堆叠管芯之间的连接（318）中接收泄漏电流，并将泄漏电流传导到接合焊盘（344） 可以在包装外部访问。 因此，可以在封装模具之后测试主模具和堆叠模具之间的连接性。 传输门在高速测试和正常运行期间被禁用。 封装还可以包括多路复用器（364），其在高速测试期间被启用以在封装级别输入和输出测试信号。 方向信号用于指示测试信号是否被输入到主模具或从主模块输出。

公开(公告)号：US07772831B2

公开(公告)日：2010-08-10

申请号：US11436452

申请日：2006-05-18

申请人： Tauseef Kazi ,  Jeff Gemar ,  Vaishnav Srinivas ,  Vivek Mohan

发明人： Tauseef Kazi ,  Jeff Gemar ,  Vaishnav Srinivas ,  Vivek Mohan

IPC分类号： H01L23/02 ,  G01R31/26

CPC分类号： G01R31/3008 ,  G01R31/318505 ,  G01R31/318533

摘要： A main die and a stacked die are included in the same component package. A transmission gate (370) is implemented on the main die, and can be enabled to receive leakage current in a connection (318) between the main die and the stacked die, and to conduct the leakage current to a bonding pad (344) that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer (364) that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.

摘要翻译： 主模具和堆叠模具包括在相同的组件封装中。 在主管芯上实现传输门（370），并且能够在主管芯和堆叠管芯之间的连接（318）中接收泄漏电流，并将泄漏电流传导到接合焊盘（344） 可以在包装外部访问。 因此，可以在封装模具之后测试主模具和堆叠模具之间的连接性。 传输门在高速测试和正常运行期间被禁用。 封装还可以包括多路复用器（364），其在高速测试期间被启用以在封装级别输入和输出测试信号。 方向信号用于指示测试信号是否被输入到主模具或从主模块输出。

公开(公告)号：US07075175B2

公开(公告)日：2006-07-11

申请号：US10830910

申请日：2004-04-22

申请人： Tauseef Kazi ,  Jeff Gemar ,  Vaishnav Srinivas ,  Vivek Mohan

发明人： Tauseef Kazi ,  Jeff Gemar ,  Vaishnav Srinivas ,  Vivek Mohan

IPC分类号： H01L23/02

CPC分类号： G01R31/3008 ,  G01R31/318505 ,  G01R31/318533

摘要： A main die and a stacked die are included in the same component package. A transmission gate (370) is implemented on the main die, and can be enabled to receive leakage current in a connection (318) between the main die and the stacked die, and to conduct the leakage current to a bonding pad (344) that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer (364) that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.