摘要:
A main die and a stacked die are included in the same component package. A transmission gate (370) is implemented on the main die, and can be enabled to receive leakage current in a connection (318) between the main die and the stacked die, and to conduct the leakage current to a bonding pad (344) that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer (364) that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.
摘要:
A main die and a stacked die are included in the same component package. A transmission gate (370) is implemented on the main die, and can be enabled to receive leakage current in a connection (318) between the main die and the stacked die, and to conduct the leakage current to a bonding pad (344) that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer (364) that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.
摘要:
A main die and a stacked die are included in the same component package. A transmission gate (370) is implemented on the main die, and can be enabled to receive leakage current in a connection (318) between the main die and the stacked die, and to conduct the leakage current to a bonding pad (344) that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer (364) that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.
摘要:
A main die and a stacked die are included in the same component package. A transmission gate (370) is implemented on the main die, and can be enabled to receive leakage current in a connection (318) between the main die and the stacked die, and to conduct the leakage current to a bonding pad (344) that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer (364) that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.
摘要:
A signal driver for an interface circuit has a first stage level shifter to accept input signals and output signals at a first signal level. The signal driver also has a second stage level shifter coupled to the first stage level shifter to output signals at a second signal level. Electronic components of the first and second stage level shifter have reliability limits less than the second signal level. The first and second stage configurations of the first stage level shifter and the second stage level shifter prevents exposing the electronic components to terminal to terminal signal levels higher than the reliability limits when processing signals for output at the second signal level.
摘要:
A break-before-make predriver for disabling a PFET of an output driver before enabling an NFET, and vice versa. The predriver includes an input inverter, two cross-coupled inverters, and output buffers. The predriver provides enhanced break-before-make action through sizing the NFETs larger than the PFETs in the predriver's cross-coupled inverters. The input inverter, the cross-coupled inverters and the first and second output buffers are sized with respect to each other such that substantially equal break before make action is provided on both rising and falling edges. The predriver also includes level-shifting capabilities through a different voltage supply at the PFETs of the cross-coupled inverter. The predriver also includes two data output nodes for connection to the two inputs of an output driver. The predriver provides for tristate action by disabling the signal from the predriver output nodes.
摘要:
A level detector has an input circuit adapted to accept signals of multiple signal levels for detecting a specific level. The signal levels include a first signal level and a larger second signal level. Electronic components of the input circuit have reliability levels less than the second signal level. A latch circuit is coupled to the input circuit for latching a signal consistent with a detected level of an accepted signal.
摘要:
Methods and apparatuses are presented for voltage tolerant floating N-well circuits. An apparatus for mitigating leakage currents caused by input voltages is presented which includes a first transistor having a source coupled to a positive voltage supply, and a drain coupled to a floating node. The apparatus may further include a controllable pull-down path coupled to a negative voltage supply and the first transistor, wherein the controllable pull-down path is configured to turn on the first transistor and pull-up the floating node during a first state. The apparatus may further include a second transistor having a source coupled to a gate of the first transistor, and drain coupled to the floating node, wherein the second transistor is configured to place the floating node at a floating potential during a second state.
摘要:
A level detector has an input circuit adapted to accept signals of multiple signal levels for detecting a specific level. The signal levels include a first signal level and a larger second signal level. Electronic components of the input circuit have reliability levels less than the second signal level. A latch circuit is coupled to the input circuit for latching a signal consistent with a detected level of an accepted signal.
摘要:
A digital output driver includes a pre-driver and a driver that may be implemented with thin-oxide FETs. The pre-driver generates first and second digital signals based on a digital input signal. The first digital signal has a first voltage range determined by a first (e.g., pad) supply voltage and an intermediate voltage. The second digital signal has a second voltage range determined by a second (e.g., core) supply voltage and circuit ground. The driver receives the first and second digital signals and provides a digital output signal having a third voltage range determined by the first supply voltage and circuit ground. The pre-driver may include a latch and a latch driver. The latch stores the current logic value for the digital input signal. The latch driver writes the logic value to the latch. The latch driver is enabled for a short time duration to write the logic value and is turned off afterward.